Patent US3813023A successfully refreshed from Google Patents.
US3813023A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Desoldering device
Assignee: Individual
•
Filing: 1972-12-04
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Granted: 1974-05-28
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Expires: 1992-12-04
Abstract
Abstract A device for desoldering a plurality of soldered connections on a support member including a heat conductive member provided with a contact surface having one or more openings therein for receiving and simultaneously melting the soldered connections. The contact surface is plated with a material that is nonwettable by solder while the walls of the openings are of a material that is wettable by the solder.
Inventors
- 👤 R Downey
- 👤 R Macomber
- 👤 D Auray
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 13:49
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/02; B23K3/025; H; H05; H05K; H05K13/00; H05K13/04; H05K13/0486; H05K13/0491; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/3494; Y; Y10; Y10T; Y10T29/00; Y10T29/53; Y10T29/53274
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
145 words
A device for desoldering a plurality of soldered connections on a support member, said device comprising a heat conductive member defining at least one contact surface of a material that is non-wettable by solder, a plurality of spaced blind cavities formed in said contact surface and extending in a pattern corresponding to the pattern of said soldered connections for receiving said soldered connections, the bottom and the wall of each cavity being of a material that is wettable by the solder and the width and depth of each cavity being sized relative to its corresponding soldered connection so that the melted solder is retained in the cavity by capillary action and so that the melted solder acts as a heat conductive medium between said heat conductive member and unmelted solder, to melt the unmelted solder, and means for applying heat to said heat conductive member.
Claim 2
Independent Claim
145 words
A device for desoldering a plurality of soldered connections on a support member, said device comprising a heat conductive member defining at least one contact surface of a material that is non-wettable by solder, a plurality of spaced blind cavities formed in said contact surface and extending in a pattern corresponding to the pattern of said soldered connections for receiving said soldered connections, the bottom and the wall of each cavity being of a material that is wettable by the solder and the width and depth of each cavity being sized relative to its corresponding soldered connection so that the melted solder is retained in the cavity by capillary action and so that the melted solder acts as a heat conductive medium between said heat conductive member and unmelted solder, to melt the unmelted solder, and means for applying heat to said heat conductive member.
Claim 3
Dependent Claim
32 words
The device of claim 1 wherein a groove is formed in one face of said heat conductive member to define two spaced continuous contact surfaces to focus said heat along said surfaces.
Claim 4
Dependent Claim
17 words
The device of claim 2 wherein said contact surfaces extend for the entire length of said face.
Claim 5
Dependent Claim
27 words
The device of claim 1 wherein said contact surface is of a chrome material and the bottom and walls of each cavity are of a copper material.
Claim 6
Independent Claim
135 words
A device for desoldering a plurality of soldered connections on a support member, said device comprising a heat conductive member defining at least one contact surface of a material that is non-wettable by solder, a continuous groove extending for the entire length of said contact surface for receiving a row of soldered connections, the bottom and the walls of said groove being of a material that is wettable by the solder, the width and depth of each groove being sized relative to its corresponding soldered connection so that the melted solder is retained in the groove by capillary action and so that the melted solder acts as a heat transfer medium between said heat conductive member and the unmelted solder to melt the unmelted solder, and means for applying heat to said heat conductive member.
Claim 7
Independent Claim
135 words
A device for desoldering a plurality of soldered connections on a support member, said device comprising a heat conductive member defining at least one contact surface of a material that is non-wettable by solder, a continuous groove extending for the entire length of said contact surface for receiving a row of soldered connections, the bottom and the walls of said groove being of a material that is wettable by the solder, the width and depth of each groove being sized relative to its corresponding soldered connection so that the melted solder is retained in the groove by capillary action and so that the melted solder acts as a heat transfer medium between said heat conductive member and the unmelted solder to melt the unmelted solder, and means for applying heat to said heat conductive member.
Claim 8
Dependent Claim
32 words
The device of claim 5 wherein a groove is formed in one face of said heat conductive member to define two spaced continuous contact surfaces to focus said heat along said surfaces.
Claim 9
Dependent Claim
17 words
The device of claim 6 wherein said contact surfaces extend for the entire length of said face.
Claim 10
Dependent Claim
27 words
The device of claim 5 wherein said contact surface is of a chrome material and the bottom and walls of said groove are of a copper material.
Claim 11
Dependent Claim
15 words
The device of claim 5 wherein each of said grooves is closed at both ends.
Claim 12
Dependent Claim
22 words
The device of claim 5 wherein said contact surface is flat and has a portion extending to either side of said groove.
References Cited (Backward Citations)
US3084649A
Cited
US3130286A
Cited
US3315350A
Cited
US3580462A
Cited
US3529760A
Cited
US3632972A
Cited
US3746239A
Cited
US3649809A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-05-27 | 1977-11-26 | 1978-05-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-05-27 | 1981-11-26 | 1982-05-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-05-27 | 1985-11-26 | 1986-05-28 | $7700.00 | Window Closed / Lapsed |