Method for making ceramic-metal structures

Claim 2

IN THE MANUFACTURE OF COMPOSITE STRUCTURES FOR USE AS MULTI-LAYERED COMPONENTS OF A HERMETIC PACKAGE FROM DIELECTRIC CERAMIC SUCH AS THOSE COMPOSED MAINLY OF ALUMINA MIXED WITH PLASTICIZERS, BINDERS AND SOLVENTS FOR SAID PLASTICIZERS AND FROM A PASTE OF POWDERED METAL SELECTED FROM THE GROUP COMPOSED OF TUNGSTEN, MOLYBDENUM, MANGANESE OR MIXTURES THEREOF, THE METHOD WHICH COMPRISES THE STEPS OF DEPOSITING SAID PASTE UPON A TRANSPORT FILM TO FORM A THIN PREDETERMINED METALIC PATTERN THEREON, DRYING SAID METALLIC PATTERN, APPLYING A THICK BODY OF SAID CERAMIC OVER SAID METALLIC PATTERN AND UPON SAID TRANSPORT FILM, DRYING SAID CERAMIC BODY TO FORM A GREEN COMPOSITE STRUCTURE, AND FIRING SAID GREEN COMPOSITE STRUCTURE AT A TEMPERATURE HIGHER THAN APPROXIMATELY 1.600*C TO VITRIFY SAID CERAMIC AND BOND SAID METAL HERMETICALLY TO SAID CERAMIC, SAID TRANSPORT FILM BEING BURNED AWAY DURING SAID FIRING TO LEAVE A CONTINUOUS PLANAR SURFACE SUITABLE FOR HERMETIC SEALING THERETO OF A FURTHER LAYER.

Claim 3

In the manufacture of compositE structures for use as multi-layered components of a hermetic package from dielectric ceramic such as those composed mainly of alumina mixed with plasticizers, binders and solvents for said plasticizers and from a paste of powdered metal selected from the group composed of tungsten, molybdenum, manganese or mixtures thereof, the method which comprises the steps of depositing said paste upon a transport film to form a thin predetermined metallic pattern thereon, drying said metallic pattern, applying a thick body of said ceramic over said metallic pattern and upon said transport film, drying said ceramic body to form a green composite structure, and firing said green composite structure at a temperature higher than approximately 1,600*C to vitrify said ceramic and bond said metal hermetically to said ceramic, said transport film being burned away during said firing to leave a continuous planar surface suitable for hermetic sealing thereto of a further layer.

Claim 4

In the manufacture of compositE structures for use as multi-layered components of a hermetic package from dielectric ceramic such as those composed mainly of alumina mixed with plasticizers, binders and solvents for said plasticizers and from a paste of powdered metal selected from the group composed of tungsten, molybdenum, manganese or mixtures thereof, the method which comprises the steps of depositing said paste upon a transport film to form a thin predetermined metallic pattern thereon, drying said metallic pattern, applying a thick body of said ceramic over said metallic pattern and upon said transport film, drying said ceramic body to form a green composite structure, and firing said green composite structure at a temperature higher than approximately 1,600*C to vitrify said ceramic and bond said metal hermetically to said ceramic, said transport film being burned away during said firing to leave a continuous planar surface suitable for hermetic sealing thereto of a further layer.

Claim 5

IN THE MANUFACTURE OF COMPOSITE STRUCTURES FOR USE AS MULTI-LAYERED COMPONENTS OF A HERMETIC PACKAGE FROM DIELECTRIC CERAMIC SUCH AS THOSE COMPOSED MAINLY OF ALUMINA MIXED WITH PLASTICIZERS, BINDERS AND SOLVENTS FOR SAID PLASTICIZERS AND FROM A PASTE OF POWDERED METAL SELECTED FROM THE GROUP COMPOSED OF TUNGSTEN, MOLYBDENUM, MANGANESE OR MIXTURES THEREOF, THE METHOD WHICH COMPRISES THE STEPS OF DEPOSITING SAID PASTE UPON A TRANSPORT FILM TO FORM A THIN PREDETERMINED METALLIC PATTERN THEREON, DRYING SAID METALLIC PATTERN, APPLYING A THICK BODY OF SAID CERAMIC OVER SAID METALLIC PATTERN AND UPON SAID TRANSPORT FILM DYRING SAID CERAMIC BODY TO FORM A GREEN COMPOSITE STRUCTURE, STRIPPING AWAY SAID TRANSPORT FILM, AND FIRING SAID GREEN COMPOSITE STRUCTURE AT A TEMPERATURE HIGHER THAN APPROXIMATELY 1,600*C TO VITRIFY SAID CERAMIC AND BOND SAID METAL HERMETRICALLY TO SAID CERAMIC, THE REMOVAL OF SAID TRANSPORT FIL LEAVING A CONTINUOUS PLANAR SURFACE SUITABLE FOR HERMETIC SEALING THERETO OF A FURTHER LAYER.

Claim 6

IN THE MANUFACTURE OF COMPOSITE STRUCTURES FOR USE AS MULTI-LAYERED COMPONENTS OF A HERMETIC PACKAGE FROM DIELECTRIC CERAMIC SUCH AS THOSE COMPOSED MAINLY OF ALUMINA MIXED WITH PLASTICIZERS, BINDERS AND SOLVENTS FOR SAID PLASTICIZERS AND FROM A PASTE OF POWDERED METAL SELECTED FROM THE GROUP COMPOSED OF TUNGSTEN, MOLYBDENUM, MANGANESE OR MIXTURES THEREOF, THE METHOD WHICH COMPRISES THE STEPS OF DEPOSITING SAID PASTE UPON A TRANSPORT FILM TO FORM A THIN PREDETERMINED METALLIC PATTERN THEREON, DRYING SAID METALLIC PATTERN, APPLYING A THICK BODY OF SAID CERAMIC OVER SAID METALLIC PATTERN AND UPON SAID TRANSPORT FILM DYRING SAID CERAMIC BODY TO FORM A GREEN COMPOSITE STRUCTURE, STRIPPING AWAY SAID TRANSPORT FILM, AND FIRING SAID GREEN COMPOSITE STRUCTURE AT A TEMPERATURE HIGHER THAN APPROXIMATELY 1,600*C TO VITRIFY SAID CERAMIC AND BOND SAID METAL HERMETRICALLY TO SAID CERAMIC, THE REMOVAL OF SAID TRANSPORT FIL LEAVING A CONTINUOUS PLANAR SURFACE SUITABLE FOR HERMETIC SEALING THERETO OF A FURTHER LAYER.

Claim 7

In the manufacture of composite structures for use as multi-layered components of a hermetic package from dielectric ceramic such as those composed mainly of alumina mixed with plasticizers, binders and solvents for said plasticizers and from a paste of powdered metal selected from the group composed of tungsten, molybdenum, manganese or mixtures thereof, the method which comprises the steps of depositing said paste upon a transport film to form a thin predetermined metallic pattern thereon, drying said metallic pattern, applying a thick body of said ceramic over said metallic pattern and upon said transport film, drying said ceramic body to form a green composite structure, stripping away said transport film, and firing said green composite structure at a temperature higher than approximately 1, 600*C to vitrify said ceramic and bond said metal hermetically to said ceramic, the removal of said transport film leaving a continuous planar surface suitable for hermetic sealing thereto of a further layer.

Claim 8

In the manufacture of composite structures for use as multi-layered components of a hermetic package from dielectric ceramic such as those composed mainly of alumina mixed with plasticizers, binders and solvents for said plasticizers and from a paste of powdered metal selected from the group composed of tungsten, molybdenum, manganese or mixtures thereof, the method which comprises the steps of depositing said paste upon a transport film to form a thin predetermined metallic pattern thereon, drying said metallic pattern, applying a thick body of said ceramic over said metallic pattern and upon said transport film, drying said ceramic body to form a green composite structure, stripping away said transport film, and firing said green composite structure at a temperature higher than approximately 1, 600*C to vitrify said ceramic and bond said metal hermetically to said ceramic, the removal of said transport film leaving a continuous planar surface suitable for hermetic sealing thereto of a further layer.

Claim 9

In the manufacture of composite structures for use as multi-layered components of a hermetic package from dielectric ceramic such as those composed mainly of alumina mixed with plasticizers, binders and solvents for said plasticizers and from a paste of powdered metal selected from the group composed of tungsten, molybdenum, manganese or mixtures thereof, the method which comprises the steps of depositing said paste upon a transport film to form a thin predetermined metallic pattern thereon, drying said metallic pattern applying a relatively thin layer of said ceramic upon said predetermined metallic pattern and upon said transport film in a predetermined ceramic pattern leaving portions of said predetermined metallic pattern exposed, drying said predetermined ceramic pattern, depositing a second quantity of said paste upon said predetermined ceramic pattern and upon said exposed portions of said predetermined metallic pattern to form metallic interconnections between said exposed portions, drying said metallic interconnections, applying a relatively thick ceramic body over said predetermined ceramic pattern and said interconnections, drying said ceramic body to form a green composite structure, firing said green composite structure at temperatures higher than approximately 1,600*C to vitrify said ceramic and bond said metal hermetically to said ceramic, said transport film being burned off during said firing to leave a continuous planar surface suitable for hermetic sealing thereto of a further layer.

Claim 10

In the manufacture of composite structures for use as multi-layered components of a hermetic package from dielectric ceramic such as those composed mainly of alumina mixed with plasticizers, binders and solvents for said plasticizers and from a paste of powdered metal selected from the group composed of tungsten, molybdenum, manganese or mixtures thereof, the method which comprises the steps of depositing said paste upon a transport film to form a thin predetermined metallic pattern thereon, drying said metallic pattern applying a relatively thin layer of said ceramic upon said predetermined metallic pattern and upon said transport film in a predetermined ceramic pattern leaving portions of said predetermined metallic pattern exposed, drying said predetermined ceramic pattern, depositing a second quantity of said paste upon said predetermined ceramic pattern and upon said exposed portions of said predetermined metallic pattern to form metallic interconnections between said exposed portions, drying said metallic interconnections, applying a relatively thick ceramic body over said predetermined ceramic pattern and said interconnections, drying said ceramic body to form a green composite structure, firing said green composite structure at temperatures higher than approximately 1,600*C to vitrify said ceramic and bond said metal hermetically to said ceramic, said transport film being burned off during said firing to leave a continuous planar surface suitable for hermetic sealing thereto of a further layer.