Method for producing metal structures upon semiconductor surfaces

Abstract

Abstract The invention describes a method of producing fine structures, preferably those consisting of a metal coating, upon semiconductor surfaces. More particularly, the invention relates to a method of producing metal layers upon semiconductor surfaces thus providing contact areas on semiconductor circuit components. The metal coating covers the entire area of surface to be processed. According to conventional planar technique, the coated area is subsequently covered by a suitable photovarnish upon which the desired structure or configuration is impressed by photographic exposure and development of the photovarnish. The non-exposed areas of the metal coating are thereafter dissolved. According to the present invention, the metal deposition, initially covering the entire area of the surface to be processed, is given an addition of at least one metal which reduces the etching time required for subsequently eliminating the area portions not covered by the etching mask. This also stabilizes the semiconductor surface.

Inventors

• 👤 Helmuth Murrmann

Bibliographic Details