Method for bonding the flip-chip to a carrier substrate
Abstract
Abstract A METHOD FOR FACE DOWN BONDING A FLIP-CHIP TO A CARRIER SUBSTRATE INCLUDING THE STEPS OF ORIENTING THE CHIP BY DIRECT REFERENCE TO ITS ELECTRICAL TERMINALS AT AS GIVEN POSITION APART FROM THE SUBSTRATE, ORIENTING THE SUBSTRATE WITH REFERENCE TO THE CHIP AT A PRESCRIBED POSITION SEPARATE FROM THE CHIP POSITION, TRANSFERRING THE CHIP FROM THE GIVEN POSITION TO THE SUBSTRATE POSITION, THE TRANSFER BEING AC- COMPLISHED IN A MANNER TO RETAIN THE RELATIVE ORIENTATION OF THE CHIP AND SUBSTRATE SO THAT THE CORRESPONDING ELECTRICAL TERMINALS THEREOF ARE PLACED IN CONTACTING RELATIONSHIP, AND APPLYING HOT GAS SOLDER TO THE REGION BETWEEN THE CHIP AND SUBSTRATE TO BOND THE CONTACTING TERMINALS.
Inventors
- 👤 Edwin P Miklaszewski
Bibliographic Details
Claims Analysis
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| 3.5 Years (Year 4) | 1974-02-01 | 1974-08-03 | 1975-02-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1978-02-01 | 1978-08-03 | 1979-02-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1982-02-01 | 1982-08-03 | 1983-02-02 | $7700.00 | Window Closed / Lapsed |