US3914850A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bonding of dissimilar workpieces to a substrate
Assignee: AT&T Inc
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Filing: 1973-11-05
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Granted: 1975-10-28
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Expires: 1993-11-05
Abstract
Abstract Device leads are compliantly bonded and external leads are directly bonded to a substrate with a single stroke of a bonding tool. The external leads are comprised in a lead frame that includes a compliant medium portion for bonding the device leads.
Inventors
- 👤 Alexander Coucoulas
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 01:04
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3421; H10W; H10W70/00; H10W70/099; H10W90/00; H10W90/701; H10W95/00; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/10742; H05K2201/10886; H05K2201/10924; H05K3/3405; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
126 words
Method of bonding a first workpiece to a first station on a substrate and a second workpiece to a second station on the substrate, said method comprising: a. fabricating a member comprising the first workpiece and a compliant medium portion; b. positioning a second workpiece adjacent the second station on the substrate; c. positioning the member relative to the substrate with the first workpiece adjacent the first station and the compliant medium portion adjacent the second workpiece; and d. applying force to the member to deform the first workpiece against, and bond the first workpiece to, the first station, and to deform the compliant medium portion around the second workpiece, thereby to deform the second workpiece against, and bond the second workpiece to, the second station.
Claim 2
Dependent Claim
126 words
Method of bonding a first workpiece to a first station on a substrate and a second workpiece to a second station on the substrate, said method comprising: a. fabricating a member comprising the first workpiece and a compliant medium portion; b. positioning a second workpiece adjacent the second station on the substrate; c. positioning the member relative to the substrate with the first workpiece adjacent the first station and the compliant medium portion adjacent the second workpiece; and d. applying force to the member to deform the first workpiece against, and bond the first workpiece to, the first station, and to deform the compliant medium portion around the second workpiece, thereby to deform the second workpiece against, and bond the second workpiece to, the second station.
Claim 3
Dependent Claim
31 words
Method as in claim 1 wherein: e. step (d) is performed by substantially deforming the first workpiece against said first station before deforming the compliant medium portion around the second workpiece.
Claim 4
Dependent Claim
29 words
Method as in claim 1 wherein: f. step (a) fuRther comprises treating the surface of the compliant medium portion to inhibit bonding between said surface and said second workpiece.
Claim 5
Dependent Claim
173 words
Method of transmitting a mechanical bonding force to a first workpiece and a limited mechanical bonding force to a second workpiece to bond said first and second workpieces to first and second stations respectively on a substrate, said method comprising: a. positioning a portion of the second workpiece adjacent the second station on the substrate; b. positioning a first portion of the first workpiece adjacent the first station on the substrate and a second portion of the first workpiece adjacent that portion of the second workpiece adjacent said second station; and c. applying mechanical bonding force to the first workpiece to deform the first portion thereof against, and bond said first portion to, the first station, and to deform the second portion of said first workpiece around said second workpiece, thereby to deform said second workpiece against, and bond said second workpiece to, said second station, the mechanical bonding force transmitted to said second workpiece being limited to that required to deform the second portion of said first workpiece around said second workpiece.
Claim 6
Dependent Claim
173 words
Method of transmitting a mechanical bonding force to a first workpiece and a limited mechanical bonding force to a second workpiece to bond said first and second workpieces to first and second stations respectively on a substrate, said method comprising: a. positioning a portion of the second workpiece adjacent the second station on the substrate; b. positioning a first portion of the first workpiece adjacent the first station on the substrate and a second portion of the first workpiece adjacent that portion of the second workpiece adjacent said second station; and c. applying mechanical bonding force to the first workpiece to deform the first portion thereof against, and bond said first portion to, the first station, and to deform the second portion of said first workpiece around said second workpiece, thereby to deform said second workpiece against, and bond said second workpiece to, said second station, the mechanical bonding force transmitted to said second workpiece being limited to that required to deform the second portion of said first workpiece around said second workpiece.
Claim 7
Dependent Claim
189 words
Method of bonding to circuit paths on a substrate first leads formed in a lead frame and second leads attached to a device, said method comprising: a. fabricating the lead frame to comprise the first leads and a compliant medium portion; b. positioning the device adjacent the substrate with the second leads having a desired orientation relative to said circuit paths; c. positioning the lead frame adjacent the substrate with the first leads having the desired orientation relative to said circuit paths and with the compliant medium portion adjacent said second leads; and d. applying force to the lead frame directly against the first leads to deform the first leads against, and bond the first leads to, circuit paths on the substrate, and directly against the compliant medium portion to deform the compliant medium portion around said second leads, thereby to deform said second leads against, and bond said second leads to, circuit paths on the substrate; the force required to deform and bond said second leads against and to said circuit paths being limited to that force required to deform said compliant medium portion around said second leads.
Claim 8
Dependent Claim
189 words
Method of bonding to circuit paths on a substrate first leads formed in a lead frame and second leads attached to a device, said method comprising: a. fabricating the lead frame to comprise the first leads and a compliant medium portion; b. positioning the device adjacent the substrate with the second leads having a desired orientation relative to said circuit paths; c. positioning the lead frame adjacent the substrate with the first leads having the desired orientation relative to said circuit paths and with the compliant medium portion adjacent said second leads; and d. applying force to the lead frame directly against the first leads to deform the first leads against, and bond the first leads to, circuit paths on the substrate, and directly against the compliant medium portion to deform the compliant medium portion around said second leads, thereby to deform said second leads against, and bond said second leads to, circuit paths on the substrate; the force required to deform and bond said second leads against and to said circuit paths being limited to that force required to deform said compliant medium portion around said second leads.
Claim 9
Dependent Claim
27 words
Method as in claim 5 wherein: e. step (d) is performed by substantially deforming the first leads before deforming the compliant medium portion around said second leads.
Claim 10
Dependent Claim
31 words
Method as in claim 5 wherein: f. step (a) further comprises treating the surface of the compliant medium portion to inhibit bonding between said compliant medium portion and said second leads.
Claim 11
Dependent Claim
29 words
Method as in claim 5 wherein: g. step (a) further comprises treating the surface of the first leads to enhance bonding between said first leads and said circuit paths.
Claim 12
Dependent Claim
42 words
Method as in claim 5 wherein: h. step (a) further comprises treating the surface of the lead frame to inhibit bonding between the compliant medium portion and said second leads and to enhance bonding between said first leads and said circuit paths.
Claim 13
Dependent Claim
52 words
Method as in claim 5 wherein the circuit paths are gold, the second leads are gold, and the lead frame is copper, and wherein: j. step (a) further comprises: i. nickel plating the lead frame, and ii. gold plating the lead frame over said nickel plating except in the compliant medium portion.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-10-27 | 1979-04-28 | 1979-10-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-10-27 | 1983-04-28 | 1983-10-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-10-27 | 1987-04-28 | 1987-10-28 | $7700.00 | Window Closed / Lapsed |