Patent US1484049A successfully refreshed from Google Patents.
Patent US4012693A successfully refreshed from Google Patents.
US4012693A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Printed circuit board testing
Assignee: Individual
•
Filing: 1975-07-16
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Granted: 1977-03-15
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Expires: 1995-07-16
Abstract
Abstract A tester locates wiring defects such as short circuits between printed wires on a printed circuit board wiring pattern by registration with a mirror image pattern. To identify a particular defect location on the pattern, a test jig is prepared by placing a pattern of insulating material on a flexible conductive screen to be held a short distance away from the corresponding conductive pattern of the identical shape on the printed circuit board. By scanning the pattern with a roller forcing the two patterns into contact with each other, current is passed from the screen through the wiring board at any scan position where the conductive printed circuit board pattern exceeds its boundary limits or short circuits adjacent conductors. Provision is made to read automatically X and Y coordinate positions of a defect location into a register.
Inventors
- 👤 Donald F. Sullivan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 16:34
CPC Classifications
G; G01; G01R; G01R31/00; G01R31/28; G01R31/2801; G01R31/2805; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
92 words
The method of locating wiring defects on printed circuit wiring board patterns having conductive wires affixed to an insulating board, comprising the steps of, providing a mirror image test jig of the wiring pattern with insulating materials located in locations corresponding to conductive locations on said board and conductive materials placed in positions corresponding to the insulating locations on said board, registering in physical contact the test jig pattern with the corresponding wiring board pattern, and sensing conductivity between the test jig and wiring board while in contact to identify wiring defects.
Claim 2
Independent Claim
92 words
The method of locating wiring defects on printed circuit wiring board patterns having conductive wires affixed to an insulating board, comprising the steps of, providing a mirror image test jig of the wiring pattern with insulating materials located in locations corresponding to conductive locations on said board and conductive materials placed in positions corresponding to the insulating locations on said board, registering in physical contact the test jig pattern with the corresponding wiring board pattern, and sensing conductivity between the test jig and wiring board while in contact to identify wiring defects.
Claim 3
Dependent Claim
34 words
The method defined in claim 1, wherein the registering step physically contacts said board at a predetermined limited region and includes the additional step of scanning the contact position over the entire board surface.
Claim 4
Dependent Claim
26 words
The method defined in claim 2, wherein the scanning step is provided by urging said test jig and wiring board in contact with a cylindrical roller.
Claim 5
Dependent Claim
20 words
The method defined in claim 2 including the step of identifying the scanning location when a wiring defect is sensed.
Claim 6
Dependent Claim
33 words
The method defined in claim 3, wherein the scanning step is taken along two intersecting coordinates and the scanning location of each coordinate is registered in response to sensing of a wiring defect.
Claim 7
Dependent Claim
27 words
The method defined in claim 1 including the step of printing wiring pattern on the printed circuit wiring board with the insulator pattern of the test jig.
Claim 8
Dependent Claim
106 words
Test equipment for locating wiring defects on a printed circuit wiring board having a conductive wire pattern affixed to an insulating board, comprising in combination, a test jig with a mirror image of the wiring pattern on said board defined by insulating materials located in place of the conductive patterns and with conducting patterns located in place of the insulating portions, means placing in registration said test jig and said wiring board, means contacting in registration at least a portion of the test jig with a corresponding portion of the wiring board, and means sensing conductivity between the test jig and wiring board while in contact.
Claim 9
Dependent Claim
106 words
Test equipment for locating wiring defects on a printed circuit wiring board having a conductive wire pattern affixed to an insulating board, comprising in combination, a test jig with a mirror image of the wiring pattern on said board defined by insulating materials located in place of the conductive patterns and with conducting patterns located in place of the insulating portions, means placing in registration said test jig and said wiring board, means contacting in registration at least a portion of the test jig with a corresponding portion of the wiring board, and means sensing conductivity between the test jig and wiring board while in contact.
Claim 10
Dependent Claim
29 words
Test equipment as defined in claim 7, wherein said conductive pattern on said test jig comprises a wire mesh, and said insulating materials are affixed to said wire mesh.
Claim 11
Dependent Claim
33 words
Test equipment as defined in claim 8, wherein the insulating materials are affixed on the surface of said wire mesh and different wiring patterns are placed on opposite surfaces of the wire mesh.
Claim 12
Dependent Claim
50 words
Test equipment as defined in claim 7, wherein said means contacting said jig and board scans a sequence of contact locations on said board along at least one coordinate, and including means identifying the coordinate position of a defect when conductivity is sensed between the test jig and wiring board.
Claim 13
Dependent Claim
40 words
Test equipment as defined in claim 7, wherein the printed wiring board has punched hole therethrough, and said means sensing conductivity comprises a flexible surface having a conductor path in contact with the wiring pattern extending through said punched holes.
Claim 14
Dependent Claim
34 words
Test equipment as defined in claim 11, wherein said flexible conductive surface comprises a substantially flat wire mesh screen having a laminated rubber backing, and plated through eyelets are located in said punched holes.
Claim 15
Dependent Claim
45 words
Test equipment as defined in claim 7, wherein said means sensing conductivity consists of an electrical alarm circuit coupled to said conductive screen and a sheet conductor making electrical contact through said board with said wiring pattern on the board registering with said test jig.
Claim 16
Dependent Claim
51 words
Test equipment as defined in claim 7, wherein said means placing the test jig and wiring board in registration comprises a framework holding the test jig and wiring board slightly separated and a cylindrical roller which urges the test jig and wiring board into physical contact substantially along a straight line.
Claim 17
Dependent Claim
39 words
Test equipment as defined in claim 7, wherein said conductive pattern on said test jig comprises a thin conductor sheet having thicker conductive surface pattern fingers thereon corresponding to the voids between the conductor wire pattern on said board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1980-03-14 | 1980-09-13 | 1981-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1984-03-14 | 1984-09-13 | 1985-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1988-03-14 | 1988-09-13 | 1989-03-15 | $7700.00 | Window Closed / Lapsed |