US3699640A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compliant bonding
Assignee: AT&T Inc
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Filing: 1970-12-01
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Granted: 1972-10-24
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Expires: 1990-12-01
Abstract
Abstract Compliant bonding of beam-leaded semiconductor devices is improved by deforming a compliant member into apertures of a rigid bonding grid during a bonding process. The deformation of the compliant member provides a desired clearance around brittle body portions of the semiconductor devices so that the body portions remain undamaged during bonding. In one example, the deformation takes place during exertion of bonding force and, in another example, just prior to the exertion of the bonding force. In still another example, the deformation is sufficient to cause complete shearing of the compliant member so that direct viewing of the device through the compliant member for alignment purposes can be effected.
Inventors
- 👤 Benjamin H Cranston
- 👤 Michael P Eleftherion
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 05:18
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/02; H10W; H10W99/00; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07188; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
91 words
In a method of compliantly bonding beam-leaded semiconductor articles with brittle body portions to a substrate, the improvement which comprises the step of: deforming a compliant member into an aperture of a bond-force producing member during a bonding sequence to provide clearaNce for the brittle portion of the device whereby bonding forces can be transmitted through said compliant member to the beam leads without causing damage to the brittle body portion wherein the deformation of the compliant member is accomplished prior to engaging the member with the article to be bonded.
Claim 2
Dependent Claim
91 words
In a method of compliantly bonding beam-leaded semiconductor articles with brittle body portions to a substrate, the improvement which comprises the step of: deforming a compliant member into an aperture of a bond-force producing member during a bonding sequence to provide clearaNce for the brittle portion of the device whereby bonding forces can be transmitted through said compliant member to the beam leads without causing damage to the brittle body portion wherein the deformation of the compliant member is accomplished prior to engaging the member with the article to be bonded.
Claim 3
Dependent Claim
44 words
The method of bonding of claim 1 wherein the deformation is achieved by pressing the bond-force producing member and a compliant member engaged therewith against an elastomeric member whereby the elastomeric member yields and effects said deformation of the compliant member into the apertures.
Claim 4
Independent Claim
133 words
A method of bonding a first workpiece having a brittle body portion and a ductile bonding portion to a desired location on a second workpiece, which comprises: engaging an expendable compliant member with an apertured bond-force producing member; deforming a portion of the engaged compliant member into the aperture of the bond-force producing member; aligning the brittle body portion of the first workpiece with the deformed portion of the compliant member; engaging the aligned compliant member with the bonding portion of the first workpiece; and applying sufficient heat and force to the compliant member to effect a thermocompression bonding of the first workpiece to the second workpiece while limiting the application of such force to portions of the compliant member other than the deformed portion, whereby the brittle body portion is left undamaged.
Claim 5
Independent Claim
133 words
A method of bonding a first workpiece having a brittle body portion and a ductile bonding portion to a desired location on a second workpiece, which comprises: engaging an expendable compliant member with an apertured bond-force producing member; deforming a portion of the engaged compliant member into the aperture of the bond-force producing member; aligning the brittle body portion of the first workpiece with the deformed portion of the compliant member; engaging the aligned compliant member with the bonding portion of the first workpiece; and applying sufficient heat and force to the compliant member to effect a thermocompression bonding of the first workpiece to the second workpiece while limiting the application of such force to portions of the compliant member other than the deformed portion, whereby the brittle body portion is left undamaged.
Claim 6
Dependent Claim
36 words
The method of bonding of claim 3 wherein the step of deforming a portion of the compliant member is accomplished by forcing the compliant member engaged with the apertured bond-force producing member against an elastomer member.
Claim 7
Dependent Claim
37 words
The method of bonding of claim 4 wherein the deformation of the compliant member is limited to the extent that some force is transmitted to the body portion during bonding and ''''bugging'''' of the workpieces is reduced.
Claim 8
Dependent Claim
53 words
The method of bonding of claim 4 wherein the compliant member is pressed against the elastomeric member with sufficient force to cause shearing of the compliant member around the periphery of the aperture whereby the compliant member can be aligned with the workpieces by direct viewing through the opening produced by said shearing.
Claim 9
Dependent Claim
23 words
The method of claim 6 wherein the elastomeric member is formed of butadiene-styrene having a hardness of 90 on the Durometer A scale.
Claim 10
Dependent Claim
137 words
In apparatus for compliantly bonding beam-leaded articles having fragile body portions to a substrate, the improvement which comprises: a bond-force producing member having an aperture formed in a bonding face thereof large enough to accommodate a body portion of the article; means for engaging an unformed compliant member with said bonding face; and means for deforming a compliant member into an aperture of a bond-force producing member to provide clearance for the fragile body portion of the article whereby bonding forces can be transmitted through said compliant member to the beam leads without damaging the body portion, said means for deforming the compliant member comprising an elastomeric member against which may be pressed the bond-force producing member and the compliant member whereby the elastomeric member yields and effects said deformation of the compliant member into the apertures.
Claim 11
Dependent Claim
137 words
In apparatus for compliantly bonding beam-leaded articles having fragile body portions to a substrate, the improvement which comprises: a bond-force producing member having an aperture formed in a bonding face thereof large enough to accommodate a body portion of the article; means for engaging an unformed compliant member with said bonding face; and means for deforming a compliant member into an aperture of a bond-force producing member to provide clearance for the fragile body portion of the article whereby bonding forces can be transmitted through said compliant member to the beam leads without damaging the body portion, said means for deforming the compliant member comprising an elastomeric member against which may be pressed the bond-force producing member and the compliant member whereby the elastomeric member yields and effects said deformation of the compliant member into the apertures.
Claim 12
Independent Claim
139 words
An apparatus for bonding a first workpiece having a brittle body portion and a ductile bonding portion to a desired location on a second workpiece, which comprises: means for engaging an expendable compliant member with an apertured bond-force producing member; means for deforming a portion of the engaged compliant member into the aperture of the bond-force producing member; means for aligning the brittle body portion of the first workpiece with the deformed portion of the compliant member; means for engaging the aligned compliant member with the bonding portion of the first workpiece; and means for applying sufficient heat aNd force to the compliant member to effect a thermocompression bonding of the first workpiece to the second workpiece while limiting such force to portions of the compliant member other than the deformed portion, whereby the brittle body portion is undamaged.
Claim 13
Independent Claim
139 words
An apparatus for bonding a first workpiece having a brittle body portion and a ductile bonding portion to a desired location on a second workpiece, which comprises: means for engaging an expendable compliant member with an apertured bond-force producing member; means for deforming a portion of the engaged compliant member into the aperture of the bond-force producing member; means for aligning the brittle body portion of the first workpiece with the deformed portion of the compliant member; means for engaging the aligned compliant member with the bonding portion of the first workpiece; and means for applying sufficient heat aNd force to the compliant member to effect a thermocompression bonding of the first workpiece to the second workpiece while limiting such force to portions of the compliant member other than the deformed portion, whereby the brittle body portion is undamaged.
Claim 14
Dependent Claim
41 words
The apparatus for bonding of claim 9 wherein the means for deforming a portion of the compliant member further comprises an elastomeric member against which the compliant member engaged with the apertured bond-force producing member may be forced to effect deformation.
Claim 15
Dependent Claim
58 words
The apparatus for bonding of claim 10 wherein the means for deformation further comprises means for pressing the compliant member against the elastomeric member with sufficient force to shear the compliant member around the periphery of the aperture whereby the compliant member can be aligned with the workpieces by direct viewing through the opening produced by said shearing.
Claim 16
Dependent Claim
25 words
The apparatus of claim 11 wherein the elastomeric member is formed of butadiene-styrene having a hardness of 44 to 90 on the Durometer A scale.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1975-10-24 | 1976-04-24 | 1976-10-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1979-10-24 | 1980-04-24 | 1980-10-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1983-10-24 | 1984-04-24 | 1984-10-24 | $7700.00 | Window Closed / Lapsed |