Method of preparing a pattern on a silicon wafer

Claim 1

In a method of preparing a pattern on a silicon oxide-coated silicon wafer which comprises applying a photoresist film to said oxide layer, exposing said photoresist to a light pattern, developing said exposed photoresist to remove exposed portions thereof, thereby uncovering portions of the oxide layer, etching said wafter to remove the uncovered oxide layer and removing the remaining photoresist, the improvement which comprises employing as the photoresist a film of a copolymer of SO 2 and keto-olefin of the formula: ##EQU2## wherein R 1 is alkyl, aryl or substituted aryl; R 2 is hydrogen or methyl; x is an integer of 1 or 2; R 3 is hydrogen or is part of a carbocyclic ring with R 4 or R 5 , with the proviso that when x is 2, R 3 is hydrogen; R 4 is hydrogen, alkyl, or aryl and R 5 is hydrogen or, when R 4 is hydrogen, is alkyl or aryl, or R 4 and R 5 together are part of a carbocyclic ring.