Laminated template for semiconductor device bonding

Claim 2

A self-aligning method of automatically transferring integrally leaded semiconductor device chips to conductive lead frame structures for bonding thereto, said method comprising: placing a semiconductor device chip having a face with a plurality of soft ferromagnetic integral leads thereon into a recess in one surface of a template so that said chip face is oriented upwardly, said template recess having a bottom portion which is substantially parallel to said one template surface, said template having an opening extending through the recess bottom portion to an opposite surface of the template; positioning a conductive lead frame having at least one set of soft ferromagnetic fingers corresponding to said integral chip leads on the one template surface so that said finger set is in accurately spaced general alignment with the chip in the template recess; applying a magnetic force to one end of a soft ferromagnetic probe so that magnetic lines of flux flow longitudinally therethrough; extending said probe through the template opening to engage the back side of the chip within the template recess and raise the chip closer to the overlying set of lead frame fingers until the magnetic force transmitted through the probe precisely aligns the integral chip leads with their corresponding fingers and concurrently magnetically raises the chip from the probe up to the fingers to produce engagement between all of the integral chip leads and their corresponding fingers; heating said integral chip leads and said fingers in engagement therewith to permanently bond said chip to said lead frame finger sets, and terminating application of said magnetic force.

Claim 3

Apparatus for magnetically transferring an integrally leaded semiconductor device chip to a conductive lead frame structure and for concurrently automatically orienting said chip during transfer so that the chip can be bonded to the lead frame with the integral chip leads in precise aligned engagement with corresponding lead frame fingers, said apparatus comprising: a laminated template serving as a temporary semiconductor chip carrier, said template having two major parallel surfaces, a plurality of recesses in one of said surfaces located in spaced rows and columns therein, said recess having a bottom portion sPaced from and parallel to said major surfaces, an opening in said recesses extending from said bottom portion to the opposite template surface; means for holding a lead frame structure in register against said one template surface so that sets of lead frame fingers overlie each template recess with all of the finger sets being spaced equivalently from the recess bottom portions; means for retaining said lead frame-template registration; an alignment probe of soft ferromagnetic material; means for positioning said template and lead frame so that said template recess openings are successively vertically aligned with said probe; means for applying a magnetic force to said probe and transmitting said force longitudinally through said probe, said magnetic force having a strength sufficient to raise a semiconductor chip with soft ferromagnetic integral leads thereon up from said probe into precisely alligned engagement with said lead frame fingers; means for vertically raising said probe to extend the probe through said recess opening so that it may engage the back side of an integrally leaded semiconductor chip in said recess and raise it to within close proximity of said overlying set of lead frame fingers, where said magnetic force can raise said chip up from said probe to said fingers, and while in transit thereto, automatically orient said chip so that the integral chip leads thereon are precisely aligned with their corresponding fingers upon engagement therewith; and means for permanently bonding said chip to said lead frame.

Claim 4

Apparatus for magnetically transferring an integrally leaded semiconductor device chip to a conductive lead frame structure and for concurrently automatically orienting said chip during transfer so that the chip can be bonded to the lead frame with the integral chip leads in precise aligned engagement with corresponding lead frame fingers, said apparatus comprising: a laminated template serving as a temporary semiconductor chip carrier, said template having two major parallel surfaces, a plurality of recesses in one of said surfaces located in spaced rows and columns therein, said recess having a bottom portion sPaced from and parallel to said major surfaces, an opening in said recesses extending from said bottom portion to the opposite template surface; means for holding a lead frame structure in register against said one template surface so that sets of lead frame fingers overlie each template recess with all of the finger sets being spaced equivalently from the recess bottom portions; means for retaining said lead frame-template registration; an alignment probe of soft ferromagnetic material; means for positioning said template and lead frame so that said template recess openings are successively vertically aligned with said probe; means for applying a magnetic force to said probe and transmitting said force longitudinally through said probe, said magnetic force having a strength sufficient to raise a semiconductor chip with soft ferromagnetic integral leads thereon up from said probe into precisely alligned engagement with said lead frame fingers; means for vertically raising said probe to extend the probe through said recess opening so that it may engage the back side of an integrally leaded semiconductor chip in said recess and raise it to within close proximity of said overlying set of lead frame fingers, where said magnetic force can raise said chip up from said probe to said fingers, and while in transit thereto, automatically orient said chip so that the integral chip leads thereon are precisely aligned with their corresponding fingers upon engagement therewith; and means for permanently bonding said chip to said lead frame.