US3793710A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods of bonding a beam-lead device to a substrate
Assignee: AT&T Inc
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Filing: 1971-10-12
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Granted: 1974-02-26
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Expires: 1991-10-12
Abstract
Abstract A beam-lead bonder incorporates an automatically indexable feeder slide for feeding a selected integrated circuit device to a bonding station, and a shuttle table for positioning a particular bond site on a substrate in alignment with the selected device. The alignment can be checked by optical instrumentation and refined by a micromanipulator. Before bonding, the device is transferred to the bonding tip of the bonder, and the substrate is transferred to a bonding support. The feeder slide and the shuttle table retract, permitting the table to be loaded with a substrate for a subsequent bonding operation while bonding of the previously aligned device and substrate is taking place. The bonded substrate disengages from the bonding support after bonding and slides into a receiving tray.
Inventors
- 👤 J Monahan
- 👤 F Schneider
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 09:35
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0446; H10W; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
117 words
A method of bonding a semiconductor device selected from a supply array to a bond site on a selected substrate, comprising: feeding the selected device toward a bonding axis of a bonding station; feeding the bond site of the selected substrate toward the bonding axis; aligning the selected device with the bond site of the selected substrate at the bonding axis; bonding the device to the bond site of the selected substrate; and loading a further substrate while the step of bonding is taking place in preparation of feeding such further loaded substrate toward the bonding axis prior to aligning the further loaded substrate with another selected device at the bonding axis in a subsequent bonding cycle.
Claim 2
Independent Claim
117 words
A method of bonding a semiconductor device selected from a supply array to a bond site on a selected substrate, comprising: feeding the selected device toward a bonding axis of a bonding station; feeding the bond site of the selected substrate toward the bonding axis; aligning the selected device with the bond site of the selected substrate at the bonding axis; bonding the device to the bond site of the selected substrate; and loading a further substrate while the step of bonding is taking place in preparation of feeding such further loaded substrate toward the bonding axis prior to aligning the further loaded substrate with another selected device at the bonding axis in a subsequent bonding cycle.
Claim 3
Independent Claim
212 words
A method of bonding sequentially selected semiconductor devices to predetermined areas on substrates successively positioned at a bonding station located on the axial extension of an axially movable bonding tip and between the bonding tip and a bonding support, comprising: supporting an array of semiconductor devices on a feeder slide; loading a substrate on a shuttle table in a preloading position; moving the feeder slide toward the bonding station to position a selected device of the array in axial alignment with and adjacent to the bonding tip; moving the shuttle table toward the bonding station to locate a predetermined area of the loaded substrate between the selected device and the bonding support; engaging the bonding tip with the selected device to remove the device from the array; retracting the feeder slide from the bonding station; elevating the bonding support toward the substrate to remove the substrate from the shuttle table; retracting the shuttle table to the preload position; lowering the bonding tip toward the bonding support to contact the predetermined area of the substrate with the engaged device to bond the device to the substrate; and positioning a substrate for a subsequent bonding operation on the shuttle table while the device is being bonded to the substrate located at the bonding station.
Claim 4
Independent Claim
212 words
A method of bonding sequentially selected semiconductor devices to predetermined areas on substrates successively positioned at a bonding station located on the axial extension of an axially movable bonding tip and between the bonding tip and a bonding support, comprising: supporting an array of semiconductor devices on a feeder slide; loading a substrate on a shuttle table in a preloading position; moving the feeder slide toward the bonding station to position a selected device of the array in axial alignment with and adjacent to the bonding tip; moving the shuttle table toward the bonding station to locate a predetermined area of the loaded substrate between the selected device and the bonding support; engaging the bonding tip with the selected device to remove the device from the array; retracting the feeder slide from the bonding station; elevating the bonding support toward the substrate to remove the substrate from the shuttle table; retracting the shuttle table to the preload position; lowering the bonding tip toward the bonding support to contact the predetermined area of the substrate with the engaged device to bond the device to the substrate; and positioning a substrate for a subsequent bonding operation on the shuttle table while the device is being bonded to the substrate located at the bonding station.
Claim 5
Dependent Claim
51 words
A method of bonding according to claim 2 comprising the additional steps of: raising the bonding tip after the bonding of the device to the substrate to disengage the tip from the device; and disengaging the substrate from the bonding support to prepare the bonding support for a subsequent bonding operation.
Claim 6
Dependent Claim
46 words
A method of bonding according to claim 3 wherein the step of disengaging includes lowering the substrate against a fixed stop, the fixed stop acting to dislodge the substrate from the bonding support, and further comprising the step of receiving the dislodged substrate in a tray.
Claim 7
Independent Claim
118 words
A method of bonding a beam-lead device selected from a supply array to a bond site on a selected substrate, comprising: feeding the device and a predetermined bond site on the substrate into alignment with each other at a bonding station; bonding the aligned device to the bond site; selecting another device from the array, to be fed to the bonding station in a subsequent operation; positioning another substrate on a shuttle table while the step of bonding is taking place in preparation of feeding the other selected device into alignment with a bond site on the positioned substrate in a subsequent operation; and releasing the bonded device and substrate into a tray before starting such subsequent operation.
Claim 8
Independent Claim
118 words
A method of bonding a beam-lead device selected from a supply array to a bond site on a selected substrate, comprising: feeding the device and a predetermined bond site on the substrate into alignment with each other at a bonding station; bonding the aligned device to the bond site; selecting another device from the array, to be fed to the bonding station in a subsequent operation; positioning another substrate on a shuttle table while the step of bonding is taking place in preparation of feeding the other selected device into alignment with a bond site on the positioned substrate in a subsequent operation; and releasing the bonded device and substrate into a tray before starting such subsequent operation.
Claim 9
Dependent Claim
134 words
A method of bonding according to claim 5, wherein the step of positioning a substrate comprises locating the substrate against a pair of mutually perpendicular locator edges of a support plate of the shuttle table to place a selected bond site of the substrate in a predetermined position with respect to the bonding station, and wherein the step of feeding comprises (a) moving the shuttle table a precise and predetermined distance toward the bonding station to align the selected bond site of the substrate located on the support plate of the shuttle table with the bonding station; (b) transferring the substrate from the support plate to the bonding station; and (c) retracting the shuttle table the predetermined distance to its earlier position to provide access to the shuttle table for the step of positioning.
Claim 10
Dependent Claim
79 words
A method of bonding according to claim 5, wherein a substrate locating support plate is mounted to the shuttle table prior to the step of feeding the device and the predetermined bond site on the substrate into alignment with each other at a bonding station, the method including the additional steps of: removing the support plate from the shuttle table; and replacing the removed support plate by a second support plate before positioning the substrate on the shuttle table.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1977-02-25 | 1977-08-27 | 1978-02-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1981-02-25 | 1981-08-27 | 1982-02-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1985-02-25 | 1985-08-27 | 1986-02-26 | $7700.00 | Window Closed / Lapsed |