Polyamides having improved dyeability and thermal stability

Claim 2

A polyamide comprising recurring carbonamide groups separated from each other by 2 to 18 carbon atoms and 0.1 to 10 molar percent based on the molecular weight of the recurring units of the polyamide chain, of a salt of an organic diamine of 2 to 18 carbon atoms between amino groups with a phosphonic acid of the formula: ##EQU5## wherein R 1 is an n-valent organic alkyl, cycloalkyl, aryl or aralkyl radical and n is an integer of from 1 to 3, said phosphonic acid salt being the predominate phosphorus material by molar percent.

Claim 3

The composition of claim 1 including the addition of a stabilizing amount of a copper salt and an iodide.

Claim 4

The composition of claim 2 wherein the copper salt is cupric acetate.

Claim 5

The composition of claim 1 in the form of a filament.

Claim 6

The composition of claim 4 in the form of a filament wherein the polyamide is polyhexamethyleneadipamide and the salt is hexamethylene diammonium phenylphosphonate.

Claim 7

The composition of claim 1 wherein the phosphonic acid is a lower alkyl phosphonic acid.

Claim 8

The composition of claim 1 wherein the phosphonic acid is cyclohexylphosphonic acid.

Claim 9

The composition of claim 1 wherein the phosphonic acid is a monocyclic aryl phosphonic acid.

Claim 10

The composition of claim 1 wherein the phosphonic acid is phenylphosphonic acid.

Claim 11

The composition of claim 1 wherein the organic diamine is hexamethylenediamine.

Claim 12

The composition of claim 1 wherein the polyamide is polycaprolactam.

Claim 13

The composition of claim 1 wherein the polyamide is polyhexamethyleneadipamide.

Claim 14

Process for the manufacture of polyamides which comprises polymerising at elevated temperatures a polyamide-forming material selected from the group consisting of a. monoaminomonocarboxylic acids, and the corresponding lactams, having at least two carbon atoms between the amino and carboxylic acids, and b. substantially equimolecular proportions of a diamine having at least two carbon atoms between the amino groups and a dicarboxylic acid having at least two carbon atoms between the carboxylic acid groups, in the presence of from 0.1 to 10.0 molar percent, based on the molecular weight of the recurring units of the polyamide chain, of a salt of an organic diamine of 2 to 18 carbon atoms between amine groups with a phosphonic acid of the formula: ##EQU6## wherein R 1 is an n-valent organic alkyl, cycloalkyl, aryl or aralkyl radical and n is an integer of from 1 to 3.

Claim 15

Process for the manufacture of polyamides which comprises polymerising at elevated temperatures a polyamide-forming material selected from the group consisting of a. monoaminomonocarboxylic acids, and the corresponding lactams, having at least two carbon atoms between the amino and carboxylic acids, and b. substantially equimolecular proportions of a diamine having at least two carbon atoms between the amino groups and a dicarboxylic acid having at least two carbon atoms between the carboxylic acid groups, in the presence of from 0.1 to 10.0 molar percent, based on the molecular weight of the recurring units of the polyamide chain, of a salt of an organic diamine of 2 to 18 carbon atoms between amine groups with a phosphonic acid of the formula: ##EQU6## wherein R 1 is an n-valent organic alkyl, cycloalkyl, aryl or aralkyl radical and n is an integer of from 1 to 3.

Claim 16

The polyamide produced by the process of claim 13.

Claim 17

The polyamide produced by the process of claim 13 in the form of a filament.

Claim 18

The process of claim 13 wherein a stabilizing amount of a copper salt and an iodide are added to the polyamide-forming material.

Claim 19

The process of claim 16 wherein the copper salt is cupric acetate.

Claim 20

Process as claimed in claim 13 wherein caprolactam is polymerised in the presence of from 0.1 to 10.0 molar per cent, based on the molecular weight of the recurring units of the polyamide chain, of a salt of an organic diamine with a phosphonic acid of the formula: ##EQU7## wherein R 1 is an n-valent organic radical and n is an integer of from 1 to 3.

Claim 21

Process as claimed in claim 13 wherein substantially equimolecular proportions of adipic acid and hexamethylenediamine are polymerised in the presence of from 0.1 to 10.0 molar per cent, based on the molecular weight of the recurring units of the polyamide chain, of a salt of an organic diamine with a phosphonic acid of the formula: ##EQU8## wherein R 1 is an n-valent organic radical and n is an integer of from 1 to 3.

Claim 22

Process as claimed in claim 13 wherein the phosphonic acid is a lower alkylphosphonic acid.

Claim 23

Process as claimed in claim 13 wherein the phosphonic acid is cyclohexylphosphonic acid.

Claim 24

Process as claimed in claim 13 wherein the phosphonic acid is a monocyclic arylphosphonic acid.

Claim 25

Process as claimed in claim 13 wherein the organic diamine is hexamethylenediamine.

Claim 26

Process as claimed in claim 13 wherein the salt of the organic diamine with the phosphonic acid is added after formation of the polyamide and the resulting mixture is heated above the melting point of the mixture to effect further polymerization.