US3847700A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of forming a magnet pattern on magnetic memory circuit cards
Assignee: AT&T Inc
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Filing: 1972-11-17
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Granted: 1974-11-12
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Expires: 1992-11-17
Abstract
Abstract A thin sheet of magnetic material is placed across a malleable substrate and struck with a multiprojectioned punch. Each projection removes a wafer of the magnetic material from the sheet and embeds it into the substrate at a selected location. To ensure that the wafers remain on the substrate, a coating of adhesive may be applied to one side of the sheet of magnetic material and spaced between the material and the substrate during punching or, after punching, an adhesive may be applied across the wafer embedded surface of the substrate.
Inventors
- 👤 A Dalal
- 👤 P Elarde
- 👤 F Klasek
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 09:31
CPC Classifications
G; G11; G11B; G11B5/00; G11B5/62; G11C; G11C11/00; G11C11/02; G11C11/06; G11C11/06085; H; H01; H01F; H01F41/00; H01F41/14; Y; Y10; Y10S; Y10S428/00; Y10S428/90; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1056; Y10T156/1062; Y10T156/107; Y10T156/1089; Y10T156/109; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/4902; Y10T29/49069; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49826; Y10T29/49833
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
163 words
In a method of compressively securing a pattern of magnetic material wafers in a surface of a malleable substrate having a magnetic permeability which is insignificant with respect to the permeability of the wafers: overlying a sheet of magnetic material in direct contact with a first surface of the substrate; positioning the opposite surface of the substrate on a rigid die having a plurality of apertures formed therein in accordance with the wafer pattern, and striking at ambient temperature the sheet of magnetic material with a punch to remove a plurality of wafers of magnetic material from the sheet, to displace the material of the substrate and embed the wafers into the first surface of the substrate and to secure the wafers therein by deforming the substrate to compressively surround the edges of the wafers, the apertures in the die receiving extruded portions of the opposite surface of the substrate beneath the wafers as the wafers are embedded into the first surface thereof.
Claim 2
Dependent Claim
163 words
In a method of compressively securing a pattern of magnetic material wafers in a surface of a malleable substrate having a magnetic permeability which is insignificant with respect to the permeability of the wafers: overlying a sheet of magnetic material in direct contact with a first surface of the substrate; positioning the opposite surface of the substrate on a rigid die having a plurality of apertures formed therein in accordance with the wafer pattern, and striking at ambient temperature the sheet of magnetic material with a punch to remove a plurality of wafers of magnetic material from the sheet, to displace the material of the substrate and embed the wafers into the first surface of the substrate and to secure the wafers therein by deforming the substrate to compressively surround the edges of the wafers, the apertures in the die receiving extruded portions of the opposite surface of the substrate beneath the wafers as the wafers are embedded into the first surface thereof.
Claim 3
Dependent Claim
29 words
In a method as set forth in claim 1, further comprising: applying a sealer across the wafer embedded surface of the substrate to more firmly secure the wafers therein.
Claim 4
Dependent Claim
37 words
In a method as set forth in claim 1, wherein the malleable substrate is an epoxy glass substrate, fUrther comprising: pressing the wafer embedded substrate between a pair of flat, heated plates, to straighten any bowing thereof.
Claim 5
Dependent Claim
23 words
In a method as set forth in claim 2, further comprising: applying a polyester film over the wafer embedded surface of the substrate.
Claim 6
Dependent Claim
239 words
In a method of manufacturing a circuit card of the type wherein a circuit pattern of a metallic material is compressively secured in a surface of a deformable carrier material: placing the carrier material between an ambient temperature punch having a raised pattern in the form of the circuit pattern, and a rigid, ambient temperature, planar die having apertures formed therein in the form of the circuit pattern and in alignment with the corresponding raised pattern of the punch for cooperation therewith; positioning a sheet of the metallic material in direct contact with a first surface of the carrier material between the punch and the carrier material, and moving the punch and the die relative to and toward each other to apply the pattern of the punch against the sheet of metallic material to cut the circuit pattern therefrom as the sheet is pressed between the pattern of the punch and the carrier, to embed the circuit pattern of metallic material into and flush with the surface of the carrier and to secure the circuit pattern therein by deforming the carrier material to compressively surround the edges of the circuit pattern, and to extrude sufficient portions of the opposite surface of the carrier material, underlying the embedded circuit pattern of metallic material, into the apertures formed in the die, so that the carrier material surrounding the metallic pattern remains essentially flush with the upper surface of the circuit pattern.
Claim 7
Dependent Claim
239 words
In a method of manufacturing a circuit card of the type wherein a circuit pattern of a metallic material is compressively secured in a surface of a deformable carrier material: placing the carrier material between an ambient temperature punch having a raised pattern in the form of the circuit pattern, and a rigid, ambient temperature, planar die having apertures formed therein in the form of the circuit pattern and in alignment with the corresponding raised pattern of the punch for cooperation therewith; positioning a sheet of the metallic material in direct contact with a first surface of the carrier material between the punch and the carrier material, and moving the punch and the die relative to and toward each other to apply the pattern of the punch against the sheet of metallic material to cut the circuit pattern therefrom as the sheet is pressed between the pattern of the punch and the carrier, to embed the circuit pattern of metallic material into and flush with the surface of the carrier and to secure the circuit pattern therein by deforming the carrier material to compressively surround the edges of the circuit pattern, and to extrude sufficient portions of the opposite surface of the carrier material, underlying the embedded circuit pattern of metallic material, into the apertures formed in the die, so that the carrier material surrounding the metallic pattern remains essentially flush with the upper surface of the circuit pattern.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-11-11 | 1978-05-13 | 1978-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-11-11 | 1982-05-13 | 1982-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-11-11 | 1986-05-13 | 1986-11-12 | $7700.00 | Window Closed / Lapsed |