US3608809A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus for uniform multiple-lead bonding
Assignee: AT&T Inc
•
Filing: 1968-08-16
•
Granted: 1971-09-28
•
Expires: 1988-08-16
Abstract
Abstract A viscous medium such as a heavy grease or molten solder is sealed in a chamber by a diaphragm to provide a compensating bonding tip and/or a compensating base. As bonding pressure is applied to a workpiece to bond a plurality of leads to selected bonding sites on the workpiece, the diaphragm flexes to compensate for workpiece irregularities and the viscous medium distributes the bonding pressure across the diaphragm to apply uniform bonding pressure at each bonding site. Bonding and/or supporting pads may be carried by the diaphragm to facilitate the application of pressure to a desired site. Alternatively, a ductile material is confined in a chamber and an apertured plate is employed to locate and retain a plurality of pins at desired positions on the ductile material. The pins and plate cooperate to confine the ductile material to the chamber and the pins are employed to apply bonding pressure to selected bonding sites on a workpiece and/or to support selected areas of the workpiece. The pins are independently displaceable to compensate for workpiece irregularities and the confined ductile material hydraulically interconnects the pins to uniformly distribute the bonding pressure to the pins. Alternatively, the resiliency of the pins is employed to provide compensation for workpiece irregularities or the pins are mounted on a resilient mat to provide such compensation.
Inventors
- 👤 Robert Holbrook
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-24 15:05
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; B; B23; B23K; B23K20/00; B23K20/02; B23K20/023; B23K20/025; B23K20/10; B23K20/106; H10P72/0444; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/07188
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
134 words
An apparatus for uniformly bonding a plurality of leads to associated bonding sites on at least one major surface of a workpiece without damage to the workpiece said workpiece having a major surface on two opposite sides of said workpiece, said apparatus comprising: means for engaging one of the major surfaces; a plurality of pads positioned at each bonding site for engaging the other major surface of said workpiece, said pads being individually displaceable to compensate for workpiece irregularities upon engagement of said means for engagement and said pads with said major surfaces to apply bonding pressure to the leads at said bonding sites; and means associated with said pads for distributing said bonding pressure equally to each of said pads to uniformly bond said leads to their associated bonding sites without workpiece damage.
Claim 2
Independent Claim
134 words
An apparatus for uniformly bonding a plurality of leads to associated bonding sites on at least one major surface of a workpiece without damage to the workpiece said workpiece having a major surface on two opposite sides of said workpiece, said apparatus comprising: means for engaging one of the major surfaces; a plurality of pads positioned at each bonding site for engaging the other major surface of said workpiece, said pads being individually displaceable to compensate for workpiece irregularities upon engagement of said means for engagement and said pads with said major surfaces to apply bonding pressure to the leads at said bonding sites; and means associated with said pads for distributing said bonding pressure equally to each of said pads to uniformly bond said leads to their associated bonding sites without workpiece damage.
Claim 3
Dependent Claim
28 words
The apparatus of claim 1 wherein said means for distributing said bonding pressure to said bonding pads is a viscous medium sealed in a chamber by a diaphragm.
Claim 4
Dependent Claim
13 words
The apparatus of claim 2 wherein said viscous medium is a heavY grease.
Claim 5
Dependent Claim
19 words
The apparatus of claim 3 wherein said means for engaging one of the major surfaces is a bonding tip.
Claim 6
Dependent Claim
10 words
The apparatus of claim 4 wherein said pads are pins.
Claim 7
Dependent Claim
14 words
The apparatus of claim 4 wherein each pair of said pads is a pontoon.
Claim 8
Dependent Claim
12 words
The apparatus of claim 2 wherein said viscous medium is molten solder.
Claim 9
Dependent Claim
19 words
The apparatus of claim 7 wherein said means for engaging one of the major surfaces is a supporting base.
Claim 10
Dependent Claim
10 words
The apparatus of claim 8 wherein said pads are pins.
Claim 11
Dependent Claim
14 words
The apparatus of claim 8 wherein each pair of said pads is a pontoon.
Claim 12
Dependent Claim
80 words
The apparatus of claim 1 wherein said means for distributing said bonding pressure to said bonding pads is a ductile material contained in a chamber, said pads are pins which directly engage said ductile material and an apertured plate which located and retains said pins with respect to said ductile material cooperates with said pins to seal said ductile material in said chamber, said ductile material acting as a fluid to equally distribute said bonding pressure to each bonding site.
Claim 13
Dependent Claim
19 words
The apparatus of claim 11 wherein said means for engaging one of the major surfaces is a bonding tip.
Claim 14
Dependent Claim
19 words
The apparatus of claim 11 wherein said means for engaging one of the major surfaces is a supporting base.
Claim 15
Independent Claim
103 words
An apparatus for bonding a plurality of leads to associated bonding sites on one major surface of a workpiece without damage to the workpiece, said workpiece having a major surface on two opposite sides of said workpiece said apparatus comprising: a plurality of pins for engaging one major surface of the workpiece, each of said pins engaging said major surface opposite a bonding site on the other major surface; and a bonding tip for applying pressure to each lead to bond the leads to their associated bonding sites, the bonding pressure compressing said pins within their elastic limits to compensate for workpiece irregularities.
Claim 16
Independent Claim
103 words
An apparatus for bonding a plurality of leads to associated bonding sites on one major surface of a workpiece without damage to the workpiece, said workpiece having a major surface on two opposite sides of said workpiece said apparatus comprising: a plurality of pins for engaging one major surface of the workpiece, each of said pins engaging said major surface opposite a bonding site on the other major surface; and a bonding tip for applying pressure to each lead to bond the leads to their associated bonding sites, the bonding pressure compressing said pins within their elastic limits to compensate for workpiece irregularities.
Claim 17
Independent Claim
114 words
An apparatus for bonding a plurality of leads to associated bonding sites on one major surface of a workpiece without damage to the workpiece, said workpiece, said workpiece having a major surface on two opposite sides of said workpiece, said apparatus comprising: a resilient mat; a plurality of pins supported on said resilient mat for engaging one major surface of the workpiece, each of said pins engaging said major surface opposite a bonding site on the other major surface; and a bonding tip for applying bonding pressure to each lead to bond the leads to their associated bonding sites, the bonding pressure displacing said pins into said resilient mat to compensate for workpiece irregularities.
Claim 18
Independent Claim
114 words
An apparatus for bonding a plurality of leads to associated bonding sites on one major surface of a workpiece without damage to the workpiece, said workpiece, said workpiece having a major surface on two opposite sides of said workpiece, said apparatus comprising: a resilient mat; a plurality of pins supported on said resilient mat for engaging one major surface of the workpiece, each of said pins engaging said major surface opposite a bonding site on the other major surface; and a bonding tip for applying bonding pressure to each lead to bond the leads to their associated bonding sites, the bonding pressure displacing said pins into said resilient mat to compensate for workpiece irregularities.
References Cited (Backward Citations)
US1453176A
Cited
US1872692A
Cited
GB388891A
Cited
US2040466A
Cited
US2960147A
Cited
US3440117A
Cited
US3483611A
Cited
US3433413A
Cited
US3547599A
Cited
US3448911A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1974-09-27 | 1975-03-29 | 1975-09-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-09-27 | 1979-03-29 | 1979-09-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-09-27 | 1983-03-29 | 1983-09-28 | $7700.00 | Window Closed / Lapsed |