Mounting pad and semiconductor encapsulation device combination

Claim 1

In combination, a semiconductor encapsulation device having at least two substantially parallel leads projecting from a single face thereof in substantially the same plane and a mounting pad comprising a body of electrically non-conductive material having first and second substantially oppositely disposed major faces and at least one transverse slot therein normal to said major faces traversing a major portion of said major faces and intersecting only one edge of said body, said slot having a non-uniform width, the slot being widest at the point of its intersection with said edge and narrowest at a point intermediate said edge and the terminal end of said slot, the width of said slot generally expanding from the narrowest point to a width substantially matching the width of the leads projecting from the encapsulation device at the terminal end of said slot, said slot further including a notch in at least one side thereof at said narrowest point, and one lead passing through said slot at the terminal end thereof and a second lead passing through said notch.