Semiconductor element having a polymeric protective coating and glass coating overlay

Claim 1

A semiconductor element comprising a body of semiconductor material having at least two regions of opposite type conductivity and a P-N junction disposed between, and formed by the abutting surfaces of, each pair of regions of opposite type conductivity; an end portion of at least one P-N junction exposed at a surface of the body; a layer of a protective coating material disposed on the exposed end portion of the at least one P-N junction, the protective coating material is a copolymer which is, when cured, one selected from the group consisting of the reaction product of a silicon-free organic diamine, an organic tetracarboxylic dianhydride and a polysiloxane diamine and a blend of polyimide compound of recurring structural units of the formula: ##STR9##with a polyimide composed of recurring structural units of the formula: ##STR10##wherein the molar proportion of the latter is from 5 to 50 mol percent, and a suitable solvent wherein R is a divalent hydrocarbon radical, R' is a monovalent hydrocarbon radical, R" is a tetravalent organic radical, Q is a divalent silicon-free organic radical which is the residue of an organic diamine, x is a whole number equal to at least 1, m is greater than 1, and n is greater than 1, and at least one layer of a chemical vapor deposited glass material disposed on the layer of protective coating material.