Patent US3836745A successfully refreshed from Google Patents.
US3836745A
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US
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Soldering method
Assignee: Argus International
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Filing: 1971-07-09
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Granted: 1974-09-17
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Expires: 1991-07-09
Abstract
Abstract A method for selectively heating predetermined portions of members through the use of a radiant energy absorbent material deposited upon the member which is heated by a source of radiation, preferably of the infra red type. The technique is also extremely advantageous for use in solder coating member and/or joining members through the use of a solder.
Inventors
- 👤 B Costello
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 11:32
CPC Classifications
B; B23; B23K; B23K1/00; B23K1/005; B23K1/0053; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3494; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0112; H05K3/341; H05K3/3421; H05K3/3465; H05K3/3485; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
148 words
A method for forming a multiplicity of soldering joints between a multiplicity of leads of a first device and associated terminals provided on a printed circuit board comprising the steps of: pulverizing an alloy solder material to form a finely divided powder and mixing the powder into a binder to form a solder paste in which the pulverized solder alloy serves as the vehicle for yielding a solder paste having a high coefficient of absorptivity; coating the terminals with said solder paste wherein said paste is maintained below its melting temperature during the coating operation; positioning said leads in surface contact with associated terminals on said board; exposing each of the solder joints to radiant energy focused upon said joints for a predetermined time period sufficient to form the solder joints and insufficient to char the printed circuit board due to the high absorptivity characteristic of the paste.
Claim 2
Independent Claim
148 words
A method for forming a multiplicity of soldering joints between a multiplicity of leads of a first device and associated terminals provided on a printed circuit board comprising the steps of: pulverizing an alloy solder material to form a finely divided powder and mixing the powder into a binder to form a solder paste in which the pulverized solder alloy serves as the vehicle for yielding a solder paste having a high coefficient of absorptivity; coating the terminals with said solder paste wherein said paste is maintained below its melting temperature during the coating operation; positioning said leads in surface contact with associated terminals on said board; exposing each of the solder joints to radiant energy focused upon said joints for a predetermined time period sufficient to form the solder joints and insufficient to char the printed circuit board due to the high absorptivity characteristic of the paste.
Claim 3
Dependent Claim
53 words
The method of claim 1, wherein the step of coating said terminals further comprises laying down a continuous stripe of solder paste across said terminals so as to span the region between the terminals; said radiant energy causing the paste in the region between terminals to wick into the solder joints being formed.
Claim 4
Dependent Claim
28 words
The method of claim 2, wherein the step of coating said leads further comprises dipping the lead to a predetermined depth into a vessel containing the solder paste.
Claim 5
Independent Claim
156 words
A method of forming a multiplicity of soldering joints between a multiplicity of leads of a first device and associated terminals provided on a printed circuit board comprising the steps of: pulverizing an alloy solder material to form a finely divided powder and mixing the powder into a binder to form a solder paste in which the pulverized solder alloy serves as the vehicle for yielding a solder paste having a high coefficient of absorptivity; coating either a multiplicity of terminals or the multiplicity of leads with said solder paste wherein said paste is maintained below its melting temperature during the coating operation; positioning said leads in surface contact with associated terminals on said board; exposing each of the solder joints to radiation focused upon said joints for a predetermined time period sufficient to form the solder joints and insufficient to char the printed circuit board whereby the solder joints so formed require no further processing.
Claim 6
Independent Claim
156 words
A method of forming a multiplicity of soldering joints between a multiplicity of leads of a first device and associated terminals provided on a printed circuit board comprising the steps of: pulverizing an alloy solder material to form a finely divided powder and mixing the powder into a binder to form a solder paste in which the pulverized solder alloy serves as the vehicle for yielding a solder paste having a high coefficient of absorptivity; coating either a multiplicity of terminals or the multiplicity of leads with said solder paste wherein said paste is maintained below its melting temperature during the coating operation; positioning said leads in surface contact with associated terminals on said board; exposing each of the solder joints to radiation focused upon said joints for a predetermined time period sufficient to form the solder joints and insufficient to char the printed circuit board whereby the solder joints so formed require no further processing.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-09-16 | 1978-03-18 | 1978-09-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-09-16 | 1982-03-18 | 1982-09-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-09-16 | 1986-03-18 | 1986-09-17 | $7700.00 | Window Closed / Lapsed |