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US3989179A Expired / Lapsed US ⏱️ 0.0 years remaining

Methods of dip soldering

Assignee: Valeo Engine Cooling Inc
•
Filing: 1975-09-09
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Granted: 1976-11-02
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Expires: 1995-09-09
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Abstract

Abstract A method is provided for eliminating "icicles" or ligaments and other manifestations of dripping solder from articles which are dip soldered by vibrating the articles simultaneously with removing them from the solder bath and continuing to vibrate the articles until the solder thereon has at least levelled.

Inventors

  • 👤 John N. Antonevich

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-29 22:20
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/0008; B23K1/0012; B23K3/00; B23K3/06; B23K3/0646; B23K3/0669; B23K3/0684

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 76 words
A method of eliminating "icicles" and drippings of solder from generally horizontally extending surfaces including U-shaped portions of heat exchangers and the like, which surfaces have been dipped in a molten bath of solder and removed from said solder bath comprising the steps of accelerating and decelerating the parts simultaneously with removing them from the solder bath and continuing to accelerate and decelerate the parts until all solder thereon has levelled itself over the dipped surfaces.
Claim 2
Independent Claim 76 words
A method of eliminating "icicles" and drippings of solder from generally horizontally extending surfaces including U-shaped portions of heat exchangers and the like, which surfaces have been dipped in a molten bath of solder and removed from said solder bath comprising the steps of accelerating and decelerating the parts simultaneously with removing them from the solder bath and continuing to accelerate and decelerate the parts until all solder thereon has levelled itself over the dipped surfaces.
Claim 3
Dependent Claim 35 words
A method as claimed in claim 1 wherein the parts are vibrated in the solder bath and continuously thereafter during removal from the bath to accelerate and decelerate them until all solder thereon has solidified.
Claim 4
Dependent Claim 14 words
A method as claimed in claim 1 wherein the vibrations are at ultrasonic frequencies.
Claim 5
Dependent Claim 20 words
A method as claimed in claim 1 wherein successive impacts are applied to the parts to accelerate and decelerate them.
Claim 6
Dependent Claim 24 words
A method as claimed in claim 1 wherein at least one impact is applied to the parts to accelerate them and level solder thereon.
Claim 7
Independent Claim 77 words
A method of eliminating "icicles" and drippings of solder from generally horizontally extending surfaces including U-shaped portions of heat exchangers and the like, which surfaces have been dipped in a molten bath of solder and removed from said solder bath comprising the steps of accelerating and decelerating said parts immediately after withdrawal from the solder bath and until the solder has levelled itself over the dipped surfaces and the solidus temperature of the solder has been reached.
Claim 8
Independent Claim 77 words
A method of eliminating "icicles" and drippings of solder from generally horizontally extending surfaces including U-shaped portions of heat exchangers and the like, which surfaces have been dipped in a molten bath of solder and removed from said solder bath comprising the steps of accelerating and decelerating said parts immediately after withdrawal from the solder bath and until the solder has levelled itself over the dipped surfaces and the solidus temperature of the solder has been reached.

References Cited (Backward Citations)

US2485444A Cited
US3834015A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1979-11-02 1980-05-03 1980-11-02 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1983-11-02 1984-05-03 1984-11-02 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1987-11-02 1988-05-03 1988-11-02 $7700.00 Window Closed / Lapsed

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