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US3841928A Expired / Lapsed US ⏱️ 0.0 years remaining

Production of semiconductor photoelectric conversion target

Assignee: Individual
•
Filing: 1972-11-13
•
Granted: 1974-10-15
•
Expires: 1992-11-13
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Abstract

Abstract In the process for making semiconductor photoelectric conversion targets used in a vidicon comprising an N-type semiconductor wafer having an array of P-type regions in a surface thereof, and an insulating layer provided to cover such surface portions of the wafer other than that of the P-type regions, an N-type impurity is diffused into the surface thereof so as to form a thin highly doped N-type layer in the surface portion of the wafer, either directly before forming the insulating layer or by using another insulating layer doped with an N-type impurity during the formation of the P-type regions.

Inventors

  • 👤 T Tokuyama
  • 👤 I Takemoto
  • 👤 I Miwa

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 03:11
CPC Classifications
H; H01; H01J; H01J29/00; H01J29/02; H01J29/10; H01J29/36; H01J29/39; H01J29/45; H01J29/451; H01J29/453; H01J9/00; H01J9/20; H01J9/233; H10; H10D; H10D99/00; Y; Y10; Y10S; Y10S148/00; Y10S148/033

Claims Analysis

Total Claims: 12
Claim 1
Independent Claim 196 words
A METHOD OF MAKING A SEMICONDUCTOR PHOTELECTRIC CONVERSION TARGET COMPRISING THE STEPS OF: A. PREPARING A SEMICONDUCTOR SUBSTRATE OF A FIRST CONDUCTIVITY TYPE, WHICH HAS ONE MAJOR SURFACE; B. FORMING A FIRST INSULATING LAYER INCLUDING A FIRST IMPURITY OF THE FIRST CONDUCTIVITY TYPE OF PREDETERMINED CONCENTRATION ON THE MAJOR SURFACE OF SAID SUBSTRATE; C. DEPOSITING A SECOND INSULATING LAYER OVER SAID FIRST INSULATING LAYER; D. MAKING APTERTURES IN ARRAY FASHION IN SAID TWO INSULATING LAYERS TO EXPOSE DESIRED SURFACE PORTIONS OF THE SEMICONDUCTOR SUBSTRATE THROUGH SAID APERTURES; E. DIFFUSING A SECOND IMPURITY OF A SECOND CONDUCTIVITY TYPE OPPOSITE TO SAID FIRST CONDUCTIVITY TYPE INTO THE SUBSTRATE FROM SAID EXPOSE SURFACE THEREOF THROUGH THE APERTURES, WHEREBY AN ARRAY OF SECOND CONDUCTIVITY REGIONS IS FORMED BY SAID DIFFUSION OF THE SECOND IMPURITY INTO SAID MAJOR SURFACE THEREOF AND A HIGH IMPURITY CONCENTRATION LAYER OF SAID FIRST CONDUCTIVITY TYPE IS SIMULTANEOSULY FORMED BY DIFFUSION OF SAID FIRST IMPURITY INCLUDED IN SAID INSULATING LAYER INTO THE SURFACE OF THE SUBSTRATE BENEATH SAID INSULATING LAYERS DURING THE DIFFUSION OF THE SECOND IMPURITY; AND F. PROVIDING A SIGNAL ELECTRODE TO SAID SUBSTRATE SO AS TO APPLY A DESIRED POTENTIAL TO SAID SUBSTRATE.
Claim 2
Independent Claim 196 words
A METHOD OF MAKING A SEMICONDUCTOR PHOTELECTRIC CONVERSION TARGET COMPRISING THE STEPS OF: A. PREPARING A SEMICONDUCTOR SUBSTRATE OF A FIRST CONDUCTIVITY TYPE, WHICH HAS ONE MAJOR SURFACE; B. FORMING A FIRST INSULATING LAYER INCLUDING A FIRST IMPURITY OF THE FIRST CONDUCTIVITY TYPE OF PREDETERMINED CONCENTRATION ON THE MAJOR SURFACE OF SAID SUBSTRATE; C. DEPOSITING A SECOND INSULATING LAYER OVER SAID FIRST INSULATING LAYER; D. MAKING APTERTURES IN ARRAY FASHION IN SAID TWO INSULATING LAYERS TO EXPOSE DESIRED SURFACE PORTIONS OF THE SEMICONDUCTOR SUBSTRATE THROUGH SAID APERTURES; E. DIFFUSING A SECOND IMPURITY OF A SECOND CONDUCTIVITY TYPE OPPOSITE TO SAID FIRST CONDUCTIVITY TYPE INTO THE SUBSTRATE FROM SAID EXPOSE SURFACE THEREOF THROUGH THE APERTURES, WHEREBY AN ARRAY OF SECOND CONDUCTIVITY REGIONS IS FORMED BY SAID DIFFUSION OF THE SECOND IMPURITY INTO SAID MAJOR SURFACE THEREOF AND A HIGH IMPURITY CONCENTRATION LAYER OF SAID FIRST CONDUCTIVITY TYPE IS SIMULTANEOSULY FORMED BY DIFFUSION OF SAID FIRST IMPURITY INCLUDED IN SAID INSULATING LAYER INTO THE SURFACE OF THE SUBSTRATE BENEATH SAID INSULATING LAYERS DURING THE DIFFUSION OF THE SECOND IMPURITY; AND F. PROVIDING A SIGNAL ELECTRODE TO SAID SUBSTRATE SO AS TO APPLY A DESIRED POTENTIAL TO SAID SUBSTRATE.
Claim 3
Dependent Claim 12 words
The method defined in claim 1, wherein said first impurity is phosphorus.
Claim 4
Dependent Claim 33 words
The method defined in claim 2, wherein said step of forming a first insulating layer comprises treating the substrate In an atmosphere of O2, PH3 and silane at about 400* to 500* C.
Claim 5
Dependent Claim 12 words
The method defined in claim 1, wherein said first impurity is antimony.
Claim 6
Dependent Claim 33 words
The method defined in claim 4, wherein said step of forming a first insulating layer comprises treating the substrate in an atmosphere of O2, SbH3 and silane at about 400* to 500* C.
Claim 7
Dependent Claim 12 words
The method defined in claim 1, wherein said semiconductor substrate is silicon.
Claim 8
Dependent Claim 22 words
The method defined in claim 1, wherein said semiconductor substrate has a volume resistivity of from about 5 to 15 Omega cm.
Claim 9
Independent Claim 147 words
A method of making a semiconductor photoelectric conversion target comprising the steps of: a. preparing a semiconductor substrate of a first conductivity type, which has a major surface; b. diffusing a first impurity of the first conductivty type into said substrate from said major surface thereof so as to form a high impurity concentration layer therein; c. forming an insulating layer over said major surface of the substrate; d. making an array of apertures in said insulating layer to expose desired surface portions of the substrate through said apertures; e. diffusing a second impurity of a second conductivity type opposite to said first conductivity type into said substrate at the surface portions thereof exposed through said apertures so as to form an array of semiconductor regions of the second conductivity type; and f. forming a signal electrode onto the substrate to apply desired potential to said substrate.
Claim 10
Independent Claim 147 words
A method of making a semiconductor photoelectric conversion target comprising the steps of: a. preparing a semiconductor substrate of a first conductivity type, which has a major surface; b. diffusing a first impurity of the first conductivty type into said substrate from said major surface thereof so as to form a high impurity concentration layer therein; c. forming an insulating layer over said major surface of the substrate; d. making an array of apertures in said insulating layer to expose desired surface portions of the substrate through said apertures; e. diffusing a second impurity of a second conductivity type opposite to said first conductivity type into said substrate at the surface portions thereof exposed through said apertures so as to form an array of semiconductor regions of the second conductivity type; and f. forming a signal electrode onto the substrate to apply desired potential to said substrate.
Claim 11
Dependent Claim 12 words
The method defined in claim 8, wherein said semiconductor substrate is silicon.
Claim 12
Dependent Claim 22 words
The method defined in claim 8, wherein said semiconductor substrate has a volume resistivity of from about 5 to 15 Omega cm.

References Cited (Backward Citations)

US3391035A Cited
US3378915A Cited
US3403284A Cited
US3481781A Cited
US3474285A Cited
US3664895A Cited
US3698078A Cited
US3676727A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-10-14 1978-04-15 1978-10-15 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-10-14 1982-04-15 1982-10-15 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-10-14 1986-04-15 1986-10-15 $7700.00 Window Closed / Lapsed

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