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US3795358A Expired / Lapsed US ⏱️ 0.0 years remaining

Immersion solder leveling apparatus using ultrasonic cavitation

Assignee: International Business Machines Corp
•
Filing: 1972-12-11
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Granted: 1974-03-05
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Expires: 1992-12-11
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Abstract

Abstract A method and apparatus utilizing ultrasonic cavitation to level molten solder on wetted surfaces to a controlled and a predetermined thickness. By immersing a surface soldered substrate, printed circuit card, printed circuit board or the like into a heated tank containing a liquid glycerol at approximately 10* C. to 40* C. above the melting point of the solder, it is possible to selectively and ultrasonically cavitate solder from the soldered surfaces to achieve uniform solder thickness.

Inventors

  • 👤 F Sarnacki
  • 👤 R Steenstrup

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-26 23:24
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0646; B23K3/0661; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3468; H05K2203/00; H05K2203/02; H05K2203/0285; H05K2203/04; H05K2203/044; H05K2203/07; H05K2203/0756; H05K2203/0776; H05K2203/15; H05K2203/1518; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49995

Claims Analysis

Total Claims: 6
Claim 1
Independent Claim 121 words
Apparatus for solder leveling printed circuit cards comprising, in combination: a. a tank, b. a liquid glycerol solution disposed within the tank, c. heating means disposed about the walls of said tank and operative for maintaining the temperature of said glycerol solution at predetermined temperatures, d. a system of cavitating apparatus including a plurality of horns disposed within said liquid glycerol solution, e. a carrier fixture adapted to supporting a printed circuit card, f. means for moving said carrier fixture into and out of the liquid glycerol solution at a predetermined rate, and g. means for ultrasonically energizing said cavitating apparatus to remove excess solder from a soldered surface of the printed circuit card to obtain a predetermined solder coat thickness.
Claim 2
Dependent Claim 121 words
Apparatus for solder leveling printed circuit cards comprising, in combination: a. a tank, b. a liquid glycerol solution disposed within the tank, c. heating means disposed about the walls of said tank and operative for maintaining the temperature of said glycerol solution at predetermined temperatures, d. a system of cavitating apparatus including a plurality of horns disposed within said liquid glycerol solution, e. a carrier fixture adapted to supporting a printed circuit card, f. means for moving said carrier fixture into and out of the liquid glycerol solution at a predetermined rate, and g. means for ultrasonically energizing said cavitating apparatus to remove excess solder from a soldered surface of the printed circuit card to obtain a predetermined solder coat thickness.
Claim 3
Dependent Claim 29 words
Apparatus for solder leveling printed circuit cards as defined in claim 1 wherein the horns of said cavitating apparatus are disposed immediately beneath the surface of said glycerol solution.
Claim 4
Dependent Claim 32 words
Apparatus for solder leveling printed circuit cards as defined in claim 2 wherein the moving means for said carrier fixture moves the printed circuit card transversely in the vicinity of said horns.
Claim 5
Dependent Claim 144 words
Apparatus for solder leveling a printed circuit card substrate comprising: a. a container, b. a liquid glycerol solution disposed within the container, c. heating means disposed about the periphery of said container, d. control means operative for maintaining the temperature of said glycerol solution at a predetermined temperature, e. cavitating apparatus including at least one horn disposed immediately beneath the surface of said liquid glycerol solution, f. a carrier fixture for supporting a printed circuit card substrate, g. means for moving said carrier fixture into and through the glycerol solution and in the vicinity of the horn at a predetermined rate, and h. means for ultrasonically energizing said cavitating apparatus in order to remove excess solder from the soldered surface of the printed circuit substrate to effect the stripping of excess solder and achieve a predetermined solder coat thickness on said printed circuit substrate.
Claim 6
Dependent Claim 144 words
Apparatus for solder leveling a printed circuit card substrate comprising: a. a container, b. a liquid glycerol solution disposed within the container, c. heating means disposed about the periphery of said container, d. control means operative for maintaining the temperature of said glycerol solution at a predetermined temperature, e. cavitating apparatus including at least one horn disposed immediately beneath the surface of said liquid glycerol solution, f. a carrier fixture for supporting a printed circuit card substrate, g. means for moving said carrier fixture into and through the glycerol solution and in the vicinity of the horn at a predetermined rate, and h. means for ultrasonically energizing said cavitating apparatus in order to remove excess solder from the soldered surface of the printed circuit substrate to effect the stripping of excess solder and achieve a predetermined solder coat thickness on said printed circuit substrate.

References Cited (Backward Citations)

US3210182A Cited
US3249281A Cited
US3498303A Cited
US3491779A Cited
US3603329A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1977-03-04 1977-09-03 1978-03-05 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1981-03-04 1981-09-03 1982-03-05 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1985-03-04 1985-09-03 1986-03-05 $7700.00 Window Closed / Lapsed

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