US3883352A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for forming a photocured solder resist
Assignee: WR Grace and Co
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Filing: 1974-05-03
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Granted: 1975-05-13
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Expires: 1994-05-03
Abstract
Abstract This invention relates to a heat and solder resistant solid photopolymer composition which can be imaged and developed and a process of using same. The solder resistant photocurable composition consists essentially of a solid diallyl phthalate prepolymer, i.e. poly-(diallyl orthophthalate) and a liquid polyene and polythiol. The solid composition when applied to a printed circuit board and cured imagewise in the presence of a free radical generator permits passage of the board through a bath of molten solder to secure electrical components thereto. When the free radical generator is actinic radiation, e.g., UV light, a curing rate accelerator, e.g., benzophenone is usually added to the composition.
Inventors
- 👤 Harold A Kloczewski
- 👤 William R Schaeffer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 11:53
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/027; G03F7/0275; C; C08; C08G; C08G75/00; C08G75/02; C08G75/04; C08G75/045; C08G75/12; Y; Y10; Y10S; Y10S430/00; Y10S430/1053; Y10S430/1055; Y10S430/114; Y10S430/124; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142; Y10T29/49155; Y10T29/49156
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
96 words
A PROCESS FOR FORMING A PHOTOCURED SOLDER RESIST ON AT LEAST ONE SURFACE OF A SUBSTRATE WHICH COMPRISES: A. APPLYING TO SAID SURFACE, A LAYER OF A SOLID PHOTOCURABLE SOLDER RESIST COMPOSITION CONSISTING ESSENTIALLY OF: 1. 5 TO 40 PARTS BY WEIGHT OF A POLYTHIOL CONTAINING AT LEAST TWO THIOL GROUPS PER MOLECULE; 2. 60 TO 95 PARTS BY WEIGHT OF POLY-(DIALLYL ORTHOPHTHALATE), THE SUM OF (1) AND (2) BEING 100 PARTS BY WEIGHT; 3. 1 TO 20 PARTS BY WEIGHT BASED ON THE WEIGHT OF (1) AND (2) OF A LIQUID POLYENE OF THE FORMULA:
Claim 2
Dependent Claim
96 words
A PROCESS FOR FORMING A PHOTOCURED SOLDER RESIST ON AT LEAST ONE SURFACE OF A SUBSTRATE WHICH COMPRISES: A. APPLYING TO SAID SURFACE, A LAYER OF A SOLID PHOTOCURABLE SOLDER RESIST COMPOSITION CONSISTING ESSENTIALLY OF: 1. 5 TO 40 PARTS BY WEIGHT OF A POLYTHIOL CONTAINING AT LEAST TWO THIOL GROUPS PER MOLECULE; 2. 60 TO 95 PARTS BY WEIGHT OF POLY-(DIALLYL ORTHOPHTHALATE), THE SUM OF (1) AND (2) BEING 100 PARTS BY WEIGHT; 3. 1 TO 20 PARTS BY WEIGHT BASED ON THE WEIGHT OF (1) AND (2) OF A LIQUID POLYENE OF THE FORMULA:
Claim 3
Dependent Claim
20 words
60 to 95 parts by weight of poly-(diallyl orthophthalate), the sum of (1) and (2) being 100 parts by weight;
Claim 4
Dependent Claim
20 words
60 to 95 parts by weight of poly-(diallyl orthophthalate), the sum of (1) and (2) being 100 parts by weight;
Claim 5
Dependent Claim
12 words
The process according to claim 1 wherein the substrate has holes therethrough.
Claim 6
Dependent Claim
35 words
The process according to claim 2 including the additional steps of passing the leads of electrical components through the holes in the substrate where desired and soldering said components to said substrate with molten solder.
Claim 7
Dependent Claim
21 words
1 to 20 parts by weight based on the weight of (1) and (2) of a liquid polyene of the formula:
Claim 8
Dependent Claim
21 words
1 to 20 parts by weight based on the weight of (1) and (2) of a liquid polyene of the formula:
Claim 9
Dependent Claim
52 words
0.05 to 10 parts by weight based on the weight of (1) and (2) of a photocuring rate accelerator, B. exposing said composition imagewise to actinic radiation for a time sufficient to insolubilize the exposed portion of said composition and C. removing the unexposed photocurable composition from the surface of said substrate.
Claim 10
Dependent Claim
52 words
0.05 to 10 parts by weight based on the weight of (1) and (2) of a photocuring rate accelerator, B. exposing said composition imagewise to actinic radiation for a time sufficient to insolubilize the exposed portion of said composition and C. removing the unexposed photocurable composition from the surface of said substrate.
Claim 11
Dependent Claim
52 words
0.05 TO 10 PARTS BY WEIGHT BASED ON THE WEIGHT OF (1) AND (2) OF A PHOTOCURING RATE ACCELERATOR, B. EXPOSING SAID COMPOSITION IMAGEWISE TO ACETINIC RADIATION FOR A TIME SUFFICIENT TO INSOLUBLIZE THE EXPOSED PORTION OF SAID COMPOSITION AND C. REMOVING THE UNEXPOSED PHOTOCURABLE COMPOSITION FROM THE SURFACE OF SAID SUBSTRATE.
Claim 12
Dependent Claim
52 words
0.05 TO 10 PARTS BY WEIGHT BASED ON THE WEIGHT OF (1) AND (2) OF A PHOTOCURING RATE ACCELERATOR, B. EXPOSING SAID COMPOSITION IMAGEWISE TO ACETINIC RADIATION FOR A TIME SUFFICIENT TO INSOLUBLIZE THE EXPOSED PORTION OF SAID COMPOSITION AND C. REMOVING THE UNEXPOSED PHOTOCURABLE COMPOSITION FROM THE SURFACE OF SAID SUBSTRATE.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-05-12 | 1978-11-11 | 1979-05-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-05-12 | 1982-11-11 | 1983-05-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-05-12 | 1986-11-11 | 1987-05-13 | $7700.00 | Window Closed / Lapsed |