US3883945A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for transferring and joining beam leaded chips
Assignee: Duracell Inc USA
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Filing: 1974-03-13
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Granted: 1975-05-20
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Expires: 1994-03-13
Abstract
Abstract Beam leaded semiconductive chips are retrieved from a tight matrix by applying a partial vacuum to a chip through a tube that is slidable in a sleeve of the transferring and joining device, the chip then being transferred to and joined to a circuit board.
Inventors
- 👤 George Wallis
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 12:59
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W99/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
132 words
A method of transferring semiconductive chips from a backing disc and joining them to a substrate comprising: A. providing: a. a heated sleeve b. a tube slideably carried in a bore of said sleeve, c. means applying a partial vacuum to said tube, and B. retrieving said semiconductive chips from said backing disc and joining them to a circuit board by: a. positioning said sleeve in a line with a chip, b. advancing said tube beyond an end of said sleeve to engage said chip c. applying a vacuum pressure to said tube to hold said chip against an end of said tube; d. transferring said chip to align it with said substrate, e. retracting said tube to hold said chip against said sleeve, and f. joining said chip to said substrate.
Claim 2
Independent Claim
132 words
A method of transferring semiconductive chips from a backing disc and joining them to a substrate comprising: A. providing: a. a heated sleeve b. a tube slideably carried in a bore of said sleeve, c. means applying a partial vacuum to said tube, and B. retrieving said semiconductive chips from said backing disc and joining them to a circuit board by: a. positioning said sleeve in a line with a chip, b. advancing said tube beyond an end of said sleeve to engage said chip c. applying a vacuum pressure to said tube to hold said chip against an end of said tube; d. transferring said chip to align it with said substrate, e. retracting said tube to hold said chip against said sleeve, and f. joining said chip to said substrate.
Claim 3
Dependent Claim
25 words
A method according to claim 1 wherein said substrate is a circuit board having electrically conductive paths, and said chip is aligned with said paths.
Claim 4
Dependent Claim
18 words
A method according to claim 1 wherein said chip is joined to said substrate through heat and pressure.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-05-19 | 1978-11-18 | 1979-05-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-05-19 | 1982-11-18 | 1983-05-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-05-19 | 1986-11-18 | 1987-05-20 | $7700.00 | Window Closed / Lapsed |