Semiconductor arrangement

Claim 2

In a semiconductor circuit arrangement including a metal contacting strip which is provided with a plurality of notches and/or recesses which divide said strip into a pattern of spaced connecting parts, including the external leads for the circuit arrangement, for receiving the semiconductor components or their connecting wires, a plurality of semiconductor components mounted on selected ones of said connecting parts, a plurality of connecting wires interconnecting the contact points of said semiconductor components with the contact points of selected ones of said connecting parts to form a desired circuit arrangement, and a housing which encloses said semiconductor wafers, said connecting wires and the portions of said contact strip other than said external leads; the improvement comprising means for providing a bridging connection between two contact points which are spaced relatively far apart whereby relatively short lengths of connecting wire may be utilized, said means including an insulating platelet mounted on and having one surface thereof connected to one of said connecting parts which is situated between said two contact points, a metal coating on the surface of said platelet opposite said one surface, and a pair of connecting wires, each electrically connected between said metal coating and a respective one of said two contact points.

Claim 3

A semiconductor circuit arrangement as defined in claim 1, wherein said platelets comprise ceramic platelets and said metal coating is gold.

Claim 4

A semiconductor circuit arrangement as defined in claim 1 wherein said metal contacting strip has a rectangular shape and wherein said connecting parts include a plurality of spaced tongues extending in two rows along two opposite sides of said contacting strip and forming the external leads for said arrangement, and a plurality of spaced strips running perpendicularly to said tongues and parallel to each other between the rows of tongues for receiving said semiconductor components and said insulating platelets.

Claim 5

A semiconductor circuit arrangement as defined in claim 3 wherein said semiconductor components are a plurality of diodes and said circuit arrangement is a diode matrix.

Claim 6

In a semiconductor arrangement including a planar metal contacting strip which is divided into a pattern of spaced conductors, including the external leads for the circuit arrangement, for receiving semiconductor components or their connecting wires, a plurality of semiconductor components mounted on selected ones of said conductors, a plurality of wires interconnecting selected ones of the contact points of said semiconductor components with selected ones of the contact points of said conductors to form a desired circuit arrangement, and a housing enclosing said semiconductor components, said connecting wires and the portions of said contacting strip other than said external leads; the improvement wherein: an insulating platelet is mounted on and has one surface connected to one of said conductors which is situated between two contact points which are to be connected by a wire and which are spaced far apart and separated from each other by a plurality of said conductors which are not to be connected to said two contact points; a metal coating is provided on the surface of said platelet opposite said one surface; and the wire connecting said two contact points includes a pair of connecting wires which are each electrically connected between said metal coating and a respective one of said two contact points and bridged over any of said plurality of conductors situated between said platelet and the associated one of said two contact points, whereby only relatively short lengths of wire are required.

Claim 7

In a semiconductor arrangement including a planar metal contacting strip which is divided into a pattern of spaced conductors, including the external leads for the circuit arrangement, for receiving semiconductor components or their connecting wires, a plurality of semiconductor components mounted on selected ones of said conductors, a plurality of wires interconnecting selected ones of the contact points of said semiconductor components with selected ones of the contact points of said conductors to form a desired circuit arrangement, and a housing enclosing said semiconductor components, said connecting wires and the portions of said contacting strip other than said external leads; the improvement wherein: an insulating platelet is mounted on and has one surface connected to one of said conductors which is situated between two contact points which are to be connected by a wire and which are spaced far apart and separated from each other by a plurality of said conductors which are not to be connected to said two contact points; a metal coating is provided on the surface of said platelet opposite said one surface; and the wire connecting said two contact points includes a pair of connecting wires which are each electrically connected between said metal coating and a respective one of said two contact points and bridged over any of said plurality of conductors situated between said platelet and the associated one of said two contact points, whereby only relatively short lengths of wire are required.

Claim 8

A circuit arrangement as defined in claim 5 wherein said contacting strip has a rectangular shape and said conductors include: a first plurality of spaced leads extending in two rows along two opposite sides of said contacting strip and forming the external leads for said arrangement; and a second plurality of spaced parallel strip-like leads extending perpendicular to said first plurality of leads and between said two rows.

Claim 9

A circuit arrangement as defined in claim 6 wherein said semiconductor components are diodes each having one terminal electrically connected to the one of said conductors on which it is mounted; and said circuit arrangement is a diode matrix.