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US3915369A
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Method of dry-soldering highly refractory materials
Assignee: Siemens AG
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Filing: 1973-03-13
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Granted: 1975-10-28
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Expires: 1993-03-13
Abstract
Abstract Highly refractory binary ceramic materials such as carbides, borides, nitrides and silicides are joined to another material by forcing a solder material which includes therein at most 1 at. $of an active metal such as Al, Ba, Ce, Cr, Hf, Mo, Nb, Ni, Ta, Ti, Zr, etc. into intimate contact with the ceramic and then heating the so-formed couple to a temperature sufficiently high for a solid-state chemical reaction to occur between the active metal and the more negative element in the binary ceramic and below the melting point of the solder material whereby interconnecting bridge-like bonds are formed between the solder material and the ceramic.
Inventors
- 👤 Heinrich Schmidt-Bruecken
- 👤 Winfried Schlapp
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 18:36
CPC Classifications
C; C04; C04B; C04B37/00; C04B37/02; C04B37/023; C04B37/026; C04B2237/00; C04B2237/02; C04B2237/12; C04B2237/124; C04B2237/125; C04B2237/126; C04B2237/127; C04B2237/30; C04B2237/32; C04B2237/36; C04B2237/363; C04B2237/40; Y; Y10; Y10S; Y10S228/00; Y10S228/903
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
124 words
A METHOD OF DRY-SOLDERING A HIGHLY REFACTORY CERAMIC SURFACE COMPOSED OF A BINARY COMPOUND OTHER THAN AN OXIDE SELECTED FROM THE GROUP CONSISTING OF CARBIDES, BORIDES, NITRIDES AND SILLICIDES WITH A SURFACE COMPOSED OF A METAL, COMPRISING THE STEPS OF: FORMING A DRY-SOLDER MATERIAL FROM A BASIC METAL AND AT MOST 1 ATOMIC PERCENT OF AN ACTIVE METAL WHICH IS CHRACTERIZED BY A FORMATION ENTHALPY WHICH IS AT LEAST 50% OF THE FORMATION ENTHLPY OF SAID BINARY COMPOUND, FORCING SAID DRY-SOLDER MATERIAL INTO INTIMATE CONTACT WITH THE SURFACES BEING DRY-SOLDERED, AND HEATING THE SO-FORMED ARRANGEMENT TO A TEMPERATURE SUFFICIENTLY HIGH FOR A SOLID-STATE CHEMICAL REACTION TO OCCUR BETWEEN SAID ACTIVE METAL AND SAID BINARY COMPOUND AND BELOW THE MELTING POINT OF SAID DRY-SOLDER MATERIAL.
Claim 2
Independent Claim
124 words
A METHOD OF DRY-SOLDERING A HIGHLY REFACTORY CERAMIC SURFACE COMPOSED OF A BINARY COMPOUND OTHER THAN AN OXIDE SELECTED FROM THE GROUP CONSISTING OF CARBIDES, BORIDES, NITRIDES AND SILLICIDES WITH A SURFACE COMPOSED OF A METAL, COMPRISING THE STEPS OF: FORMING A DRY-SOLDER MATERIAL FROM A BASIC METAL AND AT MOST 1 ATOMIC PERCENT OF AN ACTIVE METAL WHICH IS CHRACTERIZED BY A FORMATION ENTHALPY WHICH IS AT LEAST 50% OF THE FORMATION ENTHLPY OF SAID BINARY COMPOUND, FORCING SAID DRY-SOLDER MATERIAL INTO INTIMATE CONTACT WITH THE SURFACES BEING DRY-SOLDERED, AND HEATING THE SO-FORMED ARRANGEMENT TO A TEMPERATURE SUFFICIENTLY HIGH FOR A SOLID-STATE CHEMICAL REACTION TO OCCUR BETWEEN SAID ACTIVE METAL AND SAID BINARY COMPOUND AND BELOW THE MELTING POINT OF SAID DRY-SOLDER MATERIAL.
Claim 3
Dependent Claim
83 words
A method as defined in claim 1 wherein said active metal is included within said dry-solder material in a form selected from the group consisting of an alloy with said basic metal, a foil on a select surface of said basic metal, a vapor-deposited layer on a select surface of said basic metal and an ion within a thermally decomposable chemical compound yielding said active metal and an inert residue, said compound forming a coating on a select surface of said basic metal.
Claim 4
Dependent Claim
31 words
A method as defined in claim 1 wherein the amount of said active metal within said dry-solder material is 1 atom of active metal per 1000 atoms of said basic metal.
Claim 5
Dependent Claim
22 words
A method as defined in claim 1 wherein said basic metal is selected from the group consisting of Ag, Au and Cu.
Claim 6
Dependent Claim
38 words
A method as defined in claim 1 wherein said ceramic surface is composed of a diamond and said active metal is characterized by a formation enthalpy to carbon of at least 10 Cal. per atomic gram of carbon.
Claim 7
Dependent Claim
24 words
A method as defined in claim 5 wherein said active metal is selected from the group consisting of Cr, Hf, Nb, Ti and Zr.
Claim 8
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary carbide compound other than an oxide with a surface composed of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary carbide compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary carbide compound and below the melting point of said dry-solder material.
Claim 9
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary carbide compound other than an oxide with a surface composed of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary carbide compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary carbide compound and below the melting point of said dry-solder material.
Claim 10
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary boride compound other than an oxide with a surface compound of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary boride compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary boride compound and below the melting point of said dry-solder material.
Claim 11
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary boride compound other than an oxide with a surface compound of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary boride compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary boride compound and below the melting point of said dry-solder material.
Claim 12
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary nitride compound other than an oxide with a surface composed of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary nitride compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary nitride compound and below the melting point of said dry-solder material.
Claim 13
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary nitride compound other than an oxide with a surface composed of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary nitride compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary nitride compound and below the melting point of said dry-solder material.
Claim 14
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary silicide compound other than an oxide with a surface composed of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary silicide compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary silicide compound and below the melting point of said dry-solder material.
Claim 15
Independent Claim
115 words
A method of dry-soldering a highly refractory ceramic surface composed of a binary silicide compound other than an oxide with a surface composed of a metal, comprising the steps of: forming a dry-solder material from a basic metal and at most 1 atomic percent of an active metal which is characterized by a formation enthalpy which is at least 50% of the formation enthalpy of said binary silicide compound; forcing said dry-solder material into intimate contact with the surfaces being dry-soldered; and heating the so-formed arrangement to a temperature sufficiently high for a solid-state reaction to occur between said active metal and said binary silicide compound and below the melting point of said dry-solder material.
References Cited (Backward Citations)
US2015482A
Cited
US2385380A
Cited
US2564738A
Cited
US3180023A
Cited
US3372732A
Cited
US3377696A
Cited
US3444613A
Cited
US3531853A
Cited
US3517432A
Cited
US3826630A
Cited
US3795041A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-10-27 | 1979-04-28 | 1979-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-10-27 | 1983-04-28 | 1983-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-10-27 | 1987-04-28 | 1987-10-28 | $7700.00 | Window Closed / Lapsed |