Patent US3871936A successfully refreshed from Google Patents.
US3871936A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Loading of compliant tape
Assignee: AT&T Inc
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Filing: 1973-08-24
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Granted: 1975-03-18
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Expires: 1993-08-24
Abstract
Abstract Beam lead semiconductor devices are loaded onto an apertured compliant-bonding tape and held thereto with a releasable adhesive. The apertured tape is successively indexed through a loading machine. At one station, small accurately located dots of adhesive are applied to the tape. At a transfer station, integrated-circuit chips are pressed against the tape so that beam leads are secured to the dots of adhesive. Integratedcircuit chips are brought to the transfer station in springbiased holding nests mounted on an indexable turret. The compliant tape is embossed to form protective pockets therein so that when integrated-circuit chips are loaded onto the tape, subsequent winding of the tape onto a reel will not damage the chips.
Inventors
- 👤 John A Boyer
- 👤 David P Ludwig
- 👤 Friedrich Zwickel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 09:27
CPC Classifications
H; H05; H05K; H05K13/00; H05K13/003; B; B65; B65D; B65D73/00; B65D73/02; Y; Y10; Y10T; Y10T156/00; Y10T156/10; Y10T156/1089; Y10T156/109; Y10T156/1092; Y10T156/1097; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
247 words
A method of loading beam-lead devices onto successive selected portions of a continuous tape, each such portion having an aperture for receiving a device and an embossed configuration about the periphery of the aperture, the method comprising the steps of: moving at least two device receiving members between a remote location and a device transfer station: sequentially placing a device into each receiving member upon such member having been moved to the remote location; indexing the tape in seqquence past an adhesive applicator station and the transfer station, such indexing taking place simultaneously with the movement of one of the receiving members to the transfer station; precisely aligning the aperture of one of the selected portions with the applicator station and the aperture of another of the selected portions with the device in the receiving member at the transfer station; applying an adhesive to the embossed configuration in a peripheral pattern about the aperture, upon such aperture of each successive selected portion of the tape being precisely aligned with the applicator station; and displacing the device in the receiving member at the transfer station and the selected portion of the tape in alignment therewith relative to each other to insert the device into the aperture and the beam-leads thereof into the embossed configuration and to contact at least some of the beam-leads of the device to the adhesive thereat, whereby the beam-leads of the device are secured to the adhesive and loading of the tape is accomplished.
Claim 2
Independent Claim
247 words
A method of loading beam-lead devices onto successive selected portions of a continuous tape, each such portion having an aperture for receiving a device and an embossed configuration about the periphery of the aperture, the method comprising the steps of: moving at least two device receiving members between a remote location and a device transfer station: sequentially placing a device into each receiving member upon such member having been moved to the remote location; indexing the tape in seqquence past an adhesive applicator station and the transfer station, such indexing taking place simultaneously with the movement of one of the receiving members to the transfer station; precisely aligning the aperture of one of the selected portions with the applicator station and the aperture of another of the selected portions with the device in the receiving member at the transfer station; applying an adhesive to the embossed configuration in a peripheral pattern about the aperture, upon such aperture of each successive selected portion of the tape being precisely aligned with the applicator station; and displacing the device in the receiving member at the transfer station and the selected portion of the tape in alignment therewith relative to each other to insert the device into the aperture and the beam-leads thereof into the embossed configuration and to contact at least some of the beam-leads of the device to the adhesive thereat, whereby the beam-leads of the device are secured to the adhesive and loading of the tape is accomplished.
Claim 3
Dependent Claim
46 words
The method of claim 1 wherein: the application of adhesive is performed on an upwardly facing surface of the tape and the transfer of the device is accomplished against a downwardly facing surface, such a result being achieved by inverting the tape during the translation thereof.
Claim 4
Independent Claim
94 words
A method of handling beam-lead semiconductor devices which comprises the steps of: aligning the devices to cavities formed in a tape, the beamleads of the devices extending over the periphery of the cavities to align with pocket-like depressions in the tape located about each of the cavities; adhesively securing beam leads of the devices to the pocket-like depressions, thereby suspending the devices in the cavities; and reeling the loaded tape to provide a compact and damagepreventing package, said cavities and depressions forming protective barriers for the devices and their beam-leads in the reeled package.
Claim 5
Independent Claim
94 words
A method of handling beam-lead semiconductor devices which comprises the steps of: aligning the devices to cavities formed in a tape, the beamleads of the devices extending over the periphery of the cavities to align with pocket-like depressions in the tape located about each of the cavities; adhesively securing beam leads of the devices to the pocket-like depressions, thereby suspending the devices in the cavities; and reeling the loaded tape to provide a compact and damagepreventing package, said cavities and depressions forming protective barriers for the devices and their beam-leads in the reeled package.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1978-03-17 | 1978-09-16 | 1979-03-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1982-03-17 | 1982-09-16 | 1983-03-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1986-03-17 | 1986-09-16 | 1987-03-18 | $7700.00 | Window Closed / Lapsed |