Patent US4756376A successfully refreshed from Google Patents.
Patent US3915780A successfully refreshed from Google Patents.
US3915780A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Extruded epoxy packaging system
Assignee: Texas Instruments Inc
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Filing: 1973-08-02
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Granted: 1975-10-28
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Expires: 1993-08-02
Abstract
Abstract The disclosure relates to an assembly and packaging system for fabrication of integrated circuits and the like wherein a continuous strip of a polymer film having integrated circuits thereon has leads attached thereto and is then fed between a pair of strips of epoxy encapsulating material. The encapsulating material is an extruded partially cured epoxy which is quickly cooled when leaving the extruder and then heated and substantially fully cured while being positioned on each side of the polymer film strip. The layers of epoxy are then sealed together and substantially cured around the integrated circuits by means of a pair of heated rollers to encapsulate the circuit on-line in a continuous operation.
Inventors
- 👤 Jr Louis Walter Broussard
- 👤 Stephen Sydney Baird
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 15:11
CPC Classifications
B; B29; B29C; B29C63/00; B32; B32B; B32B27/00; B32B27/06; B32B27/08; B32B27/18; B32B27/20; B32B27/28; B32B27/281; B32B27/38; B65; B65B; B65B9/00; B65B9/02; H; H10; H10W; H10W74/00; H10W74/01; B32B2553/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T428/00; Y10T428/31504; Y10T428/31511; Y10T428/31525; Y10T428/31551; Y10T428/31609; Y10T428/31612; Y10T428/31652; Y10T428/31663
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
135 words
A METHOD FOR THE ASSEMBLY OF A PACKAGED SEMICOMDUCTOR DEVICE COMPRISING THE STEPS OF: 0 EXTRUDING IN A PARTIALLY CURED STATE FIRST AND SECOND PLASTIC STRIPS OF EPOXY RESIN FILM HAVING A HIGH FILLER CONTENT, AND RAPIDLY COOLING THE EXTRUDED STRIPS TO SLOW THE CURING PROCESS, FEEDING THE STRIPS IN A PARALLEL RELATIONSHIP TOWARD A COMPRESSION STATION FOR SANDWICHING THE STRIPS TOGETHER, REHEATING AT LEAST ONE OF SAID STRIPS JUST PRIOR TO ENTERING SAID COMPRESSION STATION FOR THE PURPOSE OF RESOFTENING THE FILM TO PERMIT BONDING OF SAID STRIPS IN SAID COMPRESSION STATION, AND FEEDING BETWEEN THE EPOXY STRIPS A THIRD PLASTIC STRIP HAVING MOUNTED THEREON A PLURALITY OF SPACED SEMICONDUCTOR DEVICES, AND CAUSING SAID THIRD STRIP TO BE SANDWICHED BETWEEN SAID FIRST AND SECOND PLASTIC STRIPS AT SAID COMPRESSION STATION TO ENCAPSULATE SAID DEVICES.
Claim 2
Independent Claim
135 words
A METHOD FOR THE ASSEMBLY OF A PACKAGED SEMICOMDUCTOR DEVICE COMPRISING THE STEPS OF: 0 EXTRUDING IN A PARTIALLY CURED STATE FIRST AND SECOND PLASTIC STRIPS OF EPOXY RESIN FILM HAVING A HIGH FILLER CONTENT, AND RAPIDLY COOLING THE EXTRUDED STRIPS TO SLOW THE CURING PROCESS, FEEDING THE STRIPS IN A PARALLEL RELATIONSHIP TOWARD A COMPRESSION STATION FOR SANDWICHING THE STRIPS TOGETHER, REHEATING AT LEAST ONE OF SAID STRIPS JUST PRIOR TO ENTERING SAID COMPRESSION STATION FOR THE PURPOSE OF RESOFTENING THE FILM TO PERMIT BONDING OF SAID STRIPS IN SAID COMPRESSION STATION, AND FEEDING BETWEEN THE EPOXY STRIPS A THIRD PLASTIC STRIP HAVING MOUNTED THEREON A PLURALITY OF SPACED SEMICONDUCTOR DEVICES, AND CAUSING SAID THIRD STRIP TO BE SANDWICHED BETWEEN SAID FIRST AND SECOND PLASTIC STRIPS AT SAID COMPRESSION STATION TO ENCAPSULATE SAID DEVICES.
Claim 3
Dependent Claim
19 words
A method as in claim 1 wherein the epoxy of said extruded strips contains at least about 85% filler.
Claim 4
Dependent Claim
34 words
A method as in claim 1 further including the step of adding a coupling agent to at least one of said epoxy strips to enhance the bonding of said strips at said compression station.
Claim 5
Dependent Claim
15 words
A method as in claim 1 wherin said third plastic strip comprises a polyimide resin.
Claim 6
Dependent Claim
23 words
A method as in claim 1 futher including the step of bonding metal leads to said semiconductor devices on said third plastic strip.
Claim 7
Dependent Claim
56 words
A method as in claim 5 wherein said lead bonding operation includes the steps of feeding wire from each of two spools provided on opposite sides of said third plastic strip, bonding the tip of each said wire in successive steps to a semiconductor terminal pad, and then severing the bonded wire to a suitable length.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-10-27 | 1979-04-28 | 1979-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-10-27 | 1983-04-28 | 1983-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-10-27 | 1987-04-28 | 1987-10-28 | $7700.00 | Window Closed / Lapsed |