Thermosetting compositions containing poly(arylacetylenes) and an aromatic ring compound having the rings joined through a keto group

Claim 2

A THERNOSETTING COMPOSITION COMPRISING A BLEND OF (1) A PREPOLYMER OF AT LEAST ONE POLYACETYLENICALLY SUBSTITUTED AROMATIC COMPOUND, SAID PREPOLYMER HAVING A NUMBER AVERAGE MOLECULAR WEIGHT FROM ABOUT 900 TO ABOUT 12,000, A RATIO OF AROMATIC PROTONS OF OLEFINIC PROTONS GREATER THAN ABOUT 2.4 AND CONTAINING FROM ABOUT 5 TO ABOUT 20 PERCENT ACETYLENIC GROUPS BY WEIGHT OF THE PREPOLYMER, WITH (2) FROM ABOUT 2 TO ABOUT 200 PERCENT, BY WEIGHT OF THE PREPOLYMER, OF A LEAST ONE AROMAIC ORGANIC COMPOUND CONTAINING AT LEAST TWO SIXMEMBERED AROMATIC RINGS, SAID RINGS BEING COUPLED WITH EACH OTHER THROUGH A KETO GROUP, SAID RINGS BEING COUPLED WITH EACH THEREOF HAVING A MELTING POINT LESS THAN ABOUT 220*C AND A BOILING POINT GREATER THAN ABOUT 240*C.

Claim 3

The thermosetting composition of claim 1 wherein the prepolymer comprises a polymer of a diethynylbenzene.

Claim 4

The thermosetting composition of claim 2 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and diphenylbutadiyne.

Claim 5

The thermosetting composition of claim 2 wherein the polymer of a diethynylbenzene is a copolymer of a diethynylbenzene and phenylacetylene.

Claim 6

The thermosetting composition of claim 2 wherein the aromatic organic compound is fluorenone.

Claim 7

The thermosetting composition of claim 2 wherein the aromatic organic compound is benzophenone.

Claim 8

The thermosetting composition of claim 6 wherein diphenylbutadiyne is used in conjunction with the benzophenone.

Claim 9

The process of preparing a thermoset resin essentially free of aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55*C. to about 250*C. until from about 30 percent to about 90 percent of said compound has been converted to polymer, (b) separating the prepolymer from the polymerization reaction mixture, and (2) in a second stage, (a) fabricating a blend of said prepolymer and from about 2 to about 200 percent, by weight of the prepolymer, of at least one aromatic organic compound containing at least two six-membered aromatic rings, said rings being coupled with each other through a keto group, said compound or mixtures thereof having a melting point less than about 220*C. and a boiling point greater than about 240*C., and (b) heating the fabricated blend to a temperature of from about 100*C. to about 300*C.

Claim 10

The process of preparing a thermoset resin essentially free of aliphatic unsaturation which comprises (1) in a first stage (a) preparing a prepolymer by polymerizing at least one polyacetylenically substituted aromatic compound by heating said compound with an aromatization catalyst in an inert organic diluent to a temperature of from about 55*C. to about 250*C. until from about 30 percent to about 90 percent of said compound has been converted to polymer, (b) separating the prepolymer from the polymerization reaction mixture, and (2) in a second stage, (a) fabricating a blend of said prepolymer and from about 2 to about 200 percent, by weight of the prepolymer, of at least one aromatic organic compound containing at least two six-membered aromatic rings, said rings being coupled with each other through a keto group, said compound or mixtures thereof having a melting point less than about 220*C. and a boiling point greater than about 240*C., and (b) heating the fabricated blend to a temperature of from about 100*C. to about 300*C.

Claim 11

The process of claim 8 wherein the prepolymer prepared in the first stage is prepared from a diethynylbenzene and the aromatic organic compound used in the second stage is benzophenone.