Solder substrate clip

Claim 2

A terminal adapted to be soldered to a metal pad comprising a contact arm stamp-formed from thin sheet metal stock having a contact surface adapted to engage the pad, a solder-mounting surface on the other side of the arm from the contact surface and at least one sheared edge extending between said surfaces, a mass of solder metallurgically bonded to the solder-mounting surface and extending to one side of the mounting surface beyond the sheared edge, and a rounded solder globule projecting from the solder mass at the edge across the thickness of the contact substantially to or beyond the contact surface whereby, on positioning of the contact against the pad and melting of the solder mass, molten solder flows from the mass to the pad.

Claim 3

A terminal as in claim 1, said terminal having a pair of spaced contact arms with contact surfaces thereon facing each other, one of said arms carrying said mass of solder, and a mounting portion extending away from the arms.

Claim 4

A terminal as in claim 2 wherein the other contact arm includes a contact surface, a solder mounting surface and at least one sheared edge extending between its respective surfaces, a second mass of solder metallurgically bonded to the solder mounting surface of the other arm and extending to one side of such surface past the sheared edge of the other arm, and a second rounded solder globule projecting from the second solder mass at the edge of the other arm across the thickness of the arm substantially to or beyond the contact surface thereof whereby, on positioning a substrate or like member between the arms of the terminal so that the contact pads on the substrate engage the contact surfaces on the arms and melting of the solder, solder bridges extending from their respective solder masses to the pads facilitate the flow of molten solder to the pads.

Claim 5

A terminal as in claim 1 wherein the contact includes a second sheared edge extending between said surfaces, the mass of solder extends to the side of the mounting surface beyond the second sheared edge and a second rounded solder globule projects from the mass of solder at the second edge across the thickness of the contact substantially to or beyond the contact surface to provide a pair of solder bridges to facilitate the flow of molten solder to the pad.

Claim 6

A terminal as in claim 4, said terminal having a pair of like contact arms, said solder mass being secured to one of said arms, the other arm including a contact surface facing generally toward the first contact arm, a solder mounting surface facing generally away from the first contact arm and a sheared edge extending between such surfaces, a second mass of solder metallurgically bonded to the solder mounting surface of the other arm and a rounded solder globule projecting from such solder mass at such edge across the thickness of the arm substantially to or beyond the contact surface thereof.

Claim 7

A terminal as in claim 5, said terminal having a third contact arm located adjacent said other contact arm, said third arm including a contact surface and a solder mounting surface, said second mass of solder being metallurgically bonded to the solder mounting surfaces of both said other contact arm and said third contact arm, said third contact arm including a sheared edge extending between its solder mounting and contact surfaces, and a second rounded solder globule projecting from the second solder mass at the edge of the third contact arm across the thickness thereof substantially to or beyond the contact surface.

Claim 8

A terminal as in claim 6 wherein the edges of the other and third contact arms are adjacent to each other and are located across the clip from the edges of said one arm.

Claim 9

A terminal adapted to be soldered to a metal pad comprising a contact arm formed from metal stock having a contact surface on one side thereof, a solder mounting surface on the other side thereof and an edge extending between said surfaces, a mass of solder on the mounting surface extending to one side beyond the edge, wherein the improvement comprises a rounded solder globule projecting from the solder mass at the edge a distance across the thickness toward the contact surface whereby, upon positioning the contact surface on a pad and melting the solder mass and globule, the globule forms a solder bridge between the mass and the pad.

Claim 10

A terminal adapted to be soldered to a metal pad comprising a contact arm formed from metal stock having a contact surface on one side thereof, a solder mounting surface on the other side thereof and an edge extending between said surfaces, a mass of solder on the mounting surface extending to one side beyond the edge, wherein the improvement comprises a rounded solder globule projecting from the solder mass at the edge a distance across the thickness toward the contact surface whereby, upon positioning the contact surface on a pad and melting the solder mass and globule, the globule forms a solder bridge between the mass and the pad.

Claim 11

A terminal as in claim 8, including a metallurgical bond between the mass of solder and the solder mounting surface.

Claim 12

A terminal as in claim 8 wherein the arm includes a second edge, the solder mass extends beyond the second edge and including a second rounded solder globule projecting from the solder mass at the second edge a distance across the second edge toward the contact surface.

Claim 13

A terminal as in claim 8 wherein the contact surface is on a crest on the arm, the solder mounting surface is at the bottom of a valley on the arm opposite the crest and the globule extends from the valley to the crest.

Claim 14

A terminal as in claim 11, including a metallurgical bond securing the solder mass to the arm, said bond extending along the valley.

Claim 15

A terminal as in claim 1 wherein the contact includes a valley and a crest on opposite sides thereof, the edge extending across the valley and the crest, the contact surface lying on the crest and the solder mounting surface lying in the valley, and the globule extending between the valley and the crest.

Claim 16

A terminal as in claim 13 wherein the solder mass is generally cylindrical in shape and extends along the valley.