Patent US3988757A successfully refreshed from Google Patents.
US3988757A
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Deep diode zeners
Assignee: General Electric Co
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Filing: 1975-04-17
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Granted: 1976-10-26
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Expires: 1995-04-17
Abstract
Abstract A deep diode zener has a lamellar structured body of single crystal semiconductor material. The lamellar structure is produced by a thermal gradient zone melting process embodying the thermomigration of metal "wires" through the body to form a region of conductivity opposite to that of the body. The material of the region is recrystallized semiconductor material of the body with solid solubility of the metal of the "wire" to impart the desired type conductivity and resistivity to the region.
Inventors
- 👤 Harvey E. Cline
- 👤 Thomas R. Anthony
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:20
CPC Classifications
H; H10; H10D; H10D8/00; H10D8/20; H10D8/25; H10D62/00; H10D62/40; H10D84/00; H10D84/201; H10D84/204; H10D84/221; H10P; H10P95/00; H10P95/50; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/541; H10W72/5453; H10W72/551; H10W72/552; H10W72/5524; Y; Y10; Y10S; Y10S438/00; Y10S438/983
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
477 words
A deep zener semiconductor diode comprising: a body of single crystal semiconductor material having a first type conductivity, a predetermined level of resistivity, two major opposed surfaces which are, respectively, the top and bottom surfaces thereof, and a vertical axis which is substantially parallel with a first crystal axis of the material of the body; at least one of the major surfaces having a preferred planar crystal orientation which is one selected from the group consisting of (111), (110) and (100); a lamellar structure of a plurality of integral alternate first and second regions of different and opposite type conductivity formed in situ in the body; each region extending between, and terminating in, the opposed major surfaces and having opposed end surfaces, each end surface being coextensive with only one respective major surface; a P-N junction formed by the contiguous surfaces of the material of each pair of abutting regions of opposite type conductivity, the P-N junction being substantially parallel with the first crystal axis and having end portions exposed at the opposed major surfaces; the material of each first region being a portion of the material of the body. the material of each second region consisting of recrystallized semiconductor material of the body formed in situ by the migration of a melt of metal-rich semiconductor material of the body through the entire body from one opposed major surface of the other by thermal gradient zone melting at a predetermined elevated temperature along a thermal gradient substantially parallel with the first preferred crystal axis and the vertical axis of the body and having a predetermined level of concentration of the metal of the melt distributed substantially uniformly throughout the entire region, the level of concentration of the metal being determined by the solid solubility limit of that metal in that semiconductor material at that predetermined elevated temperature of migration, the metal comprising at least one dopant impurity material for inparting the type conductivity and a predetermined level of resistivity to the recrystallized material of the region; a pair of mutually adjacent regions of opposite type conductivity comprising a zener diode; a first electrical contact affixed to, and in an electrically conductive relationship with, the first region of the zener diode; a second electrical contact affixed to, and in an electrically conductive relationship with, the second region of the zener diode, and the predetermined level of resistivity of each of the first and second regions of the zener diode are so arranged that when the P-N junction therebetween is reversed bias to a critical voltage, the P-N junction breaks down by the tunneling of carriers across the depletion zone and results in a high current flow, the occurrence of the breakdown being dependent upon the level of resistivity of the regions of opposite type conductivity and the depletion zone widths which occurs during functioning of the zener diode.
Claim 2
Dependent Claim
477 words
A deep zener semiconductor diode comprising: a body of single crystal semiconductor material having a first type conductivity, a predetermined level of resistivity, two major opposed surfaces which are, respectively, the top and bottom surfaces thereof, and a vertical axis which is substantially parallel with a first crystal axis of the material of the body; at least one of the major surfaces having a preferred planar crystal orientation which is one selected from the group consisting of (111), (110) and (100); a lamellar structure of a plurality of integral alternate first and second regions of different and opposite type conductivity formed in situ in the body; each region extending between, and terminating in, the opposed major surfaces and having opposed end surfaces, each end surface being coextensive with only one respective major surface; a P-N junction formed by the contiguous surfaces of the material of each pair of abutting regions of opposite type conductivity, the P-N junction being substantially parallel with the first crystal axis and having end portions exposed at the opposed major surfaces; the material of each first region being a portion of the material of the body. the material of each second region consisting of recrystallized semiconductor material of the body formed in situ by the migration of a melt of metal-rich semiconductor material of the body through the entire body from one opposed major surface of the other by thermal gradient zone melting at a predetermined elevated temperature along a thermal gradient substantially parallel with the first preferred crystal axis and the vertical axis of the body and having a predetermined level of concentration of the metal of the melt distributed substantially uniformly throughout the entire region, the level of concentration of the metal being determined by the solid solubility limit of that metal in that semiconductor material at that predetermined elevated temperature of migration, the metal comprising at least one dopant impurity material for inparting the type conductivity and a predetermined level of resistivity to the recrystallized material of the region; a pair of mutually adjacent regions of opposite type conductivity comprising a zener diode; a first electrical contact affixed to, and in an electrically conductive relationship with, the first region of the zener diode; a second electrical contact affixed to, and in an electrically conductive relationship with, the second region of the zener diode, and the predetermined level of resistivity of each of the first and second regions of the zener diode are so arranged that when the P-N junction therebetween is reversed bias to a critical voltage, the P-N junction breaks down by the tunneling of carriers across the depletion zone and results in a high current flow, the occurrence of the breakdown being dependent upon the level of resistivity of the regions of opposite type conductivity and the depletion zone widths which occurs during functioning of the zener diode.
Claim 3
Dependent Claim
59 words
The deep diode zener of claim 1 wherein the first and second regions of opposite type conductivity are planar regions, each planar regions having a longitudinal axis which is aligned substantially parallel with a preferred second crystal axis of the material of the body, and each of the second regions has a substantially constant uniform resistivity throughout the region.
Claim 4
Dependent Claim
26 words
The deep diode zener of claim 1 wherein the semiconductor material is one selected from the group consisting of silicon, silicon carbide, gallium arsenide and germanium.
Claim 5
Dependent Claim
32 words
The deep diode zener of claim 2 wherein the semiconductor material is one selected from the group consisting of silicon, silicon carbide, gallium arsenide and germanium, and the dopant impurity is aluminum.
Claim 6
Dependent Claim
19 words
The deep diode zener of claim 2 wherein the semiconductor material is silicon, and the dopant impurity is aluminum.
Claim 7
Dependent Claim
65 words
The deep diode zener of claim 1 wherein the lamellar structure comprises four regions of alternate and opposite type conductivity, the first and third regions being of the first type conductivity, and the second and fourth regions being of the second type conductivity, and the first electrical contact is affixed to the first region, and the second electrical contact is afixed to the fourth region.
Claim 8
Dependent Claim
38 words
The deep diode zener of claim 6 including a third electrical contact affixed to selective surface areas of the second and third regions and a portion of the P-N junction exposed therebetween to electrically shunt the P-N junction.
Claim 9
Dependent Claim
66 words
The deep diode zener of claim 1 wherein the lamellar structure comprises five alternate regions of different and opposite type conductivity, the first, third and fifth regions being of the first type conductivity, and the second and fourth regions being of the second type conductivity, the first electrical contact is affixed to the first region, and the second electrical contact is affixed to the fifth region.
Claim 10
Dependent Claim
20 words
The semiconductor device of claim 1 wherein the material of the body is silicon, silicon carbide, germanium and gallium arsenide.
Claim 11
Dependent Claim
48 words
The semiconductor device of claim 1 wherein the opposed major surfaces have a preferred planar crystal orientation of (100), the first crystal axis is < 100 >, and the preferred second crystal axis is one selected from the group consisting of < 011 > and < 011 >.
Claim 12
Dependent Claim
20 words
The semiconductor device of claim 10 wherein the material of the body is silicon, silicon carbide, germanium and gallium arsenide.
Claim 13
Dependent Claim
37 words
The semiconductor device of claim 1 wherein the opposed major surfaces have a preferred planar crystal orientation of (110), the first crystal axis is < 110 >, and the preferred second crystal axis is < 110 >.
Claim 14
Dependent Claim
20 words
The semiconductor devices of claim 12 wherein the material of the body is silicon, silicon carbide, germanium and gallium arsenide.
Claim 15
Dependent Claim
60 words
The semiconductor device of claim 1 wherein the opposed major surfaces have a preferred planar crystal orientation of (111), the first crystal axis is < 111 >, and the preferred second crystal axis is one selected from the group consisting of < 112 >, < 211 >, < 121 >, < 011 >, < 101 > and < 110 >.
Claim 16
Dependent Claim
20 words
The semiconductor device of claim 14 wherein the material of the body is silicon, silicon carbide, germanium and gallium arsenide.
Claim 17
Dependent Claim
32 words
The deep zener semiconductor diode of claim 1 wherein the solid solubility of the at least one dopant impurity material provides the substantially constant level of impurity concentration in the second regions.
Claim 18
Dependent Claim
120 words
The deep diode zener of claim 1 wherein the lamellar structure comprises six abutting regions, the second, fourth and fifth regions each having first type conductivity, the first, third and sixth regions each having second type conductivity, the first electrical contact is affixed to the first region, the second electrical contact is affixed to the sixth region, and a third electrical contact is affixed to, and in an electrical conductive relationship with, selective surface areas of the second and third regions and that end portion of the P-N junction therebetween and exposed at the surface, thereby forming a series electrical circuit of two diodes electrically connected to each other and a zener diode electrically connected to one of the diodes.
Claim 19
Dependent Claim
376 words
A deep zener semiconductor diode comprising a body of single crystal semiconductor material having two major opposed surfaces which are respectively, the top and bottom surfaces thereof, a predetermined level of resistivity, a vertical axis which is substantially parallel with a first crystal axis of the material of the body and a first type conductivity; at least one of the major surfaces having a preferred planar crystal orientation which is one selected from the group consisting of (111), (110) and (100); at least one columnar region of second type conductivity and a predetermined level of resistivity disposed within the body, extending between, and terminating in, the opposed major surfaces; each columnar region consisting of recrystallized semiconductor material of the body formed in situ in the body by the migration of a melt of metal-rich semiconductor material of the body through the entire body from one opposed major surface to the other by thermal gradient zone melting at a predetermined elevated temperature along a thermal gradient substantially parallel with the preferred first crystal axis and the vertical axis of the body and having a predetermined level of concentration of the metal of the melt distributed substantially uniformly throughout the entire region, the level of concentration of the metal being determined by the solid solubility limit of that metal in the semiconductor material at that predetermined elevated temperature of migration, the metal comprising at least one dopant impurity material for imparting the predetermined level of resistivity and type conductivity thereto; A p-n junction formed by the contiguous surfaces of the abutting material of opposite type conductivity of the region and the body; a first electrical contact affixed to the body, and a plurality of second electrical contacts, each contact being affixed to a surface of only one of the columnar regions, whereby the regions of opposite type conductivity are so arranged that when the P-N junction between two mutually adjacent regions of opposite type conductivity is reversed biased a depletion zone is formed which increases in width with increasing positive voltage and suddenly breaks down and results in a high current flow, the occurence of the breakdown being dependent upon the level of resistivity of each of the regions of opposite type conductivity and the depletion zone widths.
Claim 20
Dependent Claim
376 words
A deep zener semiconductor diode comprising a body of single crystal semiconductor material having two major opposed surfaces which are respectively, the top and bottom surfaces thereof, a predetermined level of resistivity, a vertical axis which is substantially parallel with a first crystal axis of the material of the body and a first type conductivity; at least one of the major surfaces having a preferred planar crystal orientation which is one selected from the group consisting of (111), (110) and (100); at least one columnar region of second type conductivity and a predetermined level of resistivity disposed within the body, extending between, and terminating in, the opposed major surfaces; each columnar region consisting of recrystallized semiconductor material of the body formed in situ in the body by the migration of a melt of metal-rich semiconductor material of the body through the entire body from one opposed major surface to the other by thermal gradient zone melting at a predetermined elevated temperature along a thermal gradient substantially parallel with the preferred first crystal axis and the vertical axis of the body and having a predetermined level of concentration of the metal of the melt distributed substantially uniformly throughout the entire region, the level of concentration of the metal being determined by the solid solubility limit of that metal in the semiconductor material at that predetermined elevated temperature of migration, the metal comprising at least one dopant impurity material for imparting the predetermined level of resistivity and type conductivity thereto; A p-n junction formed by the contiguous surfaces of the abutting material of opposite type conductivity of the region and the body; a first electrical contact affixed to the body, and a plurality of second electrical contacts, each contact being affixed to a surface of only one of the columnar regions, whereby the regions of opposite type conductivity are so arranged that when the P-N junction between two mutually adjacent regions of opposite type conductivity is reversed biased a depletion zone is formed which increases in width with increasing positive voltage and suddenly breaks down and results in a high current flow, the occurence of the breakdown being dependent upon the level of resistivity of each of the regions of opposite type conductivity and the depletion zone widths.
Claim 21
Dependent Claim
22 words
The deep diode zener of claim 18 wherein each of the second regions has a substantially constant uniform resistivity throughout the region.
Claim 22
Dependent Claim
41 words
The deep diode zener of claim 19 wherein the body is of N-type conductivity and has a resistivity of less than approximately 0.02 ohm-centimeter, and the columnar region is of P-type conductivity and has a resistivity of less than 0.07 ohm-centimeter.
Claim 23
Dependent Claim
26 words
The deep diode zener of claim 18 wherein the semiconductor material is one selected from the group consisting of silicon, silicon carbide, gallium arsenide and germanium.
Claim 24
Dependent Claim
32 words
The deep diode zener of claim 19 wherein the semiconductor material is one selected from the group consisting of silicon, silicon carbide, gallium arsenide and germanium, and the dopant impurity is aluminum.
Claim 25
Dependent Claim
19 words
The deep diode zener of claim 20 wherein the semiconductor material is silicon, and the dopant impurity is alumunium.
Claim 26
Dependent Claim
76 words
The deep diode zener of claim 18 wherein the deep diode zener comprises a plurality of first and second concentric abutting regions of alternate and opposite type conductivity, one of the first regions being concentric with one of the columnar regions; each of the first and second regions extending between, and terminating in, the opposed major surfaces of the body and each first region having a selective resistivity and the same type conductivity as the body.
Claim 27
Dependent Claim
19 words
The deep diode zener of claim 24 wherein each of the second regions has a substantially constant uniform resistivity.
References Cited (Backward Citations)
US2813048A
Cited
US3544397A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-10-26 | 1980-04-26 | 1980-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-10-26 | 1984-04-26 | 1984-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-10-26 | 1988-04-26 | 1988-10-26 | $7700.00 | Window Closed / Lapsed |