US3847284A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Magnetic tape die sorting system
Assignee: Teledyne Inc
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Filing: 1973-05-11
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Granted: 1974-11-12
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Expires: 1993-05-11
Abstract
Abstract An array of semiconductor devices in a monolithic wafer having a reference mark thereon is incrementally probed and tested for generating coded test data signals representing the characteristics of each device and coded position data signals defining the XY coordinates of the tested device with respect to the reference mark. The coded test data signals and the coded position data signals are recorded on a magnetic tape. Thereafter, the tested wafer is mounted on a pressure-sensitive adhesive web, scored and the individual devices are separated while maintaining their original orientation. The magnetic tape and wafer are then placed in a die transfer system and selected die types define by the test data and located by the position data are removed from the wafer by means of a cooperating and reciprocating vacuum collet and needle mechanism and are deposited at selected stations.
Inventors
- 👤 M Wiesler
- 👤 S Havdala
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 02:38
CPC Classifications
B; B07; B07C; B07C5/00; B07C5/34; B07C5/344
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
291 words
A method of sorting semiconductor devices from a wafer of said devices, said method comprising the steps of: a. marking said wafer with reference indicia describing a preselected arbitrary reference coordinate position; b. mounting said wafer on probe and test means having test probe means and means for recording coded signals on a recording stratum; c. registering said test probe means and said reference indicia; d. generating a coded signal defining said preselected reference coordinate position as an arbitrary reference coordinate position for said reference indicia; e. recording said arbitrary reference coordinate position coded signal on said recording stratum; f. probing and testing said wafer by registering said test probe means and selected ones of said devices; g. generating coded data signals defining the absolute coordinate position of said selected ones of said devices relative to said arbitrary reference coordinate position for said reference indicia and the characteristics of said devices at said absolute coordinate position; h. recording said coded data signals for said selected ones of said devices on said recording stratum; i. transferring said wafer and recording stratum to transfer means having device removing means and means for reading said recording stratum; j. registering said device removing means and said reference indicia; k. synchronizing the position of said device removing means and said reference indicia relative to the position of said test probe means and said reference indicia as defined by said arbitrary reference coordinate position; l. reading said recorded coded data signals and selectively registering said device removing means and selected ones of said devices having preselected characteristics at selected absolute coordinate positions as defined by said recorded data signals; and m. removing selected ones of said devices from said wafer according to said recorded coded data signals.
Claim 2
Independent Claim
291 words
A method of sorting semiconductor devices from a wafer of said devices, said method comprising the steps of: a. marking said wafer with reference indicia describing a preselected arbitrary reference coordinate position; b. mounting said wafer on probe and test means having test probe means and means for recording coded signals on a recording stratum; c. registering said test probe means and said reference indicia; d. generating a coded signal defining said preselected reference coordinate position as an arbitrary reference coordinate position for said reference indicia; e. recording said arbitrary reference coordinate position coded signal on said recording stratum; f. probing and testing said wafer by registering said test probe means and selected ones of said devices; g. generating coded data signals defining the absolute coordinate position of said selected ones of said devices relative to said arbitrary reference coordinate position for said reference indicia and the characteristics of said devices at said absolute coordinate position; h. recording said coded data signals for said selected ones of said devices on said recording stratum; i. transferring said wafer and recording stratum to transfer means having device removing means and means for reading said recording stratum; j. registering said device removing means and said reference indicia; k. synchronizing the position of said device removing means and said reference indicia relative to the position of said test probe means and said reference indicia as defined by said arbitrary reference coordinate position; l. reading said recorded coded data signals and selectively registering said device removing means and selected ones of said devices having preselected characteristics at selected absolute coordinate positions as defined by said recorded data signals; and m. removing selected ones of said devices from said wafer according to said recorded coded data signals.
Claim 3
Dependent Claim
40 words
The method of sorting semiconductor devices from a wafer of said devices as claimed in claim 1 including the steps of recording serial number coded signals on said magnetic recording stratum, said serial number coded signals uniquely identifying said wafer.
Claim 4
Dependent Claim
40 words
The method of sorting semiconductor devices from a wafer as claimed in claim 1 including the step of storing in an intermediate temporary storage said coded data signals representing the characteristics and coordinate position of the last good device probed.
Claim 5
Dependent Claim
59 words
The method of sorting semiconductor devices from a wafer of said devices as claimed in claim 1 including the steps of: a. mounting said wafer on an adhesive web after recording said coded data signals; and b. separating said devices on said web from one another while maintaining their original orientation prior to removing said devices from said wafer.
Claim 6
Dependent Claim
80 words
The method of sorting semiconductor devices from a monolithic wafer as claimed in claim 4 wherein said removing step includes the steps of: a. reciprocating needle means in position below said web and in registration with a selected device against said web and forcing said selected devices upwards; b. reciprocating a collet in position above said wafer and in registration with said selected deivce towards said selected device; and c. removing said selecteD device from said web by said collet.
Claim 7
Dependent Claim
38 words
The method of sorting semiconductor devices from a wafer as claimed in claim 5 including the steps of depositing said removed device at a station selected according to said coded data signals representing the characteristics of said device.
Claim 8
Independent Claim
167 words
A system for classifying semiconductor devices in a wafer of said devices, said system comprising: a. means for marking said wafer with reference indicia describing a preselected arbitrary reference coordinate position; b. prober means including indexing means on which said wafer is mounted, probe means for probing selected ones of said devices, and tester means for generating test data signals representing the characteristics of said semiconductor devices; c. reference means for generating reference data signals defining registration of said arbitrary reference coordinate position on said wafer and said probe means; d. processor means connected to said prober means and said reference means for generating coded coordinate data signals defining the absolute coordinate positions of said semiconductor devices with respect to said arbitrary reference coordinate position; and e. recorder means operatively connected to said processor means, said recorder means including a magnetic recording stratum, said recorder means recording on said magnetic recording stratum said test data signals and said absolute coordinate position data signals for said semiconductor devices.
Claim 9
Independent Claim
167 words
A system for classifying semiconductor devices in a wafer of said devices, said system comprising: a. means for marking said wafer with reference indicia describing a preselected arbitrary reference coordinate position; b. prober means including indexing means on which said wafer is mounted, probe means for probing selected ones of said devices, and tester means for generating test data signals representing the characteristics of said semiconductor devices; c. reference means for generating reference data signals defining registration of said arbitrary reference coordinate position on said wafer and said probe means; d. processor means connected to said prober means and said reference means for generating coded coordinate data signals defining the absolute coordinate positions of said semiconductor devices with respect to said arbitrary reference coordinate position; and e. recorder means operatively connected to said processor means, said recorder means including a magnetic recording stratum, said recorder means recording on said magnetic recording stratum said test data signals and said absolute coordinate position data signals for said semiconductor devices.
Claim 10
Dependent Claim
62 words
The system for classifying semiconductor devices as claimed in claim 7 wherein said processor means includes buffer means operatively connected to said prober means and recorder means, said buffer means storing test data signals representing the last semiconductor device tested having acceptable characteristics and said coordinate data signals defining the absolute coordinate position of said last tested semiconductor device having acceptable characteristics.
Claim 11
Dependent Claim
97 words
The system for classifying semiconductor devices as claimed in claim 7 wherein said processor means includes present coordinate counter means and comparator means, said present coordinate counter means operatively connected to said prober means, said comparator means operatively connected to said present coordinate counter means and said buffer means, said present coordinate counter means generating data signals defining the present coordinate position of said indexing means, said comparator means generating data signals defining the difference between the present coordinate position of said indexing means and the coordinate position of the last tested semiconductor device having acceptable characteristics.
Claim 12
Independent Claim
168 words
A system for removing semiconductor devices from a monolithic wafer of said devices according to coded instructions prerecorded on a magnetic recording stratum, said coded instructions defining the characteristics of selected ones of said semiconductor device and the absolute coordinate position of each said selected semiconductor device relative to a reference indicia at a preselected coordinate position on said wafer, said system comprising; a. reader means for generating coded data signals representing the coded instructions on said magnetic recording stratum, said coded data signals including classifying data signals defining the characteristics of said semiconductor devices and absolute coordinate position data signals defining the location of said semiconductor devices relative to the coordinate position of said reference indicia; b. sort means including indexer means on which said wafer is mounted and transfer means for removing selected semiconductor devices from said wafer; and c. processor means operatively connected to said reader means and sort means for generating command signals responsive to said coded data signals for controlling said sort means.
Claim 13
Independent Claim
168 words
A system for removing semiconductor devices from a monolithic wafer of said devices according to coded instructions prerecorded on a magnetic recording stratum, said coded instructions defining the characteristics of selected ones of said semiconductor device and the absolute coordinate position of each said selected semiconductor device relative to a reference indicia at a preselected coordinate position on said wafer, said system comprising; a. reader means for generating coded data signals representing the coded instructions on said magnetic recording stratum, said coded data signals including classifying data signals defining the characteristics of said semiconductor devices and absolute coordinate position data signals defining the location of said semiconductor devices relative to the coordinate position of said reference indicia; b. sort means including indexer means on which said wafer is mounted and transfer means for removing selected semiconductor devices from said wafer; and c. processor means operatively connected to said reader means and sort means for generating command signals responsive to said coded data signals for controlling said sort means.
Claim 14
Dependent Claim
53 words
The system for removing semiconductor devices from a wafer as claimed in claim 10 wherein said processor means includes programmable category means oPeratively connected to said reader means for generating category data signals representing selected device characteristics, said transfer means removing selected semiconductor devices having the characteristics defined by said category data signals.
Claim 15
Dependent Claim
119 words
The system for removing semiconductor devices from a wafer as claimed in claim 10 wherein said wafer is mounted on an adhesive web and wherein said transfer means includes: a. reciprocating needle means mounted in position below said web in registration with a selected device to be removed; b. reciprocating collet means mounted in position above said wafer in registration with said selected device; and c. drive means operatively connected to said needle means and said collet means, said drive means reciprocating said needle upwards into contact with said web for forcing a selected device upwards, said drive means reciprocating said collet downwards toward said selected device, said collet means operating to remove said selected device from said wafer.
Claim 16
Independent Claim
281 words
A system for sorting semiconductor devices in a wafer of said devices, said system comprising: a. means for marking said wafer with reference indicia describing a preselected arbitrary reference coordinate position; b. prober means including indexing means on which said wafer is mounted, probe means for probing selected ones of said devices, and tester means for generating test data signals representing the characteristics of said semiconductor devices; c. reference means for generating reference data signals defining registration of said arbitrary reference coordinate position on said wafer and said probe means; d. processor means connected to said prober means and said referenc means for generating coordinate data signals defining the absolute coordinate positions of said semiconductor devices with respect to said arbitrary reference coordinate position; and e. recorder means operatively connected to said processor means, said recorder means including a magnetic recording stratum, said recorder means recording on said magnetic recording stratum said test data signals and said absolute coordinate position data signals for said semiconductor devices; f. reader means for generating coded data signals representing said data signals recorded on said magnetic recording stratum; said coded data signals generated by said reader means including classifying data signals defining the characteristics of said semiconductor devices and absolute coordinate position signals defining the location of said semiconductor devices relative to the coordinate position of said reference indicia: g. sort means including position means on which said wafer is mounted and transfer means for removing selected semiconductor devices from said wafer; and h. category means operatively connected to said reader means and sort means for generating command signals responsive to said coded data signals generated by said reader means for controlling said sort means.
Claim 17
Independent Claim
281 words
A system for sorting semiconductor devices in a wafer of said devices, said system comprising: a. means for marking said wafer with reference indicia describing a preselected arbitrary reference coordinate position; b. prober means including indexing means on which said wafer is mounted, probe means for probing selected ones of said devices, and tester means for generating test data signals representing the characteristics of said semiconductor devices; c. reference means for generating reference data signals defining registration of said arbitrary reference coordinate position on said wafer and said probe means; d. processor means connected to said prober means and said referenc means for generating coordinate data signals defining the absolute coordinate positions of said semiconductor devices with respect to said arbitrary reference coordinate position; and e. recorder means operatively connected to said processor means, said recorder means including a magnetic recording stratum, said recorder means recording on said magnetic recording stratum said test data signals and said absolute coordinate position data signals for said semiconductor devices; f. reader means for generating coded data signals representing said data signals recorded on said magnetic recording stratum; said coded data signals generated by said reader means including classifying data signals defining the characteristics of said semiconductor devices and absolute coordinate position signals defining the location of said semiconductor devices relative to the coordinate position of said reference indicia: g. sort means including position means on which said wafer is mounted and transfer means for removing selected semiconductor devices from said wafer; and h. category means operatively connected to said reader means and sort means for generating command signals responsive to said coded data signals generated by said reader means for controlling said sort means.
Claim 18
Dependent Claim
62 words
The system for sorting semicoductor devices as claimed in claim 13 wherein said processor means includes memory means operatively connected to said prober means and recorder means, said memory means storing test data signals representing the last semiconductor device tested having acceptable characteristics and said coordinate data signals defining the absolute coordinate position of said last tested semiconductor device haveing acceptable characteristics.
Claim 19
Dependent Claim
97 words
The system for sorting semiconductor devices as claimed in claim 14 wherein said processor means includes present coordinate counter means and comparator means, said present coordinate counter means operatively connected to said prober means, said comparator means operatively connected to said present coordinate counter means and said memory means, said present coordinate counter means generating data signals defining the present coordinate position of said indexing means, said comparator means generating data sigals defining the Difference between the present coordinate position of said indexing means and the coordinate position of the last tested semiconductor device having acceptable characteristics.
Claim 20
Dependent Claim
51 words
The system for sorting semiconductor devices as claimed in claim 15 wherein said category means includes programmable pin board means operatively connected to said reader means for generating category data signals representing selected device characteristics, said transfer means removing selected semiconductor devices having the characteristics defined by said category data signals.
Claim 21
Independent Claim
280 words
A method of sorting semiconductor devices from a wafer of devices using a probing device and a die transfer device, the probing device including test probe means and the die transfer device including vacuum collet means, said method comprising the steps of: a. placing a recording stratum in the probing device; b. marking the wafer with reference indicia denoting a preselected reference coordinate position; c. mounting the wafer on the probing device; d. registering the test probe means and said reference indicia; e. generating a coded signal defining an arbitrary reference coordinate position for said reference indicia; f. recording said coded signal defining said arbitrary reference coordinate position on said recording stratum; g. selectively registering the test probe means and selected ones of the devices; h. generating coded data signals defining an absolute coordinate position on each one of the devices relative to said arbitrary reference coordinate position and a characteristic of each one of the devices at said absolute coordinate position; i. transferring the wafer and recording stratum from the probing device to the die transfer device; j. registering the vacuum collet means and said reference indicia; k. synchronizing the position of the collet means and said reference indicia relative to the position of the test probe means and said reference indicia as defined by said arbitrary reference coordinate position; l. reading said recorded coded data signals and selectively registering the vacuum collet means and selected ones of the devices having preselected characteristics at selected absolute coordinate positions as defined by said recorded coded data signals; and m. removing selected ones of the devices having preselected characteristics at selected absolute coordinate positions by means of the vacuum collet means.
Claim 22
Independent Claim
280 words
A method of sorting semiconductor devices from a wafer of devices using a probing device and a die transfer device, the probing device including test probe means and the die transfer device including vacuum collet means, said method comprising the steps of: a. placing a recording stratum in the probing device; b. marking the wafer with reference indicia denoting a preselected reference coordinate position; c. mounting the wafer on the probing device; d. registering the test probe means and said reference indicia; e. generating a coded signal defining an arbitrary reference coordinate position for said reference indicia; f. recording said coded signal defining said arbitrary reference coordinate position on said recording stratum; g. selectively registering the test probe means and selected ones of the devices; h. generating coded data signals defining an absolute coordinate position on each one of the devices relative to said arbitrary reference coordinate position and a characteristic of each one of the devices at said absolute coordinate position; i. transferring the wafer and recording stratum from the probing device to the die transfer device; j. registering the vacuum collet means and said reference indicia; k. synchronizing the position of the collet means and said reference indicia relative to the position of the test probe means and said reference indicia as defined by said arbitrary reference coordinate position; l. reading said recorded coded data signals and selectively registering the vacuum collet means and selected ones of the devices having preselected characteristics at selected absolute coordinate positions as defined by said recorded coded data signals; and m. removing selected ones of the devices having preselected characteristics at selected absolute coordinate positions by means of the vacuum collet means.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-11-11 | 1978-05-13 | 1978-11-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-11-11 | 1982-05-13 | 1982-11-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-11-11 | 1986-05-13 | 1986-11-12 | $7700.00 | Window Closed / Lapsed |