Heat sink for microstrip circuit

Claim 1

AN INDIVUAL HEAT SINK FOR A SOLID STATE DIODE IN A MICROWAVE STRIPLING CIRCUIT, SAID DIODE BEING IN A STANDARD PACKAGE OF THE TYPE IN WHICH ONE DIODE TERMINAL IS A CONDUCTIVE CAP. AND THE OTHER A CONDUCTIVE THREADED STUD CONCRETIC WITH THE THE FORM OF A CONDUCTIVE GROUND PLANE, A LAYER OF INSULATION OVER THE GROND PLANE, A LAYER OF INSULATION OVER THE GROUND PLANE AND A CONDUCTIVE STRIP OF INSULATION, SAID HEAT SINK COMPRISING: A BODY MADE OF A MATERIAL OF GOOD HEAT AND ELECTRICAL CONDUCTITY IN THE FORM OF A HOLLOW EXTERMALLY THREADED CYCLINDER WITH END CLOSURES FORMING A CAVITY, ONE END CLOSURE BEING IN THE FORM OF A TRUNCATED CONE HAVING AT THE CENTRE OF ITS FLAP TOP A BLIND HOLE TAPPED TO RECEIVE THE THREADED STUD OF THE DIODE PACKAGE AND THE OTHER END CLOSURE CONTAINING INLET AND OUTLET CONDUITS FOR THE PASSAGE OF A LOQUID COOLANT THROUGH SAID CAVITY, AND A HOLDER ATTACHED TO THE STRIP-LINE STRUCTURE BENEATH THE GROUND PLANE, SAID HOLDER HAVING A CIRCULAR OPENING WITH AXIS NORMAL TO THE GROUNDPLANE AND THREADED TO RECEIVE THE IXTERNALLY THREADED HEAT SINK BODY, WHEREBY SAID BODY MAY BE SCREWED INTO SAID HOLDER WITH ITS TRUNCATED END FACING SAID GROUND PLANE UNTIL THE TRUNCATED ENDS IS IN CONTACT WITH THE GROUND PLANE, AND WHEREBY SAID DIODE PACKAGE MAY BE SCREWED INTO THE TRUNCATED END OF SAID BODY THROUGH ALIGNED HOLES IN THE CONDUCTIVE STRIP INSULATION, AND GROUND PLANE OF THE STRIPLINE STRUCTURE, WHICH HOLES ARE LARGER IN DIAMETER THAN SAID STUD BUT SMALLER THAN SAID CAP, UNTIL THE STRIPLINE STRUCTURE IS COMPRESSED BETWEEN THE CAP OF THE DIODE PACKAGE AND THE TRUNCATED END OF SAID HEAT SINK BODY TO PROVIDE GOOD ELECTRICAL CONTACT BETWEEN THE STRIPLINE AND THE DIODE TERMINALS.