Vapor cooling device for dissipating heat of semiconductor elements

Claim 1

A vapor cooling device for cooling heat generator means, comprising, in combination, a coolant reservoir having a condensible coolant in the form of a liquid phase therein, at least one heat generation element disposed below said coolant reservoir, at least two heat dissipation blocks abutting against opposite sides of said heat generation element, each of said heat dissipation blocks including a hollow space therein, a fastening mechanism connecting said at least two heat dissipation blocks together into a unitary structure, a plurality of connection tubes, one for each heat dissipation block and connecting said hollow space in each of said heat dissipation blocks to said coolant reservoir, said condensible coolant in its liquid phase filling said connection tubes and said hollow spaces in said heat dissipation blocks, and condenser means disposed in fluid communication relationship with said reservoir above said coolant whereby when said heat generation element generates heat sufficient to boil these portions of said liquid coolant disposed in said hollow spaces in the adjacent heat dissipation blocks into its vapor phase, said coolant in the form of its vapor phase enter said condenser means through said connection tubes and said coolant reservoir and is condensed into its liquid phase, said condensed coolant being returned to said coolant reservoir.