US3913040A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microstrip carrier for high frequency semiconductor devices
Assignee: RCA Corp
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Filing: 1974-05-03
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Granted: 1975-10-14
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Expires: 1994-05-03
Abstract
Abstract An L-shaped thermally conductive substrate is adapted to be mounted in a microwave stripline circuit structure. Two semiconductor elements are mounted on the substrate, one on each leg of the L-shaped structure. The semiconductor elements are electrically interconnected in such a manner as to reduce parasitic reactances to a minimum.
Inventors
- 👤 Arye Rosen
- 👤 James Francis Reynolds
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 14:32
CPC Classifications
H; H03; H03F; H03F3/00; H03F3/04; H03F3/10; H10; H10W; H10W40/00; H10W40/10; H10W44/00; H10W44/20; H10W90/00; H10W72/00; H10W72/50; H10W72/531; H10W72/5363
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
188 words
A semiconductor device carrier comprising: a thermally conductive substrate, said substrate being substantially L-shaped having a pair of legs with iNtersecting inner surfaces; first and second semiconductor elements each element having two terminals, said first and second semiconductor elements generating heat when activated; said first and second semiconductor elements being mounted on the inner surface of the respective legs adjacent the intersection of said inner surfaces and so arranged that a selected terminal of said first semiconductor elements is physically proximate to a selected terminal of said second semiconductor elements, said substrate being a heat sink for said heat generated by said elements conducting said heat away from said first semiconductor element in a first heat conductivity envelope defining a first portion of said substrate and away from said second semiconductor element in a second heat conductivity envelope defining a second portion of said substrate; and a short, direct electrical connection between said selected terminal of said first element and said selected terminal of said second element; whereby the respective heat conductivity envelopes do not substantially overlap and parasitic reactances associated with said electrical connection are substantially minimized.
Claim 2
Dependent Claim
188 words
A semiconductor device carrier comprising: a thermally conductive substrate, said substrate being substantially L-shaped having a pair of legs with iNtersecting inner surfaces; first and second semiconductor elements each element having two terminals, said first and second semiconductor elements generating heat when activated; said first and second semiconductor elements being mounted on the inner surface of the respective legs adjacent the intersection of said inner surfaces and so arranged that a selected terminal of said first semiconductor elements is physically proximate to a selected terminal of said second semiconductor elements, said substrate being a heat sink for said heat generated by said elements conducting said heat away from said first semiconductor element in a first heat conductivity envelope defining a first portion of said substrate and away from said second semiconductor element in a second heat conductivity envelope defining a second portion of said substrate; and a short, direct electrical connection between said selected terminal of said first element and said selected terminal of said second element; whereby the respective heat conductivity envelopes do not substantially overlap and parasitic reactances associated with said electrical connection are substantially minimized.
Claim 3
Dependent Claim
77 words
A semiconductor device carrier in accordance with claim 1 in which said substrate is electrically conductive and one of said semiconductor elements is mounted on a standoff, said standoff comprising a thermally conductive dielectric platform member having a lower surface which is bonded to the inner surface of one leg of said substrate adjacent the intersection and an upper surface having a metal layer coated thereon to which said first semiconductor element is mechanically and electrically connected.
Claim 4
Dependent Claim
160 words
A semiconductor device carrier comprising: an electrically and thermally conductive substrate, said substrate being substantially L-shaped having a pair of legs with intersecting inner surfaces; a thermally conductive dielectric platform member having a lower surface bonded to the inner surface of one leg of said substrate adjacent to the intersection of inner surfaces and an upper surface having a metal layer coated thereon; first and second semiconductor elements, said first semiconductor element being mechanically and electrically connected to said upper surface of said dielectric platform member, and said second semiconductor element being mounted on the inner surface of the other leg of said substrate adjacent to the intersection of inner surfaces; and common input/output means, said common input/output means including a transmission line segment mounted directly on the inner surface of said one leg adjacent the standoff away from the intersection, said transmission line segment including a metal layer and a dielectric member spacing the metal layer from said substrate.
Claim 5
Dependent Claim
160 words
A semiconductor device carrier comprising: an electrically and thermally conductive substrate, said substrate being substantially L-shaped having a pair of legs with intersecting inner surfaces; a thermally conductive dielectric platform member having a lower surface bonded to the inner surface of one leg of said substrate adjacent to the intersection of inner surfaces and an upper surface having a metal layer coated thereon; first and second semiconductor elements, said first semiconductor element being mechanically and electrically connected to said upper surface of said dielectric platform member, and said second semiconductor element being mounted on the inner surface of the other leg of said substrate adjacent to the intersection of inner surfaces; and common input/output means, said common input/output means including a transmission line segment mounted directly on the inner surface of said one leg adjacent the standoff away from the intersection, said transmission line segment including a metal layer and a dielectric member spacing the metal layer from said substrate.
Claim 6
Dependent Claim
36 words
A semiconductor device carrier in accordance with claim 3 in which each of said semiconductor elements comprises a diode having an anode electrode and a cathode electrode, said diodes being adapted to operate at microwave frequencies.
Claim 7
Dependent Claim
44 words
A semiconductor device carrier in accordance with claim 4 in which said diodes are electrically connected in series, the anode electrode of one diode being electrically connected to the cathode electrode of the other diode through the metal layer of said dielectric platform member.
Claim 8
Dependent Claim
30 words
A semiconductor device carrier in accordance with claim 5 in which said series connected diodes are electrically connected between the metal layer of said transmission line segment and the substrate.
Claim 9
Dependent Claim
25 words
A semiconductor device carrier in accordance with claim 6 having a means whereby a reverse signal can be applied across the electrodes of said diodes.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-10-13 | 1979-04-14 | 1979-10-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-10-13 | 1983-04-14 | 1983-10-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-10-13 | 1987-04-14 | 1987-10-14 | $7700.00 | Window Closed / Lapsed |