Patent US3829604A successfully refreshed from Google Patents.
US3829604A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encased micro-circuit and the process for manufacturing the same
Assignee: NEC Corp
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Filing: 1973-04-10
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Granted: 1974-08-13
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Expires: 1993-04-10
Abstract
Abstract One or more leads are bonded to electrodes on a circuit board. Each lead has a first upstanding portion that extends away from a principal surface of the board and a second portion that extends parallel to that principal surface. The second portions are inserted through apertures in a block which is then inserted in an open ended case having a stair formed in its interior with the first portion of each lead clamped between the stair and a surface of the block.
Inventors
- 👤 K Tanaka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 22:25
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/0091; H05K5/0095; Y; Y10; Y10S; Y10S439/00; Y10S439/946
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
107 words
An encased micro-circuit comprising: a circuit board for mounting at least one electric element, said board having a plurality of electrodes thereon; a plurality of leads bonded to said electrodes, each lead having an upstanding first portion that extends away from a principal surface of said board and a second portion that extends parallel to said principal surface; a block defining apertures in which said leads are inserted; and a case in which said circuit board and said block are inserted, an inner wall of said case defining a stair, the first portions of each lead being held between said stair and the surface of said block.
Claim 2
Dependent Claim
107 words
An encased micro-circuit comprising: a circuit board for mounting at least one electric element, said board having a plurality of electrodes thereon; a plurality of leads bonded to said electrodes, each lead having an upstanding first portion that extends away from a principal surface of said board and a second portion that extends parallel to said principal surface; a block defining apertures in which said leads are inserted; and a case in which said circuit board and said block are inserted, an inner wall of said case defining a stair, the first portions of each lead being held between said stair and the surface of said block.
Claim 3
Dependent Claim
26 words
The micro-circuit of claim 1, wherein the second portion of each lead extends through a corresponding aperture in said block to the exterior of said case.
Claim 4
Independent Claim
124 words
A method for making an encased micro-circuit comprising the steps of: mounting at least one electric element on a circuit board having an electrode thereon; forming a lead having a first upstanding portion, a second portion extending at an angle to said first portion and a bonding portion; attaching said bonding portion to said electrode so that said first portion extends away from a principal surface of said circuit board and so that said second portion extends parallel to said principal surface; inserting said second portion through an aperture in a block; and inserting said block in a casing having a stair formed therein so that said upstanding first portion of said lead is held between said stair and a surface of said block.
Claim 5
Independent Claim
124 words
A method for making an encased micro-circuit comprising the steps of: mounting at least one electric element on a circuit board having an electrode thereon; forming a lead having a first upstanding portion, a second portion extending at an angle to said first portion and a bonding portion; attaching said bonding portion to said electrode so that said first portion extends away from a principal surface of said circuit board and so that said second portion extends parallel to said principal surface; inserting said second portion through an aperture in a block; and inserting said block in a casing having a stair formed therein so that said upstanding first portion of said lead is held between said stair and a surface of said block.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-08-12 | 1978-02-11 | 1978-08-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-08-12 | 1982-02-11 | 1982-08-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-08-12 | 1986-02-11 | 1986-08-13 | $7700.00 | Window Closed / Lapsed |