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US3833410A
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High stability thin film alloy resistors
Assignee: Northrop Grumman Space and Mission Systems Corp
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Filing: 1971-12-30
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Granted: 1974-09-03
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Expires: 1991-12-30
Abstract
Abstract High stability thin film alloy resistors can be made from a constant conductivity alloy comprising a predominant amount of platinum, rhodium, iridium, palladium, gold, or silver and a minor amount of at least two metals selected from tungsten, rhenium, tantalum, molybdenum, hafnium, zirconium, or niobium. The constant conductivity alloy is deposited onto a nonconducting substrate to a thickness of between 10 and 5,000 angstroms.
Inventors
- 👤 C Ang
- 👤 R Bailey
- 👤 J Ogren
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-27 16:20
CPC Classifications
H; H01; H01C; H01C7/00; H01C7/006; C; C23; C23C; C23C14/00; C23C14/06; C23C14/14; C23C14/18; C23C14/185; H01B; H01B1/00; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49082; Y10T29/49099; Y10T428/00; Y10T428/26; Y10T428/261
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
66 words
A thin film resistor according to claim 1 wherein: the constant conductivity alloy consists essentially of (i) from 50% to 70% by weight of a metal selected from the group consisting of platinum, rhodium, iridium, palladium, gold, and silver and (ii) from 30% to 50% by weight of at least two metals selected from the group consisting of tungsten, rhenium, tantalum, molybdenum, hafnium, zirconium, and niobium.
Claim 2
Dependent Claim
20 words
A thin film resistor according to claim 1 wherein; the alloy film is between 10 and 5,000 Angstroms in thickness.
Claim 3
Independent Claim
96 words
A method for making a thin film resistor comprising: a. positioning a nonconducting substrate and a metal alloy source consisting essentially of from 50% to 90% by weight of a metal selected from the group consisting of platinum, rhodium, iridium, palladium, gold, and silver, and from 10% to 50% by weight of at least two metals selected from the group consisting of tungsten, rhenium, tantalum, molybdenum, hafnium, zirconium, and niobium, in an enclosed chamber, b. evacuating said chamber and back filling with argon, c. depositing said metal alloy to a depth of less than 5,000 Angstroms.
Claim 4
Dependent Claim
20 words
A method according to claim 4 wherein: said metal alloy is deposited to a depth of 10 to 5,000 angstrom.
Claim 5
Dependent Claim
18 words
A method according to claim 4 wherein; said alloy is sputter-cleaned prior to sputter depositing onto said substrate.
Claim 6
Dependent Claim
22 words
A method according to claim 4 including the further step of forming a resistor pattern of said metal alloy by back sputtering.
Claim 7
Dependent Claim
26 words
A method according to claim 4 including the further step of forming a resistor pattern of said metal alloy by chemical etching of a photolithographic pattern.
Claim 8
Dependent Claim
21 words
A method according to claim 4 wherein; said substrate is selected from the group consisting of silicon, ceramic, quartz, and glass.
Claim 9
Dependent Claim
62 words
A method according to claim 9 wherein: said metal alloy consists essentially of (i) 50% to 70% by weight of a metal selected from the group consisting of platinum, rhodium, iridium, palladium, gold, and silver and (ii) from 30% to 50% by weight of at least two metals selected from the group consisting of tungsten, rhenium, tantalum, molybdenum, hafnium, zirconium, and niobium.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-09-02 | 1978-03-04 | 1978-09-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-09-02 | 1982-03-04 | 1982-09-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-09-02 | 1986-03-04 | 1986-09-03 | $7700.00 | Window Closed / Lapsed |