US3877065A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor arrangement
Assignee: Semikron GmbH and Co KG
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Filing: 1973-07-30
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Granted: 1975-04-08
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Expires: 1993-07-30
Abstract
Abstract A semiconductor arrangement including a carrier plate which is provided w a slit-shaped recess for receiving the semiconductor wafer. The semiconductor wafer has a solderable contact electrode on each of its major surfaces and an elastic protective lacquer coating around its peripheral surface. The semiconductor wafer is arranged within the recess such that its major surface intersects the plane of the carrier plate and the protective coating of the semiconductor wafer contacts the end surfaces of the recess so as to hold the semiconductor wafer in place. Metal contacts which lie along the planar surface of the carrier plate and border the longitudinal edges of the recess connect the semiconductor wafer in a desired electrical arrangement.
Inventors
- 👤 Liboslav Vladik
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 12:35
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W90/00; Y; Y10; Y10S; Y10S257/00; Y10S257/909
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
145 words
In a semiconductor arrangement including at least one semiconductor wafer, a carrier plate of insulating material for supporting the semiconductor wafer and metal contacts for connecting the semiconductor wafer in a desired electrical arrangement, the improvement wherein: said carrier plate has at least one slit-shaped recess; said semiconductor wafer has a solderable contact electrode on each of its major surfaces and an elastic protective lacquer coating around its peripheral surface for stabilizing such surface; said semiconductor wafer is arranged within said recess such that its major surfaces intersect the plane of said carrier plate and the protective coating of said semiconductor wafer contacts the end surfaces of said recess so as to hold said semiconductor wafer in place; and said metal contacts are metal layers which lie parallel to the planar surface of said carrier plate and which border the longitudinal edges of said recess.
Claim 2
Dependent Claim
145 words
In a semiconductor arrangement including at least one semiconductor wafer, a carrier plate of insulating material for supporting the semiconductor wafer and metal contacts for connecting the semiconductor wafer in a desired electrical arrangement, the improvement wherein: said carrier plate has at least one slit-shaped recess; said semiconductor wafer has a solderable contact electrode on each of its major surfaces and an elastic protective lacquer coating around its peripheral surface for stabilizing such surface; said semiconductor wafer is arranged within said recess such that its major surfaces intersect the plane of said carrier plate and the protective coating of said semiconductor wafer contacts the end surfaces of said recess so as to hold said semiconductor wafer in place; and said metal contacts are metal layers which lie parallel to the planar surface of said carrier plate and which border the longitudinal edges of said recess.
Claim 3
Dependent Claim
51 words
A semiconductor arrangement as defined in claim 1 wherein said carrier plate has a plurality of said recesses; there are a plurality of said semiconductor wafers, each arranged within a corresponding one of said recesses; and said metal contacts electrically connect all of said semiconductor wafers in the desired electrical arrangement.
Claim 4
Dependent Claim
58 words
A semiconductor arrangement as defined in claim 2 wherein said recesses are successively arranged along and transverse to a common longitudinal axis of said carrier plate; a further recess extending along said longitudinal axis interconnecting said slit-shaped recesses; and said metal contacts which are between the successive said semiconductor wafers are metal solder bars produced by immersion soldering.
Claim 5
Dependent Claim
36 words
A semiconductor arrangement as defined in claim 1 wherein said carrier plate is made of a synthetic material and said metal contacts are formed by metallization of copper on the planar surface of said carrier plate.
Claim 6
Dependent Claim
18 words
A semiconductor arrangement as defined in claim 1 wherein said carrier plate is made of a ceramic material.
Claim 7
Dependent Claim
16 words
A semiconductor arrangement as defined in claim 5 wherein said recess passes through said carrier plate.
Claim 8
Dependent Claim
21 words
A semiconductor arrangement as defined in claim 1 wherein said at least one recess is closed at both of its ends.
Claim 9
Dependent Claim
15 words
A semiconductor arrangement as defined in claim 1 wherein said semiconductor wafers are semiconductor rectifiers.
Claim 10
Dependent Claim
27 words
A semiconductor arrangement as defined in claim 2 wherein: each of said semiconductor arrangements is a semiconductor rectifier; and said metal contacts connect said rectifiers in series.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-04-07 | 1978-10-07 | 1979-04-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-04-07 | 1982-10-07 | 1983-04-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-04-07 | 1986-10-07 | 1987-04-08 | $7700.00 | Window Closed / Lapsed |