Self-bonding magnet wire and process of manufacturing same

Claim 2

A self bonding magnet wire comprising a conductor with a coating thereon, said coating comprising A. 65 to 95 parts by weight of a first copolyamide comprising 10 to 50 weight ω-laurolactam, 20 to 35 weight percent ε-caprolactam, 15 to 25 weight percent hexamethylene diammonium adipate and 5 to 35 weight percent hexamethylene diammonium sebacate; B. 35 to 5 parts by weight of a second copolyamide comprising 70 to 90 weight percent ω-laurolactam, and the remainder ε-caprolactam; and C. 5 to 25 parts by weight polyhydroxypolyetherester resin.

Claim 3

Wire of claim 1, wherein further comprising a first layer of synthetic resin next adjacent said conductor and underneath said coating, said synthetic resin being selected from the group consisting of polyester, polyesterimide, polyamideimide, polyimide and polyvinyl formal, and mixtures thereof.

Claim 4

Wire of claim 1, wherein said first copolyamide has a relative viscosity of between 2.5 to 4.0.

Claim 5

Wire of claim 1, wherein said second copolyamide has a relative viscosity of 2.6 to 3.0.

Claim 6

Wire of claim 1, wherein said polyhydroxypolyetherester resin is a linear thermoplastic polymer having a film forming property and is between 40,000 and 50,000 average molecular weight and is obtained from reaction of methyl substituted diepoxide and a dicarboxylic acid.

Claim 7

Process of manufacturing a self bonding magnet wire comprising the steps of A. polymerizing a mixture of 10 to 50 weight percent ω-laurolactam, 15 to 25 weight percent hexamethylene diammonium adipate, 20 to 35 weight percent ε-caprolactam and 5 to 35 weight percent hexamethylene diammonium sebacate to produce a copolyamide having a relative viscosity of between 2.5 to 4.0; B. polymerizing a mixture of 70 to 90 weight percent ω-laurolactam, and the remainder ε-caprolactam to produce a copolyamide having a relative viscosity of between 2.6 and 3.0; C. reacting methyl substituted diepoxide and a dicarboxylic acid to produce a polyhydroxypolyetherester resin having an average molecular weight of between 40,000 and 50,000; D. dissolving in a suitable solvent 65 to 95 parts by weight of said copolyamide of step A hereinabove; E. dissolving in a suitable solvent 35 to 5 parts by weight of said copolyamide of step B hereinabove; F. dissolving in a suitable solvent 5 to 25 parts by weight of said polyhydroxypolyetherester resin of step C hereinabove; G. mixing together the solutions of steps D,E and F hereinabove; H. coating a conductor with said mixture of step G hereinabove; I. and baking said coated conductor at a temperature of between 250°C and 400°C.

Claim 8

Process of manufacturing a self bonding magnet wire comprising the steps of A. polymerizing a mixture of 10 to 50 weight percent ω-laurolactam, 15 to 25 weight percent hexamethylene diammonium adipate, 20 to 35 weight percent ε-caprolactam and 5 to 35 weight percent hexamethylene diammonium sebacate to produce a copolyamide having a relative viscosity of between 2.5 to 4.0; B. polymerizing a mixture of 70 to 90 weight percent ω-laurolactam, and the remainder ε-caprolactam to produce a copolyamide having a relative viscosity of between 2.6 and 3.0; C. reacting methyl substituted diepoxide and a dicarboxylic acid to produce a polyhydroxypolyetherester resin having an average molecular weight of between 40,000 and 50,000; D. dissolving in a suitable solvent 65 to 95 parts by weight of said copolyamide of step A hereinabove; E. dissolving in a suitable solvent 35 to 5 parts by weight of said copolyamide of step B hereinabove; F. dissolving in a suitable solvent 5 to 25 parts by weight of said polyhydroxypolyetherester resin of step C hereinabove; G. mixing together the solutions of steps D,E and F hereinabove; H. coating a conductor with said mixture of step G hereinabove; I. and baking said coated conductor at a temperature of between 250°C and 400°C.

Claim 9

Process of claim 6, wherein said conductor is first coated with a synthetic resin selected from the group consisting of polyester, polyesterimide, polyamideimide, polyimide and polyvinyl formal, and mixtures thereof, prior to said coating with said mixture.

Claim 10

Process of claim 6, wherein said copolyamide of step A has a relative viscosity of 2.7 to 3.6 and is dissolved in m-cresol in an amount of 80 to 90 parts by weight; wherein said copolyamide of step B has a relative viscosity of 2.8 to 2.9 and is dissolved in m-cresol in an amount of from 10 to 20 parts by weight; and wherein said polyhydroxypolyetherester resin has an average molecular weight of 40,000 and is dissolved in m-cresol in an amount of 25 parts by weight; and wherein said coating is heated at a temperature of 300°C at a linear speed of 5 m/min.