US3897628A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a thin piezoelectric body metallically bonded to a propagation medium crystal
Assignee: RCA Corp
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Filing: 1973-11-19
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Granted: 1975-08-05
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Expires: 1993-11-19
Abstract
Abstract One surface of a piezoelectric body is polished free of surface defects. A metallic film is deposited on the damage free surface of the piezoelectric body and on one surface of a propagation medium crystal. The film surfaces of the piezoelectric body and the propagation medium crystal are bonded together. The piezoelectric body is thinned to final thickness by ion beam milling.
Inventors
- 👤 Joseph J Hanak
- 👤 David Michael Stevenson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 23:27
CPC Classifications
H; H10; H10N; H10N30/00; H10N30/01; H10N30/06; Y; Y10; Y10T; Y10T29/00; Y10T29/42
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
116 words
A METHOD OF FORMING A THIN BODY OF PIEZOELECTRIC MATERIAL BONDED TO A PROPAGATION MEDIUM CRYSTAL WHILE MAINTAINING THE BULK PROPERTIES OF SAID PIEXOELECTRIC MATERIAL COMPRISING THE STEPS OF: A. PROVIDING A BODY OF PIEXOELECTRIC MATERIAL, SAID BODY HAVING SURFACE DEFECTS IN AT LEAST ONE SURFACE, B. POLISHING SAID ONE SURFACE OF SAID PIEZOELECTRIC BODY UNTIL SUBSTANTIALLY ALL SURFACE DEFECTS ARE REMOVED, C. DEPOSITING A METALLIC FILM ON SAID POLISHED SURFACE OF SAID PIEXOELECTRIC BODY AND ON ONE SURFACE OF SAID PROPAGATION MEDIUM CRYSTAL, THEN D. BONDING SAID METALLIZED SURFACE OF SAID PIEZOELECTRIC BODY TO SAID METALLIZED SURFACE OF SAID PROPAGATION MEDIUM CRYSTAL, AND THEN E. THINNING SAID PIEXOELECTRIC BODY, SAID THINNING INCLUDING ION BEAM MILLING.
Claim 2
Independent Claim
116 words
A METHOD OF FORMING A THIN BODY OF PIEZOELECTRIC MATERIAL BONDED TO A PROPAGATION MEDIUM CRYSTAL WHILE MAINTAINING THE BULK PROPERTIES OF SAID PIEXOELECTRIC MATERIAL COMPRISING THE STEPS OF: A. PROVIDING A BODY OF PIEXOELECTRIC MATERIAL, SAID BODY HAVING SURFACE DEFECTS IN AT LEAST ONE SURFACE, B. POLISHING SAID ONE SURFACE OF SAID PIEZOELECTRIC BODY UNTIL SUBSTANTIALLY ALL SURFACE DEFECTS ARE REMOVED, C. DEPOSITING A METALLIC FILM ON SAID POLISHED SURFACE OF SAID PIEXOELECTRIC BODY AND ON ONE SURFACE OF SAID PROPAGATION MEDIUM CRYSTAL, THEN D. BONDING SAID METALLIZED SURFACE OF SAID PIEZOELECTRIC BODY TO SAID METALLIZED SURFACE OF SAID PROPAGATION MEDIUM CRYSTAL, AND THEN E. THINNING SAID PIEXOELECTRIC BODY, SAID THINNING INCLUDING ION BEAM MILLING.
Claim 3
Dependent Claim
42 words
The method of claim 1 wherein said polishing includes bringing said surface of said piezoelectric body into contact with precipitated colloidal silica slurried in water in an alkaline solution, wherein said colloidal silica is slid over said surface of said piezoelectric body.
Claim 4
Dependent Claim
33 words
The method of claim 2 wherein prior to said polishing in said solution, said surface of said body is lapped with abrasive powder and then diamond polished with consecutively smaller sized abrasive particles.
Claim 5
Dependent Claim
32 words
The method of claim 3 wherein prior to said ion beam milling, said piezoelectric body is thinned by lapping with abrasive powder and then diamond polished with consecutively smaller sized abrasive particles.
Claim 6
Dependent Claim
19 words
The method of claim 4 wherein said piezoelectric body is thinned to a thickness no less than 0.1 microns.
Claim 7
Independent Claim
100 words
A method of forming a thin body of single crystalline material bonded to a substrate while retaining the bulk properties of said material comprising the steps of: a. polishing one of the surfaces of said body to remove surface defects in which said polishing includes bringing said surface of said body into contact with precipitated colloidal silica slurried in water in an alkaline solution, wherein said colloidal silica is slid over said surface of said body, then b. bonding said polished surface of said body to said substrate, and then c. thinning said body, said thinning including ion beam milling.
Claim 8
Independent Claim
100 words
A method of forming a thin body of single crystalline material bonded to a substrate while retaining the bulk properties of said material comprising the steps of: a. polishing one of the surfaces of said body to remove surface defects in which said polishing includes bringing said surface of said body into contact with precipitated colloidal silica slurried in water in an alkaline solution, wherein said colloidal silica is slid over said surface of said body, then b. bonding said polished surface of said body to said substrate, and then c. thinning said body, said thinning including ion beam milling.
Claim 9
Dependent Claim
32 words
The method of claim 6 wherein prior to polishing in said solution, said surface of said body is lapped with abrasive powder and then diamond polished with consecutively Smaller sized abrasive particles.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-08-04 | 1979-02-03 | 1979-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-08-04 | 1983-02-03 | 1983-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-08-04 | 1987-02-03 | 1987-08-05 | $7700.00 | Window Closed / Lapsed |