Methods of producing gallium phosphide yellow light emitting diodes

Claim 3

A method as claimed in claim 1 wherein the growth of the nitrogen doped gallium phosphide layer from a hydride vapour phase is effected in a furnace having first, second and third zones and includes the steps of placing a source of gallium in the first zone of the furnace; positioning the substrate on a holder in the third zone of the furnace; flushing the furnace with palladiam diffused H 2 ; heating the three zones of the furnace to their respective operating temperatures; etching the substrate surface; passing HC 1 over the heated gallium to produce a required quantity of gallium chloride vapour which passes from the first zone to the second zone of the furnace; admitting appropriate quantities of the gases PH 3 , NH 3 and H 2 S into the second zone and causing these gases to be mixed with the gallium chloride vapour to produce a mixture which passes to the third zone of the furnace to provide a vapour phase therein; and epitaxially growing the nitrogen doped gallium phosphide layer on the substrate surface from the vapour phase.

Claim 4

A method as claimed in claim 2 wherein the etching of the substrate surface is effected with 30 ccs/min HCl for a period of 2 minutes.

Claim 5

A method as claimed in claim 2 wherein the first and second zones are respectively maintained at temperatures of 750° and 950°C, wherein the third zone is maintained at a temperature in the range 840° to 880°C, wherein the HCl is admitted to the first zone at a flow rate of 30 ccs/min, wherein the NH 3 and 5% by volume PH 3 in H 2 are admitted to the second zone respectively at flow rates 15 ccs/min and 10 ccs/min, wherein the H 2 S is synthesised prior to admittance to the second zone by passing H 2 over sulphur at a flow rate of 25 ccs/min and wherein the thickness of the epitaxial layer which is achieved after 60 minutes growth is in the range 60 to 80μm.

Claim 6

A method as claimed in claim 4 wherein the provision of the H 2 S gas includes the steps of passing H 2 over sulphur in one zone of a two zone furnace, the said one zone being maintained at a temperature of the order of 60°C; and reacting the H 2 and sulphur vapour in the other zone which is maintained at a temperature of the order of 800°C.

Claim 7

A method as claimed in claim 2 wherein the first and second zones are respectively maintained at temperatures of 750° and 950°C, wherein the third zone is maintained at a temperature in the range 840° to 880°C, wherein the HCl is admitted to the first zone at a flow rate of 240 ccs/min, wherein NH 3 and 5% by volume PH 3 in H 2 are both admitted to the second zone at a flow rate of 400 ccs/min, wherein 50 ppm H 2 S in H 2 is admitted to the second zone at a flow rate of 25 ccs/min and wherein the thickness of the epitaxial layer which is achieved after 60 minutes growth is in the range 20 to 30μ m.

Claim 8

A method as claimed in claim 1 wherein the nitrogen doped gallium phosphide layer is of n-type conductivity and wherein the said at least one p-n junction is formed in the n-type layer by diffusing the surface of the layer with a material selected from the group which comprises zinc, cadmium, magnesium and beryllium.

Claim 9

A method as claimed in claim 7 wherein the n-type layer includes a number of p-n junctions and wherein each of the p-n junctions are formed by zinc diffusion using a SiO 2 /Si 3 N 4 /SiO 2 layered mask.

Claim 10

A method as claimed in claim 1 wherein the formation of a p-n junction with the said layer includes the steps of epitaxially growing another single crystal layer on the surface of the said layer and simultaneously doping the said another layer during growth with a dopant of the opposite conductivity type to the said layers.

Claim 11

A method as claimed in claim 9 wherein the said another layer is grown from a hydride vapour phase and is nitrogen doped.

Claim 12

A method as claimed in claim 1 wherein the nitrogen doped gallium phosphide layer includes a number of p-n junctions and wherein the method includes the step of cutting the structure into dice of the required dimensions to provide individual diodes.

Claim 13

A method as claimed in claim 11 which includes the steps of mounting and bonding each of the individual diodes onto a suitable header; and encapsulating the diode in a light transparent material.