Patent US3971428A successfully refreshed from Google Patents.
US3971428A
Expired / Lapsed
US
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Method for making beam leads
Assignee: United States Department of the Navy
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Filing: 1975-10-17
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Granted: 1976-07-27
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Expires: 1995-10-17
Abstract
Abstract A method for making beam leads for use in the interconnecting of electronic packages to a substrate. Metal foil, such as copper, is etched to form a plurality of beam leads and then a second metal having poor adhesion with said metal foil is deposited onto the metal foil. The second metal is then separated from the metal foil and the metal foil is reuseable as a depository for another deposition of the second metal which is the desired beam leads.
Inventors
- 👤 Ronald D. Hall
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-23 17:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/04; H10W70/042; B; B22; B22D; B22D25/00; B22D25/02; B22D25/04; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
111 words
A process for making beam leads for use in the interconnecting of electronic packages to substrates comprising the steps of, coating metallic foil with a resist pattern, then etching said metallic foil with said resist pattern thereon to form a metallic foil pattern having a plurality of beam leads, then depositing a second metal different than said metal of said metallic foil which said second metal has poor adhesion with said metallic foil, and then separating said deposited second metal from said metallic foil to provide a plurality of second metal beam leads and whereby said metallic foil pattern is reuseable as a depository for another deposition of said second metal.
Claim 2
Dependent Claim
111 words
A process for making beam leads for use in the interconnecting of electronic packages to substrates comprising the steps of, coating metallic foil with a resist pattern, then etching said metallic foil with said resist pattern thereon to form a metallic foil pattern having a plurality of beam leads, then depositing a second metal different than said metal of said metallic foil which said second metal has poor adhesion with said metallic foil, and then separating said deposited second metal from said metallic foil to provide a plurality of second metal beam leads and whereby said metallic foil pattern is reuseable as a depository for another deposition of said second metal.
Claim 3
Dependent Claim
34 words
A process for making beam leads for use in the interconnecting of substrates to electronic packages as set forth in claim 1 wherein said metallic foil is copper and said second metal is aluminum.
Claim 4
Dependent Claim
35 words
A process for making beam leads for use in the interconnecting of substrates to electronic packages as set forth in claim 2 wherein said aluminum is deposited at ambient room temperature onto said copper foil.
Claim 5
Dependent Claim
69 words
A process for making beam leads for use in interconnecting of substrates to electronic packages as set forth in claim 2 wherein said copper foil is etched from only one side to form a plurality of undercut beam leads each having a top side more narrow in width than a bottom side and wherein said aluminum is deposited onto the bottom sides of said plurality of undercut beam leads.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-07-27 | 1980-01-26 | 1980-07-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-07-27 | 1984-01-26 | 1984-07-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-07-27 | 1988-01-26 | 1988-07-27 | $7700.00 | Window Closed / Lapsed |