US3951701A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mask for use in production of semiconductor arrangements
Assignee: Telefunken Electronic GmbH
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Filing: 1975-03-19
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Granted: 1976-04-20
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Expires: 1995-03-19
Abstract
Abstract A mask for use in production of semiconductor arrangements comprises a mask element with projections thereon at a side adapted to face the semiconductor arrangement, the projections being adapted to cooperate with recesses in the semiconductor arrangement to locate the mask element thereon. The invention also includes a method of producing the semiconductor arrangements.
Inventors
- 👤 Andreas Csillag
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-28 23:25
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10D; H10D99/00; H10P; H10P95/00; Y; Y10; Y10S; Y10S438/00; Y10S438/942; Y10S438/944; Y10T; Y10T428/00; Y10T428/24; Y10T428/24479
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
61 words
A mask for use in production of a semiconductor arrangement, particularly evaporation masks for a semiconductor chip, characterised in that the mask is provided on its surface which is to face the semiconductor arrangement, with projections which are provided for the self-lining up of the mask for engagement in corresponding recesses in the surface of the semiconductor arrangement to be processed.
Claim 2
Dependent Claim
61 words
A mask for use in production of a semiconductor arrangement, particularly evaporation masks for a semiconductor chip, characterised in that the mask is provided on its surface which is to face the semiconductor arrangement, with projections which are provided for the self-lining up of the mask for engagement in corresponding recesses in the surface of the semiconductor arrangement to be processed.
Claim 3
Dependent Claim
12 words
A mask as defined in claim 1, wherein said mask comprises metal.
Claim 4
Independent Claim
75 words
A method of producing a semiconductor arrangement including the steps of forming in a surface of said semiconductor arrangement a plurality of recesses, applying to said surface of said semiconductor arrangement a mask element with projections cooperating with said plurality of recesses to locate said mask element on said surface of said semiconductor arrangement and depositing connecting contacts by evaporation of metal through windows in said mask element onto said surface of said semiconductor arrangement.
Claim 5
Independent Claim
75 words
A method of producing a semiconductor arrangement including the steps of forming in a surface of said semiconductor arrangement a plurality of recesses, applying to said surface of said semiconductor arrangement a mask element with projections cooperating with said plurality of recesses to locate said mask element on said surface of said semiconductor arrangement and depositing connecting contacts by evaporation of metal through windows in said mask element onto said surface of said semiconductor arrangement.
Claim 6
Independent Claim
81 words
A method of producing a semiconductor arrangement including the steps of forming in a surface of said semiconductor arrangement a plurality of recesses, applying to said surface of said semiconductor arrangement a mask element with projections cooperating with said plurality of recesses to locate said mask element on said surface of said semiconductor arrangement and depositing covering layers for certain regions of said surface of said semiconductor arrangement on said surface of said semiconductor arrangement through windows in said mask element.
Claim 7
Independent Claim
81 words
A method of producing a semiconductor arrangement including the steps of forming in a surface of said semiconductor arrangement a plurality of recesses, applying to said surface of said semiconductor arrangement a mask element with projections cooperating with said plurality of recesses to locate said mask element on said surface of said semiconductor arrangement and depositing covering layers for certain regions of said surface of said semiconductor arrangement on said surface of said semiconductor arrangement through windows in said mask element.
Claim 8
Dependent Claim
14 words
A method as defined in claim 4, wherein said covers are deposited by evaporation.
Claim 9
Dependent Claim
14 words
A method as claimed in claim 5, wherein said covers are deposited by printing.
Claim 10
Independent Claim
104 words
A method of producing a semiconductor arrangement including the steps of forming in a surface of said semiconductor arrangement a plurality of recesses to form mesa arrangements, applying to said surface of said surface of said semiconductor arrangement a mask element with projections cooperating with said plurality of recesses to locate said mask element relative to said surface of said semiconductor arrangement with said projections being longer than the depth of said plurality of recesses to space said mask element above said surface of said semiconductor arrangement and depositing thick metal peaks on surfaces of said mesa arrangements through windows in said mask element.
Claim 11
Independent Claim
104 words
A method of producing a semiconductor arrangement including the steps of forming in a surface of said semiconductor arrangement a plurality of recesses to form mesa arrangements, applying to said surface of said surface of said semiconductor arrangement a mask element with projections cooperating with said plurality of recesses to locate said mask element relative to said surface of said semiconductor arrangement with said projections being longer than the depth of said plurality of recesses to space said mask element above said surface of said semiconductor arrangement and depositing thick metal peaks on surfaces of said mesa arrangements through windows in said mask element.
Claim 12
Dependent Claim
54 words
A mask for use in the production of a semiconductor arrangement comprising a mask element and a plurality of projections on said mask element on a side of the mask adapted to face said semiconductor arrangement for engagement in recesses in said semiconductor arrangement to position said mask element relative to said semiconductor arrangements.
Claim 13
Dependent Claim
54 words
A mask for use in the production of a semiconductor arrangement comprising a mask element and a plurality of projections on said mask element on a side of the mask adapted to face said semiconductor arrangement for engagement in recesses in said semiconductor arrangement to position said mask element relative to said semiconductor arrangements.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1979-04-20 | 1979-10-20 | 1980-04-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1983-04-20 | 1983-10-20 | 1984-04-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1987-04-20 | 1987-10-20 | 1988-04-20 | $7700.00 | Window Closed / Lapsed |