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US3852104A Expired / Lapsed US ⏱️ 0.0 years remaining

Method of manufacturing a semiconductor device

Assignee: US Philips Corp
•
Filing: 1972-10-02
•
Granted: 1974-12-03
•
Expires: 1992-10-02
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Abstract

Abstract A method of making a semiconductor device employing local or selective oxidation of a semiconductor while non-oxidized areas are protected by an oxidizing mask, wherein cracking of the oxidation mask is reduced by removing the mask edges that overhand a recess etched onto the semiconductor before carrying out the selective oxidation step.

Inventors

  • 👤 E Kooi
  • 👤 Werdt R De
  • 👤 Paffen M Nijdam

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-28 20:00
CPC Classifications
H; H10; H10P; H10P95/00; H10D; H10D84/00; H10D84/01; H10D84/0123; H10D84/0126; H10D84/02; H10D84/03; H10D84/038; H10P50/00; H10P50/20; H10P50/28; H10P50/282; H10P50/283; H10P76/00; H10P76/40; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/012; H10W10/10; H10W10/13; H10W74/00; H10W74/40; H10W74/43; Y; Y10; Y10S; Y10S148/00; Y10S148/051; Y10S148/053; Y10S148/106; Y10S148/117

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 127 words
A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, COMPRISING PROVIDING ON ONE SIDE OF A SEMICONDUCTOR BODY A PATTERNED ETCHANT-RRESISTANT AND OXIDATION-RESISTANT MASKING LAYER, SUBJECTING THE SEMICONDUCTOR BODY TO AN ETCHING TREATMENT WITH AN ETCHANT WHICH DOES NOT SUBSTANTIALLY ATTACK THE MASKING LAYER TO FORM RECESXES IN THE SEMICONDUCTOR BODY AT THE UNMASKED AREAS, THE SEMICONDUCTOR UNDERETCHING AT THE MASKING LAYER EDGES WHEREBY THE LATTER PROJECT OVER THE RECESSES, THEREAFTER REMOVING THE MASKING LAYER EDGES WHICH PROJECT OVER THE RECESSES, AND THEREAFTER SUBJECTING THE MASKED BODY TO AN OXIDATION TREATMENT WITH THE MASKING LAYER IN PLACE TO FORM AN OXIDE INSET IN THE BODY AT THE RECESSES, SAID OXIDATION TREATMENT BEING CONTINUED UNTIL THE SURFACE OF THE GROWN OXIDE REACHES AT LEAST THE LEVEL OF THE MASKING LAYER.
Claim 2
Independent Claim 127 words
A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE, COMPRISING PROVIDING ON ONE SIDE OF A SEMICONDUCTOR BODY A PATTERNED ETCHANT-RRESISTANT AND OXIDATION-RESISTANT MASKING LAYER, SUBJECTING THE SEMICONDUCTOR BODY TO AN ETCHING TREATMENT WITH AN ETCHANT WHICH DOES NOT SUBSTANTIALLY ATTACK THE MASKING LAYER TO FORM RECESXES IN THE SEMICONDUCTOR BODY AT THE UNMASKED AREAS, THE SEMICONDUCTOR UNDERETCHING AT THE MASKING LAYER EDGES WHEREBY THE LATTER PROJECT OVER THE RECESSES, THEREAFTER REMOVING THE MASKING LAYER EDGES WHICH PROJECT OVER THE RECESSES, AND THEREAFTER SUBJECTING THE MASKED BODY TO AN OXIDATION TREATMENT WITH THE MASKING LAYER IN PLACE TO FORM AN OXIDE INSET IN THE BODY AT THE RECESSES, SAID OXIDATION TREATMENT BEING CONTINUED UNTIL THE SURFACE OF THE GROWN OXIDE REACHES AT LEAST THE LEVEL OF THE MASKING LAYER.
Claim 3
Dependent Claim 23 words
A method as claimed in claim 1 wherein the patterned masking layer has edges which form at least one angle larger than 180*.
Claim 4
Dependent Claim 13 words
A method as claimed in claim 2 wherein the angle is approximately 270*.
Claim 5
Dependent Claim 30 words
A method as claimed in claim 1 wherein the projecting edges of the masking layer are removed by means of an etching treatment employing etchants which selectively attack said layer.
Claim 6
Dependent Claim 14 words
A method as claimed in claim 4 wherein the masking layer comprises silicon nitride.

References Cited (Backward Citations)

US3425879A Cited
US3418227A Cited
US3578515A Cited
US3580735A Cited
US3755001A Cited
US3706129A Cited
US3796612A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-12-02 1978-06-03 1978-12-03 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-12-02 1982-06-03 1982-12-03 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-12-02 1986-06-03 1986-12-03 $7700.00 Window Closed / Lapsed

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