US3881241A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Galvano-magneto effect device
Assignee: Denki Onkyo Co Ltd
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Filing: 1972-07-21
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Granted: 1975-05-06
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Expires: 1992-07-21
Abstract
Abstract A galvano-magneto effect device comprised of a semiconductor element and lead frames, the element being provided with electrodes which are coated with a thermally fusible conductive material and are formed at the terminal sections of the element and the conductive lead frames being made by reducing the thickness of the end portions which are to be coupled to the electrodes and coating them with a thermally fusible conductive material.
Inventors
- 👤 Noboru Masuda
- 👤 Hisashi Takiguchi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 12:11
CPC Classifications
H; H10; H10N; H10N50/00; H10N50/80; H10N52/00; H10N52/80; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49082
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
183 words
A method of connecting a lead frame to a semiconductor element comprising: a. positioning in parallel a pair of unconnected lead frame plates, each lead frame plate having a base and a plurality of lead frames extending therefrom forming a comb type structure, wherein said positioning includes positioning said bases in parallel with said lead frame extending towards each other, the extended ends of each said lead frame on one of said lead frame plates being positioned at a predetermined distance from the corresponding lead frame on the other of said lead frame plates; b. providing a plurality of magneto-resistance efFect elements with each element having at least a pair of electrodes, placing each magneto-resistance element between the extended ends of a pair of opposed lead frames of said pair of lead frame plates with each electrode of said pair of electrodes of each element contacting a different one of said pair of opposed lead frames; and c. heating the extended ends of said lead frames to bond said extended ends to the electrodes of said pair of electrodes of said magneto-resistance elements.
Claim 2
Independent Claim
183 words
A method of connecting a lead frame to a semiconductor element comprising: a. positioning in parallel a pair of unconnected lead frame plates, each lead frame plate having a base and a plurality of lead frames extending therefrom forming a comb type structure, wherein said positioning includes positioning said bases in parallel with said lead frame extending towards each other, the extended ends of each said lead frame on one of said lead frame plates being positioned at a predetermined distance from the corresponding lead frame on the other of said lead frame plates; b. providing a plurality of magneto-resistance efFect elements with each element having at least a pair of electrodes, placing each magneto-resistance element between the extended ends of a pair of opposed lead frames of said pair of lead frame plates with each electrode of said pair of electrodes of each element contacting a different one of said pair of opposed lead frames; and c. heating the extended ends of said lead frames to bond said extended ends to the electrodes of said pair of electrodes of said magneto-resistance elements.
Claim 3
Dependent Claim
30 words
The method of claim 1 including coating the electrode portion of said magneto-resistance element with a thermally fusible conductive material prior to placing said magneto-resistance elements between said lead frames.
Claim 4
Dependent Claim
31 words
The method of claim 2 including coating the extended ends of said lead frames with a thermally fusible conductive material prior to placing said pair of lead frame plates in parallel.
Claim 5
Dependent Claim
91 words
The method of claim 3 including: a. after said heating, separating the base from the lead frames on one of said pair of lead frame plates thereby forming a free end on each of said separated lead frames; b. connecting one terminal of a power supply to the base plate of the other of said pair of lead frame plates; c. sequentially connecting the other terminal of said power supply to the free end of each lead frame; and d. sequentially measuring the electrical characteristics of each of said magneto-resistance devices.
Claim 6
Dependent Claim
16 words
The method of claim 1 including forming an identification symbol on each of said lead frames.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-05-05 | 1978-11-04 | 1979-05-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-05-05 | 1982-11-04 | 1983-05-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-05-05 | 1986-11-04 | 1987-05-06 | $7700.00 | Window Closed / Lapsed |