Stackable heat sink assembly

Claim 2

A heat sink assembly for a plurality of circuit components of the type enabled by the application of mechanical pressure thereto comprising: a number of heat conducting mounting plates, there being a pair of mounting plates for each circuit component, respectively, each mounting plate having a pair of opposed, flat faces, each pair of mounting plates being disposed with respective faces in thermal contact with respective sides of the corresponding circuit component; a heat sink member for at least one of each pair of mounting plates, said heat sink member having a plurality of open-end air passages therethrough and a working surface in thermal contact with the adjacent face of the corresponding mounting plate, the working surface and the adjacent face having an area greater than the area of the adjacent side of the corresponding component to minimize the thermal impedance between the surface and the face; cage means defining a holder for confining a stack of said circuit components, said mounting plates and said heat sink members, the mounting plates and heat sink members being stackable one-by-one in the holder; and means coupled with the holder for applying a predetermined meChanical pressure simultaneously to the stack of parts held thereby.

Claim 3

A heat sink assembly as set forth in claim 1, wherein said holder includes a pair of spaced base plates and a number of spaced tension rods interconnecting said base plates, the rods being at the outer periphery of and confining a space for receiving said stack of parts, said pressure applying means being carried by one of said base plates.

Claim 4

A heat sink assembly as set forth in claim 1, wherein is included an insulating plate between a mounting plate of one circuit component and a mounting plate of an adjacent circuit component to electrically isolate said circuit components.

Claim 5

A heat sink assembly comprising: a plurality of stacked circuit components capable of being rendered operable by the application of mechanical pressure thereto; a pair of spaced base plates; a plurality of tension rods interconnecting the base plates and defining the outer periphery of a confined space for receiving a stack of parts; a number of heat conductive mounting plates, each mounting plate having opposed, flat, first and second faces, there being a pair of mounting plates for each circuit component, respectively, with the first faces of each pair of mounting plates being disposed for thermal contact with respective sides of the corresponding circuit component, each first face having an area greater than that of the side in thermal contact therewith; a heat sink member for each circuit component, respectively, each heat sink member having a pair of opposed, flat surfaces, one of the surfaces being in thermal contact with and of substantially the same area as the second face of the adjacent mounting plate, each heat sink member being comprised of an extrusion having a plurality of open-end air passages therethrough, said mounting plates and said heat sink members being stackable one-by-one in said space to form with said circuit components a stack of parts; and means on one of the base plates for applying a predetermined mechanical pressure simultaneously to the stack of parts in said space.

Claim 6

A heat sink assembly comprising: a plurality of stacked circuit components capable of being rendered operable by the application of mechanical pressure thereto; a pair of spaced base plates; a plurality of tension rods interconnecting the base plates and defining the outer periphery of a confined space for receiving a stack of parts; a number of heat conductive mounting plates, each mounting plate having opposed, flat, first and second faces, there being a pair of mounting plates for each circuit component, respectively, with the first faces of each pair of mounting plates being disposed for thermal contact with respective sides of the corresponding circuit component, each first face having an area greater than that of the side in thermal contact therewith; a heat sink member for each circuit component, respectively, each heat sink member having a pair of opposed, flat surfaces, one of the surfaces being in thermal contact with and of substantially the same area as the second face of the adjacent mounting plate, each heat sink member being comprised of an extrusion having a plurality of open-end air passages therethrough, said mounting plates and said heat sink members being stackable one-by-one in said space to form with said circuit components a stack of parts; and means on one of the base plates for applying a predetermined mechanical pressure simultaneously to the stack of parts in said space.

Claim 7

A heat sink assembly as set forth in claim 4, wherein said pressure-applying means includes a housing having a compression spring therein, a pressure plate engageable with said stack of parts, and means coupled with the housing for compressing the spring through a predetermined distance.

Claim 8

A heat sink assembly as set forth in claim 4, wherein each circuit component has a locating pad at each end thereof, respectively, one of the mounting plates having a recess therein defining a spot face for positioning a locating pad of the adjacent circuit component.

Claim 9

A heat sink assembly as set forth in claim 4, wherein is provided an electrically insulating plate between one mounting plate of one circuit component and a mounting plate of the adjacent circuit component.

Claim 10

A heat sink assembly as set forth in claim 7, wherein is included a connector for an electrical conductor having a tab at one end thereof, said conductor including a bar having a transversely V-shaped notch therein, a metallic pin receivable within the notch and engageable with said tab, and fastener means coupled with the bar for rigidly securing the same to one side of the mounting plate to force the pin against the tab of the conductor to thereby urge the tab into fused relationship to the side of the mounting plate.