Abstract A bipolar power transistor in which the emitter region is composed of a plurality of segments radiating from a central area. Each segment has a tree-like configuration and comprises a trunk with pairs of lateral branches extending from opposite sides thereof. Each trunk terminates at the outer periphery with a relatively large area, high current bonding pad. The device includes a base region having segments of complementary shape, each including a trunk and lateral branches interdigitated with the emitter branches. The device also has an emitter contact electrode comprising a metal plate suspended above the transistor surface, the plate making a high-current connection to each emitter segment only at each bonding pad. The plate has a central aperture through which a base contact electrode extends.
A transistor comprising: a. a wafer of semiconducting material including emitter, base and collector regions; b. said emitter region being of one conductivity type and being disposed adjacent a surface of said wafer, said emitter region being composed of a plurality of separate portions each of which comprises a trunk with pairs of lateral branches extending from a central area of said surface and said branches being of progressively increasing length toward the periphery of said surface; c. a bonding pad at the periphery of each said trunk; d. a base region of opposite conductivity type also adjacent said wafer surface, said base portion including said central surface area and having branches interdigitated with said emitter region branches; e. an emitter contact electrode comprising a metal plate suspended above said wafer surface, said plate being connected only to each of said bonding pads, said plate having a central aperture, and; f. a base contact electrode extending through said aperture connected to said central area base region portion.
Claim 2
Dependent Claim
167 words
A transistor comprising: a. a wafer of semiconducting material including emitter, base and collector regions; b. said emitter region being of one conductivity type and being disposed adjacent a surface of said wafer, said emitter region being composed of a plurality of separate portions each of which comprises a trunk with pairs of lateral branches extending from a central area of said surface and said branches being of progressively increasing length toward the periphery of said surface; c. a bonding pad at the periphery of each said trunk; d. a base region of opposite conductivity type also adjacent said wafer surface, said base portion including said central surface area and having branches interdigitated with said emitter region branches; e. an emitter contact electrode comprising a metal plate suspended above said wafer surface, said plate being connected only to each of said bonding pads, said plate having a central aperture, and; f. a base contact electrode extending through said aperture connected to said central area base region portion.
Claim 3
Dependent Claim
21 words
A transistor according to claim 1, wherein each said bonding pad is coterminous with the outermost branches of each said trunk.
Claim 4
Dependent Claim
29 words
A transistor according to claim 2, in which said emitter is composed of four separate segments each of which is located in a different quarter of said wafer surface.
Claim 5
Dependent Claim
15 words
A transistor according to claim 3, in which said emitter region is a mesa type.
Claim 6
Dependent Claim
17 words
A transistor according to claim 4, in which said emitter and base regions are metallized with solder.