US3813773A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure
Assignee: Bunker Ramo Corp
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Filing: 1972-09-05
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Granted: 1974-06-04
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Expires: 1992-09-05
Abstract
Abstract A low-cost method employing precision stamping for fabricating the wafers of a multiwafer electrical circuit structure comprised of a plurality of electrically conductive wafers stacked together under pressure. A stack is normally comprised of conductive wafers of different types including component wafers, interconnection wafers, and connector wafers which are fabricated to provide X, Y and Z-axis coaxial connections between components in the stack. In accordance with the present invention, these X, Y and Z coaxial connections are fabricated directly from the wafer material itself at relatively low cost as compared to known methods as a result of the employment of a novel combination of precision stamping, dielectric filling and sanding or etching steps.
Inventors
- 👤 H Parks
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:48
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/44; H05K3/445; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/09654; H05K2201/09745; H05K2201/09818; H05K2201/09881; H05K2203/00; H05K2203/03; H05K2203/0323; H05K2203/0369; H05K3/02; H05K3/04; H05K3/041; H05K3/06; H05K3/10; H05K3/107; H05K3/46; H05K3/4611; H05K3/4614; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/49155
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
103 words
A method of fabricating a plurality of spaced, electrically insulated through-connections in a predetermined pattern in a conductive sheet, said method comprising: precision stamping one surface of said conductive sheet so as to form a plurality of closed path recesses therein defining a plurality of through-connection segments corresponding to said predetermined pattern, affixing dielectric material in the stamped closed path recesses, and removing a layer from the opposite surface of said conductive sheet of thickness sufficient to electrically isolate said through-connection segments from said sheet, said dielectric material serving to support the thus formed isolated throughconnections in said sheet and electrically insulated therefrom.
Claim 2
Independent Claim
103 words
A method of fabricating a plurality of spaced, electrically insulated through-connections in a predetermined pattern in a conductive sheet, said method comprising: precision stamping one surface of said conductive sheet so as to form a plurality of closed path recesses therein defining a plurality of through-connection segments corresponding to said predetermined pattern, affixing dielectric material in the stamped closed path recesses, and removing a layer from the opposite surface of said conductive sheet of thickness sufficient to electrically isolate said through-connection segments from said sheet, said dielectric material serving to support the thus formed isolated throughconnections in said sheet and electrically insulated therefrom.
Claim 3
Dependent Claim
16 words
The invention in accordance with claim 1, wherein the step of removing is accomplished by sanding.
Claim 4
Dependent Claim
17 words
The invention in accordance with claim 1, wherein the step of removing is accomplished by chemical etching.
Claim 5
Dependent Claim
31 words
The invention in accordance with claim 1, wherein said method additionally includes forming at least one electrically insulated conductor in said conductive sheet extending parallel thereto and following a predetermined path.
Claim 6
Dependent Claim
99 words
The invention in accordance with claim 4, wherein said electrically insulated conductor extending parallel to said sheet is formed by precision stamping additional recesses in said one surface shaped so as to define a conductor segment following said predetermined path and into which additional recesses dielectric material is likewise affixed, said additional recesses having a depth so that said conductor segment is likewise electrically isolated from said conductive sheet as a result of the removing of said layer from the opposite surface of said sheet and being likewise supported in said sheet and insulated therefrom by said dielectric material.
Claim 7
Dependent Claim
49 words
The invention in accordance with claim 5, wherein the forming of said conductor extending parallel to said wafer includes precision stamping second additional recesses of lesser depth in said one surface at locations corresponding to said conductor segment so as to recess the conductor segment from said one surface.
Claim 8
Dependent Claim
53 words
The invention in accordance with claim 6, wherein the forming of said conductor extending parallel to said wafer also includes recessing the opposite surface of said conductor segment from the surface of said sheet formed after removal of said layer so that the resulting conductor is recessed from both surfaces of said sheet.
Claim 9
Dependent Claim
24 words
The invention in accordance with claim 7, wherein the recessing of the opposite surface of said conductor segment is accomplished by selective chemical etching.
Claim 10
Dependent Claim
27 words
The invention in accordance with claim 8, wherein said method also includes affixing dielectric material in the recesses formed in the opposite surface of said conductor segment.
Claim 11
Independent Claim
143 words
A method of fabricating a connector wafer for use in providing wafer-to-wafer electrical connections in a pressure-stacked multiwafer electrical structure, said method comprising: providing a conductive wafer, precision stamping one surface of said conductive wafer so as to form a plurality of spaced closed path recesses therein defining a plurality of through-connection segments in a desired predetermined pattern as required for wafer-to-wafer interconnections in said multiwafer electrical structure, affixing dielectric material in the stamped closed path recesses, removing a layer from the opposite surface of said sheet of thickness sufficient to electrically isolate said through-connection segments from said wafer, said dielectric material serving to support the thus formed isolated through-connections in said sheet and electrically insulated therefrom, and forming a pressure-deformable contact of conductive material more malleable than said conductive wafer on at least one end of each of the isolated through-connection segments.
Claim 12
Independent Claim
143 words
A method of fabricating a connector wafer for use in providing wafer-to-wafer electrical connections in a pressure-stacked multiwafer electrical structure, said method comprising: providing a conductive wafer, precision stamping one surface of said conductive wafer so as to form a plurality of spaced closed path recesses therein defining a plurality of through-connection segments in a desired predetermined pattern as required for wafer-to-wafer interconnections in said multiwafer electrical structure, affixing dielectric material in the stamped closed path recesses, removing a layer from the opposite surface of said sheet of thickness sufficient to electrically isolate said through-connection segments from said wafer, said dielectric material serving to support the thus formed isolated through-connections in said sheet and electrically insulated therefrom, and forming a pressure-deformable contact of conductive material more malleable than said conductive wafer on at least one end of each of the isolated through-connection segments.
Claim 13
Dependent Claim
28 words
The invention in accordance with claim 10, wherein said method includes forming additional pressure-deformable contacts on at least one surface of said wafer at locations between said through-connections.
Claim 14
Dependent Claim
21 words
The invention in accordance with claim 11, wherein said through-connections and said additional pressure-deformable contacts are provided in a uniform pattern.
Claim 15
Dependent Claim
32 words
The invention in accordance with claim 11, wherein said method includes forming said uniform pattern of pressure-deformable contacts on both ends of said through-connection segments and on both surfaces of said wafer.
Claim 16
Independent Claim
157 words
A method of fabricating a predetermined pattern of spaced, electrically insulated through-connections in a conductive sheet along with at least one insulated conductor wholly within the sheet extending parallel thereto and following a predetermined path, said method comprising: precision stamping one surface of said conductive sheet so as to form first and second pluralities of recesses therein, said first plurality of recesses being shaped so as to define a plurality of through-connection segments corresponding to said predetermined pattern and said second plurality of recesses being shaped so as to define a conductor segment following said predetermined path, affixing dielectric material in each of said first and second pluralities of recesses, and removing a layer from the opposite surface of said sheet of thickness sufficient to electrically isolate said through-connection segments and said conductor segment from said sheet, said dielectric material serving to support the thus formed isolated through-connections and conductor in said sheet and electrically insulated therefrom.
Claim 17
Independent Claim
157 words
A method of fabricating a predetermined pattern of spaced, electrically insulated through-connections in a conductive sheet along with at least one insulated conductor wholly within the sheet extending parallel thereto and following a predetermined path, said method comprising: precision stamping one surface of said conductive sheet so as to form first and second pluralities of recesses therein, said first plurality of recesses being shaped so as to define a plurality of through-connection segments corresponding to said predetermined pattern and said second plurality of recesses being shaped so as to define a conductor segment following said predetermined path, affixing dielectric material in each of said first and second pluralities of recesses, and removing a layer from the opposite surface of said sheet of thickness sufficient to electrically isolate said through-connection segments and said conductor segment from said sheet, said dielectric material serving to support the thus formed isolated through-connections and conductor in said sheet and electrically insulated therefrom.
Claim 18
Dependent Claim
30 words
The invention in accordance with claim 14, wherein said predetermined path of said conductor is chosen so that said conductor is electrically connected to at least one of said through-connections.
Claim 19
Dependent Claim
51 words
The invention in accordance with claim 14, wherein said method includes precision stamping additional recesses in said one surface of said wafer of lesser depth than said first and second pluralities of recesses at locations corresponding to said conductor segment so as to recess the conductor segment from said one surface.
Claim 20
Dependent Claim
44 words
The invention in accordance with claim 16, wherein said method includes recessing the opposite surface of said conductor segment from the surface of said sheet formed after removal of said layer so that the resulting conductor is recessed from both surfaces of said sheet.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-06-03 | 1977-12-03 | 1978-06-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-06-03 | 1981-12-03 | 1982-06-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-06-03 | 1985-12-03 | 1986-06-04 | $7700.00 | Window Closed / Lapsed |