Abstract A copper backing is formed on a silver-cadmium oxide contact by first forming a bimetal strip having a thin layer of substantially pure silver and copper layer. The bimetal strip is secured at at least one end to a billet of the contact material, to retain them together during subsequent operations, with the silver surface of the bimetal strip against a surface of the billet of contact materials. The composite is then rolled to a substantial reduction of thickness, of the order of at least 50 percent, to bond the silver surface of the bimetal to the contact material. This produces a tri-layer contact with the layers fully integrated, consisting of the main contact material section, an intermediate silver layer and a copper backing layer.