Epoxy resin photoresist with iodoform and bismuth triphenyl

Claim 1

As an article of manufacture, a composite sheet, comprising: A support; and in surface contact therewith, an organic-solvent-soluble layer responsive to electromagnetic or electron-beam radiation containing, in admixture, (a) a monomeric or prepolymeric epoxide or mixture thereof, said epoxide being polymerizable to higher molecular weights through the action of a cationic catalyst; and, (b) as a latent curing agent for polymerizing and insolubilizing said epoxide, a radiation-sensitive catalyst precursor which decomposes upon exposure to electromagnetic or electron-beam radiation to provide an active catalyst effective to initiate polymerization of said epoxide, said precursor being an organohalogen compound wherein the organo radicals are alkyl, aryl, alkaryl, aralkyl, alkoxy and aroxy in combination with an oranometallic compound having the formula R 3 M wherein M is P, As, Sb or Bi and R is a hydrocarbyl radical or hydrogen with the proviso that at least one R is a hydrocarbyl radical; said latent curing agent having had substantially no exposure to electromagnetic or electron-beam radiation.