Patent US3981076A successfully refreshed from Google Patents.
US3981076A
Expired / Lapsed
US
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Method of connecting electronic microcomponents
Assignee: Commissariat à l'Énergie Atomique et Aux Énergies Alternatives
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Filing: 1974-11-27
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Granted: 1976-09-21
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Expires: 1994-11-27
Abstract
Abstract A method of connecting electronic microcomponents comprising the steps of realizing a support with conducting wire connecting pads secured on said support, the position of which is adapted to the arrangement of the connections for the microcomponents, making a connecting circuit by sticking an insulated wire onto said support and connecting said conducting wire connecting pads, positioning the microcomponent panels so that each microcomponent connection is in electrical contact with one of said wire connecting pads, welding the connections to their respective wire connecting pads. A substrate for connecting microcomponents comprising a support on which conducting wire connecting pads are deposited and joined by a connecting circuit made of insulated wire. A hybrid circuit comprising a number of electronic microcomponents connected by said substrate.
Inventors
- 👤 Gerard Nicolas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 22:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/10; H05K3/103; H05K7/00; H05K7/02; H05K7/06; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K2201/10424; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07502; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07554; H10W72/50; H10W72/521; H10W72/522; H10W72/531; H10W72/536; H10W72/5366; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/555; H10W72/581; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49133; Y10T29/49137; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
119 words
A method of connecting electronic microcomponents comprising the steps of: securing wire connecting pads on a support, the position of which is adapted to the arrangement of the connections for the microcomponents; unwinding a continuous wire over said pads to form a circuit; dividing said circuit into a plurality of partial circuits; superposing said partial circuits to obtain the complete connecting circuit; stripping the insulated wire at each pad; securing the stripped wire portions to the corresponding pads; cutting off those parts of the wire which do not form part of the final connecting circuit; positioning the microcomponents so that each microcomponent is in electrical contact with one of said pads; and securing the microcomponents to their respective pads.
Claim 2
Independent Claim
119 words
A method of connecting electronic microcomponents comprising the steps of: securing wire connecting pads on a support, the position of which is adapted to the arrangement of the connections for the microcomponents; unwinding a continuous wire over said pads to form a circuit; dividing said circuit into a plurality of partial circuits; superposing said partial circuits to obtain the complete connecting circuit; stripping the insulated wire at each pad; securing the stripped wire portions to the corresponding pads; cutting off those parts of the wire which do not form part of the final connecting circuit; positioning the microcomponents so that each microcomponent is in electrical contact with one of said pads; and securing the microcomponents to their respective pads.
Claim 3
Dependent Claim
32 words
A method according to claim 1, wherein the connecting circuit is electrically tested by making a non-cut-off test on each of the partial connecting circuits when they are still in one piece.
Claim 4
Independent Claim
157 words
A method of connecting electronic microcomponents comprising the steps of: making insulating frames having dimensions such that each frame can receive one panel of microcomponents to be connected and forming grooves in the frame peripheries; disposing the frames on a support, said grooves being parallel to said supprt; placing a continuous wire into said grooves to form a circuit; dividing said circuit into a plurality of partial circuits; superposing the partial circuits relative to each other to obtain a complete connecting circuit; stripping the wire at the places where wire connecting pads are to be positioned; manufacturing the pads by forming an electrolytic deposit, during which the continuous wires forming each partial circuit are raised to appropriate potentials; cutting off those parts of the wire not forming part of the final connecting circuit; positioning the microcomponents so that each microcomponent is in electrical contact with one of said pads; and securing the microcomponents to their respective pads.
Claim 5
Independent Claim
157 words
A method of connecting electronic microcomponents comprising the steps of: making insulating frames having dimensions such that each frame can receive one panel of microcomponents to be connected and forming grooves in the frame peripheries; disposing the frames on a support, said grooves being parallel to said supprt; placing a continuous wire into said grooves to form a circuit; dividing said circuit into a plurality of partial circuits; superposing the partial circuits relative to each other to obtain a complete connecting circuit; stripping the wire at the places where wire connecting pads are to be positioned; manufacturing the pads by forming an electrolytic deposit, during which the continuous wires forming each partial circuit are raised to appropriate potentials; cutting off those parts of the wire not forming part of the final connecting circuit; positioning the microcomponents so that each microcomponent is in electrical contact with one of said pads; and securing the microcomponents to their respective pads.
Claim 6
Dependent Claim
50 words
A method according to claim 3, comprising the steps of: forming said pads in grooves in the frames; subsequently cutting out the central parts of the frames flush with the inner side walls of the frames; positioning said microcomponent panels by depositing them by the top in their respective frames.
Claim 7
Dependent Claim
16 words
A method according to claim 4 wherein the central parts are cut out by mechanical punching.
Claim 8
Dependent Claim
32 words
A method according to claim 3, wherein the connecting circuit is electrically tested by making a non-cut-off test on each of the partial connecting circuits when they are still in one piece.
Claim 9
Dependent Claim
72 words
A method according to claim 3, comprising the steps of: forming the pads inside the frames; subsequently cutting out the central parts of the frame leaving the pads at the inner edge of the side walls of the frames; cutting out also the part of the support inside the frame; positioning the microcomponent by inserting them by the bottom into their respective frames; securing the panel bottoms to a second rigid support.
Claim 10
Dependent Claim
16 words
A method according to claim 7, wherein the central parts are cut out by mechanical punching.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-09-21 | 1980-03-22 | 1980-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-09-21 | 1984-03-22 | 1984-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-09-21 | 1988-03-22 | 1988-09-21 | $7700.00 | Window Closed / Lapsed |