US3797103A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Machine and process for semiconductor device assembly
Assignee: General Electric Co
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Filing: 1971-11-10
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Granted: 1974-03-19
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Expires: 1991-11-10
Abstract
Abstract A machine and process are disclosed for assembling a plurality of semiconductor devices having heat sinks initially united in a common strip. A track is provided for allowing a heat sink strip to be sequentially transported through a plurality of assembly stations. A magazine is provided for dispensing heat sink strips to the track. The strip is advanced by fingers engaging regularly recurring apertures in the strip. The heat sink strip is first burred and then a solder preform is stamped onto the strip at spaced intervals overlying the burrs. Lead carrying headers are fed into association with spaced foot portions of the strip. A dispenser feeds a solder ball to a window in each header. A forming and pick up mechanism positions sub-assemblies including semiconductive elements and internal connectors on the heat sink strip overlying the solder preforms.
Inventors
- 👤 R Desmond
- 👤 E Fronczek
- 👤 Carthy J Mc
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:36
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0478; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49169; Y10T29/49171; Y10T29/49172
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
146 words
A process for the assembly of a plurality of semiconductor devices having heat sinks initially united in a common strip comprising advancing a heat sink strip along a track, burring the heat sink strip, associating bonding preforms having oxidized surfaces with the burred portions of the heat sink strip at spaced intervals so that the oxidized surfaces are penetrated by the burrs and the solder preforms are fastened to the strip, insulatively positioning leads at spaced intervals along the heat sink strip, superimposing a sub-assembly comprised of a semi-conductor body and an internal connector over each bonding preform and simultaneously positioning each internal connector to contact a lead with a bonding material interposed therebetween, simultaneously bonding the internal connectors to the leads and the semiconductor bodies to the heat sink strip, protectively encapsulating the semiconductor bodies, and sub-dividing the strip to form plural discrete semiconductor devices.
Claim 2
Dependent Claim
146 words
A process for the assembly of a plurality of semiconductor devices having heat sinks initially united in a common strip comprising advancing a heat sink strip along a track, burring the heat sink strip, associating bonding preforms having oxidized surfaces with the burred portions of the heat sink strip at spaced intervals so that the oxidized surfaces are penetrated by the burrs and the solder preforms are fastened to the strip, insulatively positioning leads at spaced intervals along the heat sink strip, superimposing a sub-assembly comprised of a semi-conductor body and an internal connector over each bonding preform and simultaneously positioning each internal connector to contact a lead with a bonding material interposed therebetween, simultaneously bonding the internal connectors to the leads and the semiconductor bodies to the heat sink strip, protectively encapsulating the semiconductor bodies, and sub-dividing the strip to form plural discrete semiconductor devices.
Claim 3
Dependent Claim
32 words
A process according to claim 1 additionally including the step of transporting the sub-assemblies from a magazine to the heat sink strip and bending the internal connectors at an intermediate transport station.
Claim 4
Dependent Claim
200 words
A process for the assembly of a plurality of semi-conductor devices having heat sinks initially united in a common strip comprising advancing a heat sink strip along a track in stepped increments, burring the heat sink strip, sequentially urging first solder preforms having oxidized surfaces into association with burrs on the heat sink strip at spaced intervals so that the oxidized surfaces are penetrated by the burrs and the solder preforms are fastened to the strip, sequentially associating leaded headers with the heat sink strip at spaced intervals, sequentially associating relatively oxide free center portions of second solder preforms with the heat sink strip and a first lead carried by each header, sequentially superimposing a sub-assembly comprised of a semiconductor body and a solder clad internal connector over each first solder preform with the solder clad internal connectors each being associated with a remaining lead of each header, heating the heat sink strip simultaneously to solder the semiconductor bodies to the heat sink strip, the first lead of each header to the heat sink strip, and a remaining lead of each header to the internal connector, protectively encapsulating the semiconductor bodies, and sub-dividing the strip to form discrete semiconductor devices.
Claim 5
Dependent Claim
200 words
A process for the assembly of a plurality of semi-conductor devices having heat sinks initially united in a common strip comprising advancing a heat sink strip along a track in stepped increments, burring the heat sink strip, sequentially urging first solder preforms having oxidized surfaces into association with burrs on the heat sink strip at spaced intervals so that the oxidized surfaces are penetrated by the burrs and the solder preforms are fastened to the strip, sequentially associating leaded headers with the heat sink strip at spaced intervals, sequentially associating relatively oxide free center portions of second solder preforms with the heat sink strip and a first lead carried by each header, sequentially superimposing a sub-assembly comprised of a semiconductor body and a solder clad internal connector over each first solder preform with the solder clad internal connectors each being associated with a remaining lead of each header, heating the heat sink strip simultaneously to solder the semiconductor bodies to the heat sink strip, the first lead of each header to the heat sink strip, and a remaining lead of each header to the internal connector, protectively encapsulating the semiconductor bodies, and sub-dividing the strip to form discrete semiconductor devices.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-03-18 | 1977-09-17 | 1978-03-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-03-18 | 1981-09-17 | 1982-03-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-03-18 | 1985-09-17 | 1986-03-19 | $7700.00 | Window Closed / Lapsed |