Novel photoresist article and process for its use
Abstract
Abstract AN ARTICLE IS DISCLOSED HAVING AN INSULATIVE SUPPORT ON WHICH IS POSITIONED AN ETCHANT DESTRUCTIBLE PLATING LAYER HAVING A THICKNESS OF LESS THAN 10,000 ANGSTROMS AND, PERFERABLY, LESS THAN 5,00 ANGSTROMS. A PHOTORESIST LAYER OVERLIES THE PLATING LAYER. A PROTECTIVE LAYER CAN OVER LIE THE PHOTORESIST LAYER. UNEXPOSED AREAS OF THE PHOTORESIST LAYER ARE CAPABLE OF BEING REMOVED BY A NON-ETCHING SOLVENT TO LEAVE THE PLATING LAYER SUBSTANTIALLY MICRO-RESIDUE FREE. THIS PERMITS PLATING A METAL LAYER OVER THE UNCOVERED PORTIONS OF THE THIN PLATING LAYER WITHOUT EMPOLYING A CLEANING ETCHANT CAPABLE OF DESTROYING OR DAMAGING THE PLATING LAYER. THE PLATED METAL LAYER CAN BE ELECTROPLATED OR ELECTROLESSLY DEPOSITED ONTO THE PLATING LAYER TO FORM A TENACIOUSLY ADHERENT COATING.
Inventors
- 👤 R Neubert
- 👤 J Verstraete
- 👤 J Noonan
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1977-08-26 | 1978-02-25 | 1978-08-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-08-26 | 1982-02-25 | 1982-08-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-08-26 | 1986-02-25 | 1986-08-27 | $7700.00 | Window Closed / Lapsed |